GB8320548D0 - Forming electrical circuit - Google Patents
Forming electrical circuitInfo
- Publication number
- GB8320548D0 GB8320548D0 GB8320548A GB8320548A GB8320548D0 GB 8320548 D0 GB8320548 D0 GB 8320548D0 GB 8320548 A GB8320548 A GB 8320548A GB 8320548 A GB8320548 A GB 8320548A GB 8320548 D0 GB8320548 D0 GB 8320548D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrical circuit
- forming electrical
- forming
- circuit
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US40345282A | 1982-07-30 | 1982-07-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
GB8320548D0 true GB8320548D0 (en) | 1983-09-01 |
GB2124830A GB2124830A (en) | 1984-02-22 |
Family
ID=23595826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8320548A Withdrawn GB2124830A (en) | 1982-07-30 | 1983-07-29 | Electrical circuit assembly |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS5933895A (en) |
FR (1) | FR2531302A1 (en) |
GB (1) | GB2124830A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5650667A (en) * | 1995-10-30 | 1997-07-22 | National Semiconductor Corporation | Process of forming conductive bumps on the electrodes of semiconductor chips using lapping and the bumps thereby created |
DE10023539B4 (en) * | 2000-05-13 | 2009-04-09 | Micronas Gmbh | Method for producing a component |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB845453A (en) * | 1957-05-30 | 1960-08-24 | Nat Res Dev | Improvements in or relating to electrical circuit elements |
GB1175832A (en) * | 1965-10-12 | 1969-12-23 | Emi Ltd | Improvements relating to the production of an Electrical Conductor Adhering to an Insulating Support |
FR1569479A (en) * | 1967-07-13 | 1969-05-30 | ||
US3516156A (en) * | 1967-12-11 | 1970-06-23 | Ibm | Circuit package assembly process |
DE1910021B1 (en) * | 1969-02-27 | 1970-10-01 | Siemens Ag | Process for the production of electrical circuit boards |
CA942433A (en) * | 1969-06-10 | 1974-02-19 | Minnesota Mining And Manufacturing Company | Alumina palladium composite |
FR2404990A1 (en) * | 1977-10-03 | 1979-04-27 | Cii Honeywell Bull | SUBSTRATE FOR THE INTERCONNECTION OF ELECTRONIC COMPONENTS WITH INTEGRATED CIRCUITS, EQUIPPED WITH A REPAIR DEVICE |
DE3021896A1 (en) * | 1980-06-06 | 1982-03-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | METHOD FOR PRODUCING PRINTED CIRCUITS |
CH650618A5 (en) * | 1980-07-08 | 1985-07-31 | Olten Ag Elektro Apparatebau | PUSH BUTTON WITH PULSE OR LATCH FUNCTION. |
-
1983
- 1983-05-27 FR FR8308821A patent/FR2531302A1/en not_active Withdrawn
- 1983-07-22 JP JP13300683A patent/JPS5933895A/en active Pending
- 1983-07-29 GB GB8320548A patent/GB2124830A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2531302A1 (en) | 1984-02-03 |
GB2124830A (en) | 1984-02-22 |
JPS5933895A (en) | 1984-02-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB8321375D0 (en) | Electrical circuit units | |
GB8331096D0 (en) | Electrical circuits | |
GB2123216B (en) | Electrical circuit assemblies | |
GB8316270D0 (en) | Circuit arrangement | |
EP0107028A3 (en) | Circuit arrangement | |
GB2130795B (en) | Electrical contacts | |
GB8328851D0 (en) | Circuit arrangement | |
GB8303615D0 (en) | Electrical callibration arrangements | |
GB8305972D0 (en) | Circuit | |
GB8304856D0 (en) | Circuit arrangement | |
GB8527345D0 (en) | Circuit | |
DE3374735D1 (en) | Selectively operable electrical connection circuit | |
GB8312055D0 (en) | Circuit arrangement | |
GB2114824B (en) | Electrical terminal | |
GB8300387D0 (en) | Circuit arrangement | |
GB8311645D0 (en) | Circuit | |
GB8313517D0 (en) | Circuit | |
GB8329473D0 (en) | Electrical circuit arrangements | |
GB2075293B (en) | Electrical circuit arrangements | |
GB8313988D0 (en) | Circuit arrangement | |
GB8326201D0 (en) | Circuit arrangements | |
GB2127627B (en) | Electrical component | |
GB8303687D0 (en) | Circuit | |
GB8310136D0 (en) | Circuit | |
GB8318965D0 (en) | Circuit arrangement |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |