GB8701759D0 - Processing of semi-conductor materials - Google Patents

Processing of semi-conductor materials

Info

Publication number
GB8701759D0
GB8701759D0 GB878701759A GB8701759A GB8701759D0 GB 8701759 D0 GB8701759 D0 GB 8701759D0 GB 878701759 A GB878701759 A GB 878701759A GB 8701759 A GB8701759 A GB 8701759A GB 8701759 D0 GB8701759 D0 GB 8701759D0
Authority
GB
United Kingdom
Prior art keywords
semi
processing
conductor materials
conductor
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB878701759A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik LIL Ltd
Original Assignee
Laporte Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laporte Industries Ltd filed Critical Laporte Industries Ltd
Priority to GB878701759A priority Critical patent/GB8701759D0/en
Publication of GB8701759D0 publication Critical patent/GB8701759D0/en
Priority to EP88100902A priority patent/EP0276774A3/en
Priority to US07/147,782 priority patent/US4885106A/en
Priority to KR1019880000606A priority patent/KR880009420A/ko
Priority to JP63014803A priority patent/JPS63211724A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/906—Cleaning of wafer as interim step

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
GB878701759A 1987-01-27 1987-01-27 Processing of semi-conductor materials Pending GB8701759D0 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB878701759A GB8701759D0 (en) 1987-01-27 1987-01-27 Processing of semi-conductor materials
EP88100902A EP0276774A3 (en) 1987-01-27 1988-01-22 Composition for use in the processing of semiconductor materials and method for its preparation and use
US07/147,782 US4885106A (en) 1987-01-27 1988-01-25 Storable semiconductor cleaning solution containing permonosulphuric acid
KR1019880000606A KR880009420A (ko) 1987-01-27 1988-01-26 반도체 재료 제조용 조성물과 이의 제조방법 및 사용방법
JP63014803A JPS63211724A (ja) 1987-01-27 1988-01-27 貯蔵可能な半導体洗浄液、その製造方法及びその使用方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB878701759A GB8701759D0 (en) 1987-01-27 1987-01-27 Processing of semi-conductor materials

Publications (1)

Publication Number Publication Date
GB8701759D0 true GB8701759D0 (en) 1987-03-04

Family

ID=10611280

Family Applications (1)

Application Number Title Priority Date Filing Date
GB878701759A Pending GB8701759D0 (en) 1987-01-27 1987-01-27 Processing of semi-conductor materials

Country Status (5)

