GB716253A - Improvements in or relating to electrically conducting adhesives - Google Patents
Improvements in or relating to electrically conducting adhesivesInfo
- Publication number
- GB716253A GB716253A GB1726651A GB1726651A GB716253A GB 716253 A GB716253 A GB 716253A GB 1726651 A GB1726651 A GB 1726651A GB 1726651 A GB1726651 A GB 1726651A GB 716253 A GB716253 A GB 716253A
- Authority
- GB
- United Kingdom
- Prior art keywords
- silver
- electrically conducting
- fine
- relating
- ultra
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 title abstract 2
- 230000001070 adhesive effect Effects 0.000 title abstract 2
- 239000004332 silver Substances 0.000 abstract 5
- 229910052709 silver Inorganic materials 0.000 abstract 5
- 210000003298 dental enamel Anatomy 0.000 abstract 3
- 239000011521 glass Substances 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 abstract 1
- 239000000020 Nitrocellulose Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229920001220 nitrocellulos Polymers 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 238000009877 rendering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01011—Sodium [Na]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Die Bonding (AREA)
- Glass Compositions (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
An electrically conducting adhesive comprises a glass enamel with which is incorporated sufficient of a mixture of fine flake silver and ultra-fine precipitated silver, preferably prepared as described in Specification 716,243, to render the conductivity of the enamel when solidified, substantially the same as that of block silver, without rendering the solidified compound friable. A preferred composition consists of fine flake silver, ultra-fine precipitated silver, glass enamel powder, ethyleneglycolmonoethylether and nitrocellulose.
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE512894D BE512894A (en) | 1951-07-20 | ||
GB1726651A GB716253A (en) | 1951-07-20 | 1951-07-20 | Improvements in or relating to electrically conducting adhesives |
DEJ6145A DE1166934B (en) | 1951-07-20 | 1952-07-18 | Electric semiconductor device built into a glass case |
FR65238D FR65238E (en) | 1949-07-29 | 1952-07-18 | Triodes using crystals such as germanium crystals |
FR65380D FR65380E (en) | 1949-07-29 | 1952-11-25 | Triodes using crystals such as germanium crystals |
FR65573D FR65573E (en) | 1949-07-29 | 1953-02-27 | Triodes using crystals such as germanium crystals |
FR65867D FR65867E (en) | 1949-07-29 | 1953-04-24 | Triodes using crystals such as germainium crystals |
FR67258D FR67258E (en) | 1949-07-29 | 1954-08-03 | Triodes using crystals such as germanium crystals |
FR69063D FR69063E (en) | 1949-07-29 | 1955-03-03 | Triodes using crystals such as germanium crystals |
FR69069D FR69069E (en) | 1949-07-29 | 1955-04-07 | Triodes using crystals such as germanium crystals |
FR69071D FR69071E (en) | 1950-06-09 | 1955-06-10 | Triodes using crystals such as germanium crystals |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1726651A GB716253A (en) | 1951-07-20 | 1951-07-20 | Improvements in or relating to electrically conducting adhesives |
Publications (1)
Publication Number | Publication Date |
---|---|
GB716253A true GB716253A (en) | 1954-09-29 |
Family
ID=10092178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1726651A Expired GB716253A (en) | 1949-07-29 | 1951-07-20 | Improvements in or relating to electrically conducting adhesives |
Country Status (3)
Country | Link |
---|---|
BE (1) | BE512894A (en) |
DE (1) | DE1166934B (en) |
GB (1) | GB716253A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1226232B (en) * | 1958-12-06 | 1966-10-06 | Philips Patentverwaltung | Coating agent for the production of electrically conductive silver layers on insulating bodies |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE314173C (en) * | ||||
CH216635A (en) * | 1940-07-19 | 1941-09-15 | Bbc Brown Boveri & Cie | Process for producing a conductive coating on insulators. |
CH231571A (en) * | 1941-08-27 | 1944-03-31 | Hermes Patentverwertungs Gmbh | High voltage insulator, in particular for DC voltage systems. |
US2415036A (en) * | 1944-10-13 | 1947-01-28 | Bendix Aviat Corp | Resistance material |
-
0
- BE BE512894D patent/BE512894A/xx unknown
-
1951
- 1951-07-20 GB GB1726651A patent/GB716253A/en not_active Expired
-
1952
- 1952-07-18 DE DEJ6145A patent/DE1166934B/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1226232B (en) * | 1958-12-06 | 1966-10-06 | Philips Patentverwaltung | Coating agent for the production of electrically conductive silver layers on insulating bodies |
Also Published As
Publication number | Publication date |
---|---|
DE1166934B (en) | 1964-04-02 |
BE512894A (en) |
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