GB869558A - Improvements in or relating to methods for the production of semi-conductor arrangements - Google Patents
Improvements in or relating to methods for the production of semi-conductor arrangementsInfo
- Publication number
- GB869558A GB869558A GB1897/59A GB189759A GB869558A GB 869558 A GB869558 A GB 869558A GB 1897/59 A GB1897/59 A GB 1897/59A GB 189759 A GB189759 A GB 189759A GB 869558 A GB869558 A GB 869558A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semi
- relating
- production
- methods
- conductor arrangements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Alloys used in soldering and doping a semi-conductor (see Group XXXVI) consist of (1) 99.5% indium, 0.5% gallium, (2) approximately 70% lead, 30% tin, 1% arsenic and (3) 99% lead, 1% arsenic.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0056611 | 1958-01-17 | ||
| DES0056878 | 1958-02-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB869558A true GB869558A (en) | 1961-05-31 |
Family
ID=25995473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1897/59A Expired GB869558A (en) | 1958-01-17 | 1959-01-19 | Improvements in or relating to methods for the production of semi-conductor arrangements |
Country Status (5)
| Country | Link |
|---|---|
| CH (1) | CH373107A (en) |
| DE (2) | DE1067935B (en) |
| FR (1) | FR1224868A (en) |
| GB (1) | GB869558A (en) |
| NL (1) | NL235207A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1292257B (en) * | 1960-08-30 | 1969-04-10 | Siemens Ag | Method for alloying an electrode with the formation of a pn junction in a semiconducting germanium crystal for a semiconductor component |
| DE1248166B (en) * | 1964-07-17 | 1967-08-24 | Philips Nv | Multiple alloy mold for the production of semiconductor components with one or more alloyed contacts |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2791524A (en) * | 1953-04-03 | 1957-05-07 | Gen Electric | Fabrication method for p-n junctions |
| US2765245A (en) * | 1952-08-22 | 1956-10-02 | Gen Electric | Method of making p-n junction semiconductor units |
| AT186670B (en) * | 1953-12-23 | 1956-09-10 | Philips Nv | Electrode system with a semiconducting body |
| AT187598B (en) * | 1954-04-07 | 1956-11-10 | Int Standard Electric Corp | Crystal rectifier or crystal amplifier |
| BE539366A (en) * | 1954-06-29 |
-
0
- DE DENDAT1072751D patent/DE1072751B/en active Pending
- NL NL235207D patent/NL235207A/xx unknown
- DE DENDAT1067935D patent/DE1067935B/de active Pending
-
1959
- 1959-01-13 CH CH6825859A patent/CH373107A/en unknown
- 1959-01-17 FR FR784436A patent/FR1224868A/en not_active Expired
- 1959-01-19 GB GB1897/59A patent/GB869558A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE1072751B (en) | 1960-01-07 |
| DE1067935B (en) | 1959-10-29 |
| FR1224868A (en) | 1960-06-28 |
| NL235207A (en) | 1900-01-01 |
| CH373107A (en) | 1963-11-15 |
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