GB780207A - Improvements in or relating to methods for manufacturing devices embodying semi-conductors - Google Patents

Improvements in or relating to methods for manufacturing devices embodying semi-conductors

Info

Publication number
GB780207A
GB780207A GB37113/54A GB3711354A GB780207A GB 780207 A GB780207 A GB 780207A GB 37113/54 A GB37113/54 A GB 37113/54A GB 3711354 A GB3711354 A GB 3711354A GB 780207 A GB780207 A GB 780207A
Authority
GB
United Kingdom
Prior art keywords
support
tube
semi
envelope
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB37113/54A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Publication of GB780207A publication Critical patent/GB780207A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

780,207. Semi-conductor devices. PHILIPS ELECTRICAL INDUSTRIES, Ltd. Dec. 22, 1954 [Dec. 24, 1953], No. 37113/54. Class 37. A method of making a semi-conductor device comprising an envelope 1 through which a metal tube 2 has been sealed, housing a semiconductor body 10, e.g. Ge, and a co-operating electrode 9 or electrodes, comprises securing a metal support 6, 5 for the body 10 or one 9 of the electrodes in the tube by deforming the outer end of the tube to grip the support and form a partial seal therewith and then sealing it to the support. In the crystal diode shown in Fig. 1, the envelope is of glass and both tubes 2 of Fe-Ni-Co alloy are deformed by spinning them over at 13 into grooves 12 in the respective supports 5, 6, the seal being completed by solder or synthetic, e.g. ethoxyline resin, applied to the outside of the end of each tube. In a modification, Fig. 2 (not shown), the tube through which the support on which the Ge bead is soldered passes, is spun over a bulge on the support before the sealing. The support to which the cooperating electrode is welded is then sealed through a sealed-in metal tube in the normal way, influx of vapour generated by the sealing being prevented by the pressure generated within the envelope by the heating.
GB37113/54A 1953-12-24 1954-12-22 Improvements in or relating to methods for manufacturing devices embodying semi-conductors Expired GB780207A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL780207X 1953-12-24

Publications (1)

Publication Number Publication Date
GB780207A true GB780207A (en) 1957-07-31

Family

ID=19830386

Family Applications (1)

Application Number Title Priority Date Filing Date
GB37113/54A Expired GB780207A (en) 1953-12-24 1954-12-22 Improvements in or relating to methods for manufacturing devices embodying semi-conductors

Country Status (3)

Country Link
DE (1) DE1699520U (en)
FR (1) FR1116365A (en)
GB (1) GB780207A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE534369A (en) * 1953-12-24
DE1207512B (en) * 1961-03-01 1965-12-23 Telefunken Patent Process for the production of semiconductor components with a platelet-shaped semiconductor body

Also Published As

Publication number Publication date
DE1699520U (en) 1955-06-02
FR1116365A (en) 1956-05-07

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