GB8518468D0 - Lead frame taping method - Google Patents

Lead frame taping method

Info

Publication number
GB8518468D0
GB8518468D0 GB858518468A GB8518468A GB8518468D0 GB 8518468 D0 GB8518468 D0 GB 8518468D0 GB 858518468 A GB858518468 A GB 858518468A GB 8518468 A GB8518468 A GB 8518468A GB 8518468 D0 GB8518468 D0 GB 8518468D0
Authority
GB
United Kingdom
Prior art keywords
lead frame
taping method
frame taping
lead
taping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB858518468A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Corp
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of GB8518468D0 publication Critical patent/GB8518468D0/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB858518468A 1984-07-23 1985-07-22 Lead frame taping method Pending GB8518468D0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US63334484A 1984-07-23 1984-07-23

Publications (1)

Publication Number Publication Date
GB8518468D0 true GB8518468D0 (en) 1985-08-29

Family

ID=24539266

Family Applications (1)

Application Number Title Priority Date Filing Date
GB858518468A Pending GB8518468D0 (en) 1984-07-23 1985-07-22 Lead frame taping method

Country Status (5)

Country Link
JP (1) JPS6136960A (en)
FR (1) FR2568059A1 (en)
GB (1) GB8518468D0 (en)
IL (1) IL75877A0 (en)
IT (1) IT1185286B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61296749A (en) * 1985-06-25 1986-12-27 Toray Silicone Co Ltd Lead frame for semiconductor device
EP0213014B1 (en) * 1985-07-23 1990-09-19 Fairchild Semiconductor Corporation Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate
US4796080A (en) * 1987-07-23 1989-01-03 Fairchild Camera And Instrument Corporation Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate
JPH0226479Y2 (en) * 1987-08-28 1990-07-18
JPH0341679Y2 (en) * 1988-12-01 1991-09-02
JPH02170457A (en) * 1988-12-22 1990-07-02 Hitachi Cable Ltd Lead frame for semiconductor device and pressure tape used for it
US5098863A (en) * 1990-11-29 1992-03-24 Intel Corporation Method of stabilizing lead dimensions on high pin count surface mount I.C. packages

Also Published As

Publication number Publication date
IT8521638A0 (en) 1985-07-19
IL75877A0 (en) 1985-11-29
IT1185286B (en) 1987-11-04
JPS6136960A (en) 1986-02-21
FR2568059A1 (en) 1986-01-24

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