GB811509A - Improvements relating to printed circuit connections - Google Patents

Improvements relating to printed circuit connections

Info

Publication number
GB811509A
GB811509A GB33237/55A GB3323755A GB811509A GB 811509 A GB811509 A GB 811509A GB 33237/55 A GB33237/55 A GB 33237/55A GB 3323755 A GB3323755 A GB 3323755A GB 811509 A GB811509 A GB 811509A
Authority
GB
United Kingdom
Prior art keywords
lead
panel
leads
hole
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB33237/55A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB811509A publication Critical patent/GB811509A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H05K2201/10765—Leads folded back, i.e. bent with an angle of 180 deg
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

811,509. Soldering. INTERNATIONAL BUSINESS MACHINES CORPORATION. Nov. 21, 1955 [Nov. 22, 1954], No. 33237/55. Class 83 (4). In connecting a component to a printed circuit panel by dip soldering, a portion of a component lead is inserted in a hole in the panel so that a capillary gap is left between the lead and an adjacent member or another portion of the lead or the wall of the hole and the lead or lead and member on one side of the panel are immersed in molten solder so that solder enters the gap and travels to the other side of the panel. In an embodiment a component 8, Fig. 2, has two leads 1 about each of which a wire 2 is coiled to form the capillary gap and the leads are inserted in holes 3 in a panel 4 having patterns 5, 6 on both sides thereof, the panel being then immersed on one side in solder 7. The solder travels up the coils and forms a connection between the leads 1 and both patterns 5, 6. In modifications, a lead is bent back on itself, Fig. 4, to form the capillary gap, a separate wire is coiled about a lead to form a shoulder with a straight portion lying adjacent the lead in the hole or the lead may be coiled as in Fig. 5 to fit the hole. The turns 9 and 10 resting on the upper surface of the panel position the leads.
GB33237/55A 1954-11-22 1955-11-21 Improvements relating to printed circuit connections Expired GB811509A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US811509XA 1954-11-22 1954-11-22

Publications (1)

Publication Number Publication Date
GB811509A true GB811509A (en) 1959-04-08

Family

ID=22162402

Family Applications (1)

Application Number Title Priority Date Filing Date
GB33237/55A Expired GB811509A (en) 1954-11-22 1955-11-21 Improvements relating to printed circuit connections

Country Status (1)

Country Link
GB (1) GB811509A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3062981A (en) * 1959-02-24 1962-11-06 Rca Corp Electron tube stem conductors having improved surface wettability
DE2806683A1 (en) * 1978-02-16 1979-08-30 Siemens Ag Current-carrying wire lead for electronic component - has end bent double to hold component to circuit board prior to soldering
FR2555010A1 (en) * 1983-11-15 1985-05-17 Thomson Csf WAVE-BRAZING METHOD AND CAPILLARY BRAZE SENSOR USING THE SAME
US4691979A (en) * 1983-08-04 1987-09-08 Manda R & D Compliant press-fit electrical contact
DE19528315A1 (en) * 1995-05-29 1996-12-12 Telefunken Microelectron Method of soldering insulated wire with uninsulated end into circuit board soldering hole
US5695110A (en) * 1995-05-29 1997-12-09 Temic Telefunken Microelectronic Gmbh Procedure for soldering an insulated wire

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3062981A (en) * 1959-02-24 1962-11-06 Rca Corp Electron tube stem conductors having improved surface wettability
DE2806683A1 (en) * 1978-02-16 1979-08-30 Siemens Ag Current-carrying wire lead for electronic component - has end bent double to hold component to circuit board prior to soldering
US4691979A (en) * 1983-08-04 1987-09-08 Manda R & D Compliant press-fit electrical contact
FR2555010A1 (en) * 1983-11-15 1985-05-17 Thomson Csf WAVE-BRAZING METHOD AND CAPILLARY BRAZE SENSOR USING THE SAME
EP0145557A2 (en) * 1983-11-15 1985-06-19 Thomson-Csf Wave soldering process and capillary solder means for carrying out the process
EP0145557A3 (en) * 1983-11-15 1985-07-10 Thomson-Csf Wave soldering process and capillary solder means for carrying out the process
DE19528315A1 (en) * 1995-05-29 1996-12-12 Telefunken Microelectron Method of soldering insulated wire with uninsulated end into circuit board soldering hole
US5695110A (en) * 1995-05-29 1997-12-09 Temic Telefunken Microelectronic Gmbh Procedure for soldering an insulated wire
DE19528315C2 (en) * 1995-05-29 2000-07-20 Telefunken Microelectron Process for soldering an insulated wire

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