KR840003971A - Printed Circuit Board Soldering Method - Google Patents

Printed Circuit Board Soldering Method Download PDF

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Publication number
KR840003971A
KR840003971A KR1019830001220A KR830001220A KR840003971A KR 840003971 A KR840003971 A KR 840003971A KR 1019830001220 A KR1019830001220 A KR 1019830001220A KR 830001220 A KR830001220 A KR 830001220A KR 840003971 A KR840003971 A KR 840003971A
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KR
South Korea
Prior art keywords
solvent composition
temperature
solder
contacting
solvent
Prior art date
Application number
KR1019830001220A
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Korean (ko)
Inventor
브로우스 잭
Original Assignee
프레드릭 씨. 디스크 쥬니어
알파 메탈스 인코오포레이티드
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Application filed by 프레드릭 씨. 디스크 쥬니어, 알파 메탈스 인코오포레이티드 filed Critical 프레드릭 씨. 디스크 쥬니어
Publication of KR840003971A publication Critical patent/KR840003971A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

내용 없음No content

Description

인쇄회로 기판 납땜방법Printed Circuit Board Soldering Method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (17)

미리정해진 납땜온도에 유지되는 용융땜납 공급원으로 부터 납땜될 표면에 적용하기 위한 방법에 있어서, 상기 표면의 적어도 일부분을 상기 미리 정해진 땜납온도보다 낮은 적어도 약 65.5℃의 온도로 가열하는데 충분한 용제 온도에 유지된 가열된 용제 조성물과 상기 납땜될 표면을 접촉시킴에 의해 상기 표면을 용해하고 상기 가열되고 용해된 표면을 적어도 약 65.5℃의 온도로 유지되어 있는 동안 상기 용융땜납 공급원과 접촉시키는 단계들을 특징으로하는 납땜방법.A method for applying to a surface to be soldered from a molten solder source maintained at a predetermined soldering temperature, the method comprising: maintaining at least a portion of the surface at a solvent temperature sufficient to heat to a temperature of at least about 65.5 ° C. below the predetermined solder temperature Dissolving the surface by contacting the heated solvent composition with the surface to be soldered and contacting the heated and dissolved surface with the molten solder source while maintaining the temperature at least about 65.5 ° C. Soldering method. 제1항에 있어서, 상기 표면과 상기 용융땜공급원과의 접촉단계가 그 단계와 용해단계 사이에서 상기 표면의 중간가열을 행함이 없이 상기 용해단계로 부터 직접 수행되는 것을 특징으로 하는 상기 방법.The method according to claim 1, wherein the step of contacting the surface with the molten solder source is performed directly from the melting step without performing intermediate heating of the surface between the melting step and the melting step. 제1 또는 2항에 있어서, 상기 표면을 상기 용융땜납 공급원과의 접촉전에 열풍흐름과 접촉시키는 단계를 더 포함하는 것을 특징으로 하는 상기방법.3. The method of claim 1 or 2, further comprising contacting the surface with a hot air stream prior to contacting the molten solder source. 제1-3항중 한항에 있어서, 상기 용해단계와 땜납접촉단계를 통하여 상기 표면을 이송하기 위한 반송수단에 상기 납땜될 표면을 장착하는 단계를 포함함을 특징으로 하는 상기방법.4. A method as claimed in any one of claims 1-3, comprising the step of mounting the surface to be soldered to conveying means for conveying the surface through the dissolving step and the solder contacting step. 제4항에 있어서, 상기 반송수단이 연속적인 통로를 따라 상기 용해 및 접촉단계들을 통하여 상기 표면을 이송하는데 적합하게된 것을 특징으로하는 상기 방법.5. The method according to claim 4, wherein the conveying means is adapted to convey the surface through the dissolving and contacting steps along a continuous passage. 상기 항들중 한항에 있어서, 상기 가열된 용제 조성물이 약 65.5-107℃의 온도로 상기 표면의 적어도 일부분을 가열하는데 충분한 용제 온도로 유지되고, 상기 미리 정해진 땜납온도는 적어도 약 232℃인것을 특징으로 하는 상기방법.The method of claim 1, wherein the heated solvent composition is maintained at a solvent temperature sufficient to heat at least a portion of the surface to a temperature of about 65.5-107 ° C., and the predetermined solder temperature is at least about 232 ° C. Said method. 상기 항들중 한항에 있어서, 상기 가열된 용제 조성물이 휘발성 성분을 사실상 포함하지 않아서 상기 가열된 용제 조성물이 약 199℃이상의 비등점을 가짐을 특징으로 하는 상기 방법.The method of claim 1, wherein the heated solvent composition is substantially free of volatile components such that the heated solvent composition has a boiling point of about 199 ° C. or more. 