GB8305326D0 - Preheated flux in automated soldering processes - Google Patents

Preheated flux in automated soldering processes

Info

Publication number
GB8305326D0
GB8305326D0 GB838305326A GB8305326A GB8305326D0 GB 8305326 D0 GB8305326 D0 GB 8305326D0 GB 838305326 A GB838305326 A GB 838305326A GB 8305326 A GB8305326 A GB 8305326A GB 8305326 D0 GB8305326 D0 GB 8305326D0
Authority
GB
United Kingdom
Prior art keywords
soldering processes
automated soldering
preheated
flux
preheated flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB838305326A
Other versions
GB2120964A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alpha Metals Ltd
Alpha Assembly Solutions Inc
Original Assignee
Alpha Metals Ltd
Alpha Metals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Metals Ltd, Alpha Metals Inc filed Critical Alpha Metals Ltd
Publication of GB8305326D0 publication Critical patent/GB8305326D0/en
Publication of GB2120964A publication Critical patent/GB2120964A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB08305326A 1982-03-25 1983-02-25 Processes of applying solder Withdrawn GB2120964A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US36149882A 1982-03-25 1982-03-25

Publications (2)

Publication Number Publication Date
GB8305326D0 true GB8305326D0 (en) 1983-03-30
GB2120964A GB2120964A (en) 1983-12-14

Family

ID=23422296

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08305326A Withdrawn GB2120964A (en) 1982-03-25 1983-02-25 Processes of applying solder

Country Status (7)

Country Link
JP (1) JPS58179562A (en)
KR (1) KR840003971A (en)
DE (1) DE3308589A1 (en)
FR (1) FR2524248A1 (en)
GB (1) GB2120964A (en)
IL (1) IL68070A0 (en)
IT (1) IT1160749B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113199850A (en) * 2020-01-30 2021-08-03 赛米控电子股份有限公司 Device for printing heat-conducting material on cooling device or power semiconductor module

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4684054A (en) * 1985-03-30 1987-08-04 Asahi Chemical Research Laboratory Co., Ltd. Automatic soldering apparatus and method of using the flux to heat the circuit board
JPS61226166A (en) * 1985-03-30 1986-10-08 Asahi Kagaku Kenkyusho:Kk Method and apparatus for automatic soldering
BE1002430A3 (en) * 1988-02-16 1991-02-05 Interflux Electronics Bv Met B Soldering flux
JPH07121468B2 (en) * 1990-10-03 1995-12-25 メック株式会社 Flux for soldering
DE4033430A1 (en) * 1990-10-20 1992-04-23 Licentia Gmbh Solder coating of conductor pattern for attaching TAB-assembled device - consists of placing foil of flux material with a solder pattern on top, over substrate pattern
JPH05212584A (en) * 1992-01-31 1993-08-24 Senju Metal Ind Co Ltd Solder paste

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3112723A (en) * 1961-05-15 1963-12-03 Admiral Corp Automatic fluxing machine
GB1102621A (en) * 1965-04-07 1968-02-07 Electrovert Mfg Company Ltd Method and apparatus for fluxing and soldering connections on printed circuit boards
US3796610A (en) * 1972-09-28 1974-03-12 Ibm Glycerol soldering fluxes
US3825164A (en) * 1972-12-11 1974-07-23 Ibm Apparatus for soldering printed circuit cards
SE424518B (en) * 1973-09-07 1982-07-26 Western Electric Co PROCEDURE AND DEVICE FOR SOFT, MOLDING OR HARDWARE

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113199850A (en) * 2020-01-30 2021-08-03 赛米控电子股份有限公司 Device for printing heat-conducting material on cooling device or power semiconductor module

Also Published As

Publication number Publication date
IT8320254A0 (en) 1983-03-24
KR840003971A (en) 1984-10-06
JPS58179562A (en) 1983-10-20
IT1160749B (en) 1987-03-11
IL68070A0 (en) 1983-06-15
FR2524248A1 (en) 1983-09-30
DE3308589A1 (en) 1983-10-06
GB2120964A (en) 1983-12-14

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)