Country Link
US (1) US4885106A (ja)
EP (1) EP0276774A3 (ja)
JP (1) JPS63211724A (ja)
KR (1) KR880009420A (ja)
GB (1) GB8701759D0 (ja)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8813889D0 (en) * 1988-06-11 1988-07-13 Micro Image Technology Ltd Solutions of permonosulphuric acid
JP2894717B2 (ja) * 1989-03-15 1999-05-24 日産化学工業株式会社 低表面張力硫酸組成物
US5238463A (en) * 1990-08-27 1993-08-24 Diversey Corporation Method of treating denim fabric
CA2059841A1 (en) * 1991-01-24 1992-07-25 Ichiro Hayashida Surface treating solutions and cleaning method
JP3075290B2 (ja) * 1991-02-28 2000-08-14 三菱瓦斯化学株式会社 半導体基板の洗浄液
DE4139205A1 (de) * 1991-11-28 1993-06-03 Wacker Chemitronic Verfahren zur herstellung lagerstabiler oberflaechen von siliciumscheiben mit vorteilhaften oxidationseigenschaften
TW263531B (ja) * 1992-03-11 1995-11-21 Mitsubishi Gas Chemical Co
US5637151A (en) * 1994-06-27 1997-06-10 Siemens Components, Inc. Method for reducing metal contamination of silicon wafers during semiconductor manufacturing
US5853491A (en) * 1994-06-27 1998-12-29 Siemens Aktiengesellschaft Method for reducing metal contamination of silicon wafers during semiconductor manufacturing
GB2297976A (en) * 1995-02-01 1996-08-21 Reckitt & Colmann Prod Ltd Improvements in or relating to a bleaching process
EP0742279A1 (en) * 1995-05-10 1996-11-13 The Procter & Gamble Company Acidic aqueous liquid compositions
DE19631363C1 (de) * 1996-08-02 1998-02-12 Siemens Ag Wässrige Reinigungslösung für ein Halbleitersubstrat
US6068787A (en) * 1996-11-26 2000-05-30 Cabot Corporation Composition and slurry useful for metal CMP
US5958288A (en) * 1996-11-26 1999-09-28 Cabot Corporation Composition and slurry useful for metal CMP
US6066609A (en) * 1997-07-31 2000-05-23 Siemens Aktiengesellschaft Aqueous solution for cleaning a semiconductor substrate
US6025273A (en) * 1998-04-06 2000-02-15 Taiwan Semiconductor Manufacturing Company, Ltd. Method for etching reliable small contact holes with improved profiles for semiconductor integrated circuits using a carbon doped hard mask
US6417098B1 (en) * 1999-12-09 2002-07-09 Intel Corporation Enhanced surface modification of low K carbon-doped oxide
US6383065B1 (en) 2001-01-22 2002-05-07 Cabot Microelectronics Corporation Catalytic reactive pad for metal CMP
TW591089B (en) * 2001-08-09 2004-06-11 Cheil Ind Inc Slurry composition for use in chemical mechanical polishing of metal wiring
US6953389B2 (en) * 2001-08-09 2005-10-11 Cheil Industries, Inc. Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching
KR100734669B1 (ko) * 2003-08-08 2007-07-02 동부일렉트로닉스 주식회사 반도체 소자의 제조 방법 및 그 장치
JP2007049022A (ja) * 2005-08-11 2007-02-22 Dainippon Screen Mfg Co Ltd 基板処理方法及びその装置
US20070068901A1 (en) * 2005-09-29 2007-03-29 Wang Yuchun Composition and method for enhancing pot life of hydrogen peroxide-containing CMP slurries
US20070227556A1 (en) * 2006-04-04 2007-10-04 Bergman Eric J Methods for removing photoresist
WO2008024480A2 (en) * 2006-08-23 2008-02-28 The Regents Of The University Of California Method for cleaning diffraction gratings
JP4863897B2 (ja) * 2007-01-31 2012-01-25 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び基板洗浄プログラム
US20090001339A1 (en) * 2007-06-29 2009-01-01 Tae Young Lee Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same
KR20090002506A (ko) * 2007-06-29 2009-01-09 제일모직주식회사 상변화 메모리 소자 연마용 ｃｍｐ 슬러리 조성물 및 이를이용한 연마 방법
JP5076164B2 (ja) * 2007-09-20 2012-11-21 富士通セミコンダクター株式会社 半導体製造装置の洗浄方法
WO2013173738A1 (en) * 2012-05-18 2013-11-21 Advanced Technology Materials, Inc. Composition and process for stripping photoresist from a surface including titanium nitride

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1958204A (en) * 1931-11-02 1934-05-08 Du Pont Stabilization of peroxide solutions
US2658818A (en) * 1945-10-05 1953-11-10 Buffalo Electro Chem Co Stabilized hydrogen peroxide and method of making same
US2872293A (en) * 1953-03-18 1959-02-03 Fmc Corp Stabilizing hydrogen peroxide
US3383174A (en) * 1965-04-07 1968-05-14 Fmc Corp Stabilization of hydrogen peroxide
US3387939A (en) * 1966-07-06 1968-06-11 Du Pont Stannate stabilizer compositions containing an alkylidene diphosphonic acid, their preparation and hydrogen peroxide solutions stabilized therewith
US3681022A (en) * 1970-05-01 1972-08-01 Fmc Corp Manufacture of stable hydrogen peroxide solutions
US3864271A (en) * 1972-12-04 1975-02-04 Du Pont Stabilized acidic hydrogen peroxide solutions
BE818616A (fr) * 1973-08-30 1975-02-10 Solutions aqueuses stabilisees de peroxyde d'hydrogene
US4320102A (en) * 1980-10-10 1982-03-16 Air Products And Chemicals, Inc. Method of stabilizing hydrogen peroxide solutions
US4378270A (en) * 1981-10-29 1983-03-29 Learonal, Inc. Method of etching circuit boards and recovering copper from the spent etch solutions
US4442134A (en) * 1983-03-18 1984-04-10 Rca Corporation Chemical deposition termination
GB8522046D0 (en) * 1985-09-05 1985-10-09 Interox Chemicals Ltd Stabilisation

Also Published As

Publication number Publication date
EP0276774A3 (en) 1988-09-21
EP0276774A2 (en) 1988-08-03
US4885106A (en) 1989-12-05
KR880009420A (ko) 1988-09-15
JPS63211724A (ja) 1988-09-02

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