제7항에 있어서, 상기 가열된 용제 조성물이 그 조성물의 유지온도와 같은 상기 용제 온도에서 약 50토르 보다 낮은 증가압을 가짐을 특징으로 하는 상기방법.8. The method of claim 7, wherein said heated solvent composition has an increasing pressure lower than about 50 Torr at said solvent temperature, such as the holding temperature of said composition. 상기 항들중 한항에 있어서, 상기 가열된 용제 조성물이 약 77℃이상의 온도로 유지되는 것을 특징으로 하는 상기방법.The method of claim 1, wherein the heated solvent composition is maintained at a temperature of about 77 ° C. or higher. 제9항에 있어서, 상기 가열된 용제 조성물이 약 93-190.5℃의 온도로 유지되는 상기방법.The method of claim 9, wherein the heated solvent composition is maintained at a temperature of about 93-190.5 ° C. 11. 상기항들중 한항에 있어서, 상기 표면이 인쇄회로 기판의 표면인 것을 특징으로 하는 상기방법.The method of claim 1, wherein the surface is a surface of a printed circuit board. 용융 땜납 공급원과 접촉될 표면을 용해하는데 사용하기 위한 땜납 용제 조성물에 있어서, 상기 용제 조성물이 아민하이드로 할라이드, 4암모니움 할라이드, 카복실산, 설폰산, 포스폰산, 황산 및 인산의 에스테르, 무기산, 무기염 및 그들의 혼합물로 이루어진 군으로 부터 선택된 용제 활성제와, 유기 용해 매개물을 포함하고, 상기 유기용해 매개물과 용제 조성물이 약 199℃이상의 부등점을 가지며, 상기 용제조성물이 실온에서 액상인 것을 특징으로하는 땜납용 제조성물.A solder solvent composition for use in dissolving a surface to be contacted with a molten solder source, wherein the solvent composition is an aminehydro halide, tetraammonium halide, carboxylic acid, sulfonic acid, phosphonic acid, ester of sulfuric acid and phosphoric acid, inorganic acid, inorganic salt. And a solvent activator selected from the group consisting of a mixture thereof, an organic dissolution medium, wherein the organic dissolution medium and the solvent composition have a boiling point of about 199 ° C. or more, and the solvent composition is a liquid at room temperature. Manufactured product. 제12항에 있어서, 상기 유기 용해 매개물과 용제 조성물이 약 120℃이상의 비등점을 가지는 것을 특징으로 하는 상기 땜납용 제조성물.13. The method of claim 12, wherein the organic dissolution medium and the solvent composition has a boiling point of about 120 ℃ or more. 제12항에 있어서, 상기 유기 용해 매개물 및 용제 조성물이 약 227℃이상의 비등점을 가짐을 특징으로 하는 상기 땜납용 제조성물.13. The preparation for soldering according to claim 12, wherein the organic dissolution medium and the solvent composition have a boiling point of about 227 ° C or more. 제12-14항중 한항에 있어서, 상기 유기용해 매개물이 글리콜, 글리콜, 에테르, 폴리글리콜, 폴리올, 폴리글리콜 에테르, 왁스, 지방, 유, 로진, 개질로진, 로진유도체, 알카린 카보네이트 및 그들의 혼합물로 이루어진 군으로부터 선택된 화합물을 포함함을 특징으로 하는 상기 땜납용제 조성물.The method according to any one of claims 12-14, wherein the organic dissolution medium is glycol, glycol, ether, polyglycol, polyol, polyglycol ether, wax, fat, oil, rosin, modified rosin, rosin derivative, alkaline carbonate and mixtures thereof. The solder solvent composition, characterized in that it comprises a compound selected from the group consisting of. 제12-15항중 한항에 있어서, 상기 용제 활성제가 카복실산, 설폰산, 포스폰산, 황산 및 인산의 에스테르, 비할로겐화 무기산 및 염, 그들의 화합물로 이루어진 군으로부터 선택되고 상기 유기 용해매개물이 높은 극성의 유기용해 매개물을 포함함을 특징으로 하는 상기 땜납 용제조성물.The organic of claim 12, wherein the solvent activator is selected from the group consisting of carboxylic acids, sulfonic acids, phosphonic acids, esters of sulfuric acid and phosphoric acid, non-halogenated inorganic acids and salts, and compounds thereof, wherein the organic dissolution medium is a highly polar organic Wherein said solder solvent composition comprises a dissolution medium. 제12-16항중 한항에 있어서, 상기 접촉될 표면이 인쇄회로기판의 표면인 것을 특징으로하는 상기 땜납용제 조성물.The solder solvent composition according to any one of claims 12 to 16, wherein the surface to be contacted is a surface of a printed circuit board. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019830001220A 1982-03-25 1983-03-25 Printed Circuit Board Soldering Method KR840003971A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US36149882A 1982-03-25 1982-03-25
US361,498 1982-03-25

