CH373107A - Process for the production of semiconductor arrangements in which foreign substances with doping properties are alloyed into a semiconductor body - Google Patents

Process for the production of semiconductor arrangements in which foreign substances with doping properties are alloyed into a semiconductor body

Info

Publication number
CH373107A
CH373107A CH6825859A CH6825859A CH373107A CH 373107 A CH373107 A CH 373107A CH 6825859 A CH6825859 A CH 6825859A CH 6825859 A CH6825859 A CH 6825859A CH 373107 A CH373107 A CH 373107A
Authority
CH
Switzerland
Prior art keywords
semiconductor
alloyed
production
foreign substances
arrangements
Prior art date
Application number
CH6825859A
Other languages
German (de)
Inventor
Enderlein Dieter
Heinz Dr Henker
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH373107A publication Critical patent/CH373107A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1203Rectifying Diode
    • H01L2924/12033Gunn diode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CH6825859A 1958-01-17 1959-01-13 Process for the production of semiconductor arrangements in which foreign substances with doping properties are alloyed into a semiconductor body CH373107A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES0056611 1958-01-17
DES0056878 1958-02-07

Publications (1)

Publication Number Publication Date
CH373107A true CH373107A (en) 1963-11-15

Family

ID=25995473

Family Applications (1)

Application Number Title Priority Date Filing Date
CH6825859A CH373107A (en) 1958-01-17 1959-01-13 Process for the production of semiconductor arrangements in which foreign substances with doping properties are alloyed into a semiconductor body

Country Status (5)

Country Link
CH (1) CH373107A (en)
DE (2) DE1072751B (en)
FR (1) FR1224868A (en)
GB (1) GB869558A (en)
NL (1) NL235207A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1292257B (en) * 1960-08-30 1969-04-10 Siemens Ag Method for alloying an electrode with the formation of a pn junction in a semiconducting germanium crystal for a semiconductor component
DE1248166B (en) * 1964-07-17 1967-08-24 Philips Nv Multiple alloy mold for the production of semiconductor components with one or more alloyed contacts

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2791524A (en) * 1953-04-03 1957-05-07 Gen Electric Fabrication method for p-n junctions
US2765245A (en) * 1952-08-22 1956-10-02 Gen Electric Method of making p-n junction semiconductor units
AT186670B (en) * 1953-12-23 1956-09-10 Philips Nv Electrode system with a semiconducting body
AT187598B (en) * 1954-04-07 1956-11-10 Int Standard Electric Corp Crystal rectifier or crystal amplifier
BE539366A (en) * 1954-06-29

Also Published As

Publication number Publication date
NL235207A (en) 1900-01-01
GB869558A (en) 1961-05-31
DE1067935B (en) 1959-10-29
DE1072751B (en) 1960-01-07
FR1224868A (en) 1960-06-28

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