GB8511711D0 - Laser material processing - Google Patents

Laser material processing

Info

Publication number
GB8511711D0
GB8511711D0 GB858511711A GB8511711A GB8511711D0 GB 8511711 D0 GB8511711 D0 GB 8511711D0 GB 858511711 A GB858511711 A GB 858511711A GB 8511711 A GB8511711 A GB 8511711A GB 8511711 D0 GB8511711 D0 GB 8511711D0
Authority
GB
United Kingdom
Prior art keywords
material processing
laser material
laser
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB858511711A
Other versions
GB2175737A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CONTROL LASER Ltd
Original Assignee
CONTROL LASER Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CONTROL LASER Ltd filed Critical CONTROL LASER Ltd
Priority to GB08511711A priority Critical patent/GB2175737A/en
Publication of GB8511711D0 publication Critical patent/GB8511711D0/en
Publication of GB2175737A publication Critical patent/GB2175737A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H01S3/2383—Parallel arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
GB08511711A 1985-05-09 1985-05-09 Laser material processing Withdrawn GB2175737A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08511711A GB2175737A (en) 1985-05-09 1985-05-09 Laser material processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08511711A GB2175737A (en) 1985-05-09 1985-05-09 Laser material processing

Publications (2)

Publication Number Publication Date
GB8511711D0 true GB8511711D0 (en) 1985-06-19
GB2175737A GB2175737A (en) 1986-12-03

Family

ID=10578854

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08511711A Withdrawn GB2175737A (en) 1985-05-09 1985-05-09 Laser material processing

Country Status (1)

Country Link
GB (1) GB2175737A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109909601A (en) * 2017-12-13 2019-06-21 京东方科技集团股份有限公司 A kind of laser-processing system and method

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4839497A (en) * 1987-09-03 1989-06-13 Digital Equipment Corporation Drilling apparatus and method
CA1332445C (en) * 1988-02-15 1994-10-11 Kurt E. Schirmer Microsurgery using alternating laser beams of different wave lengths
DE4007947A1 (en) * 1990-03-13 1991-09-19 Fraunhofer Ges Forschung Laser-beam working - using additional energy source to maintain plasma energy coupling capability during time in cycle when main laser beam is switched off
DE4033166A1 (en) * 1990-10-19 1992-04-23 Bergmann Hans Wilhelm METHOD FOR COUPLING CW-CO (DOWN ARROW) 2 (DOWN ARROW) LASER BEAMS
DE19635843C2 (en) * 1996-09-04 1999-11-11 Oppermann Willi Friedrich Pipe welding system for the production of a welded round tube from a flat strip of material
WO1999006173A1 (en) * 1997-08-01 1999-02-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and device for laser beam welding
DE19742739B4 (en) * 1997-09-27 2007-06-14 Audi Ag Method and device for processing the cylinder surfaces of reciprocating internal combustion engines
JP3456424B2 (en) * 1998-09-30 2003-10-14 スズキ株式会社 Laser welding method and laser welding apparatus
JP2003517931A (en) * 1999-11-29 2003-06-03 シーメンス アクチエンゲゼルシヤフト Apparatus for processing a substrate and method for processing a substrate using the apparatus
TW516981B (en) * 2000-12-22 2003-01-11 Koninkl Philips Electronics Nv Method of laser welding
EP1223423A3 (en) * 2001-01-16 2004-01-28 National Research Council of Canada Method and apparatus for enhanced laser-induced plasma spectroscopy using mixed-wavelength laser pulses
DE10210040C1 (en) 2002-03-07 2003-10-30 Siemens Ag Operating procedures and trolleys for a laser processing system
DE102004059260A1 (en) * 2004-12-09 2006-03-09 Daimlerchrysler Ag Metallic component surface area processing method, involves irradiating area of surface of metallic component with one laser radiation before processing of area of metallic component surface with another radiation
US7279721B2 (en) 2005-04-13 2007-10-09 Applied Materials, Inc. Dual wavelength thermal flux laser anneal
US8053705B2 (en) * 2005-09-07 2011-11-08 Purdue Research Foundation Laser assisted machining process with distributed lasers
JP5384354B2 (en) * 2006-10-30 2014-01-08 オルセン，フレミング・オベ・エルホルム Laser processing method and system
EP1918062A1 (en) * 2006-10-30 2008-05-07 Danmarks Tekniske Universitet Method and system for laser processing
DE102010032781B4 (en) * 2010-04-01 2015-03-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for separating workpieces with laser beams
JP5642493B2 (en) * 2010-10-15 2014-12-17 三菱重工業株式会社 Laser cutting apparatus and laser cutting method
DE102011016579A1 (en) 2011-04-07 2011-11-17 Daimler Ag Laser beam welding of metallic work pieces by two laser beams that are moved from each other over a weld area along a predetermined path curve and predetermined distance, where laser beams are provided from a common laser beam source
DE102012212672B4 (en) 2012-07-19 2020-07-02 Trumpf Laser Gmbh Laser oscillator and method for the simultaneous generation of two laser beams of different wavelengths
CN110293326B (en) * 2019-07-30 2021-04-13 长沙理工大学 Method for cutting thick plate by double-beam laser
DE102020200909B4 (en) 2020-01-27 2024-05-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Method for machining a metallic workpiece
CN111843210B (en) * 2020-08-14 2021-06-04 福建祥鑫股份有限公司 Laser welding method for 7-series aluminum alloy plate with thickness larger than 40mm

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1565007A1 (en) * 1965-05-25 1970-05-21 Philips Patentverwaltung Process and device for thermal material processing by means of laser beams
IL48554A (en) * 1975-11-27 1978-07-31 Laser Ind Ltd Laser beam aligning apparatus
US4396285A (en) * 1980-08-25 1983-08-02 Coherent, Inc. Laser system and its method of use
JPS5985657A (en) * 1982-11-06 1984-05-17 日本赤外線工業株式会社 Laser radiation apparatus
GB2144561B (en) * 1983-04-21 1987-09-23 Cilco Inc Laser system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109909601A (en) * 2017-12-13 2019-06-21 京东方科技集团股份有限公司 A kind of laser-processing system and method

Also Published As

Publication number Publication date
GB2175737A (en) 1986-12-03

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)