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KR840003971A true KR840003971A (en) 1984-10-06

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ID=23422296

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Application Number Title Priority Date Filing Date
KR1019830001220A KR840003971A (en) 1982-03-25 1983-03-25 Printed Circuit Board Soldering Method

Country Status (7)

Country Link
JP (1) JPS58179562A (en)
KR (1) KR840003971A (en)
DE (1) DE3308589A1 (en)
FR (1) FR2524248A1 (en)
GB (1) GB2120964A (en)
IL (1) IL68070A0 (en)
IT (1) IT1160749B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61226166A (en) * 1985-03-30 1986-10-08 Asahi Kagaku Kenkyusho:Kk Method and apparatus for automatic soldering
US4684054A (en) * 1985-03-30 1987-08-04 Asahi Chemical Research Laboratory Co., Ltd. Automatic soldering apparatus and method of using the flux to heat the circuit board
BE1002430A3 (en) * 1988-02-16 1991-02-05 Interflux Electronics Bv Met B Soldering flux
JPH07121468B2 (en) * 1990-10-03 1995-12-25 メック株式会社 Flux for soldering
DE4033430A1 (en) * 1990-10-20 1992-04-23 Licentia Gmbh Solder coating of conductor pattern for attaching TAB-assembled device - consists of placing foil of flux material with a solder pattern on top, over substrate pattern
JPH05212584A (en) * 1992-01-31 1993-08-24 Senju Metal Ind Co Ltd Solder paste
DE102020102306A1 (en) * 2020-01-30 2021-08-05 Semikron Elektronik Gmbh & Co. Kg Device and method for printing through a waxy, pasty, thermally conductive material onto a cooling device or a power semiconductor module

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3112723A (en) * 1961-05-15 1963-12-03 Admiral Corp Automatic fluxing machine
GB1102621A (en) * 1965-04-07 1968-02-07 Electrovert Mfg Company Ltd Method and apparatus for fluxing and soldering connections on printed circuit boards
US3796610A (en) * 1972-09-28 1974-03-12 Ibm Glycerol soldering fluxes
US3825164A (en) * 1972-12-11 1974-07-23 Ibm Apparatus for soldering printed circuit cards
SE424518B (en) * 1973-09-07 1982-07-26 Western Electric Co PROCEDURE AND DEVICE FOR SOFT, MOLDING OR HARDWARE

Also Published As

Publication number Publication date
IL68070A0 (en) 1983-06-15
FR2524248A1 (en) 1983-09-30
IT8320254A0 (en) 1983-03-24
GB2120964A (en) 1983-12-14
JPS58179562A (en) 1983-10-20
GB8305326D0 (en) 1983-03-30
DE3308589A1 (en) 1983-10-06
IT1160749B (en) 1987-03-11

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