GB690888A - Compositions comprising organopolysiloxanes and silica gels - Google Patents
Compositions comprising organopolysiloxanes and silica gelsInfo
- Publication number
- GB690888A GB690888A GB1432/51A GB143251A GB690888A GB 690888 A GB690888 A GB 690888A GB 1432/51 A GB1432/51 A GB 1432/51A GB 143251 A GB143251 A GB 143251A GB 690888 A GB690888 A GB 690888A
- Authority
- GB
- United Kingdom
- Prior art keywords
- siloxane
- silica
- solvent
- composition
- hydrogel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A composition for use as a dielectric sealing material, e.g for sparking plug terminals, which will not flow after being subjected to mechanical shear, is made by replacing the water in a silica hydrogel with a water miscible organic solvent and then replacing the organic solvent with a liquid polysiloxane having a viscosity of not less than 50 cs. at 25 DEG C., and having between 1.9 and 2.1 hydrocarbon radicals per silicon atom, at least 50 per cent of the radicals being methyl and the remainder phenyl. The initial hydrogel has 1 to 35 per cent silica. The composition has from 1 to 35 per cent of silica, based on the weight of the composition. Other ingredients which may be present are aluminium, iron, copper and titanium oxides (in the form of co-gels with the silica), and suspensoids such as silica, titanium oxide, clay, kaolin, mica, talc, graphite, diatomaceous earth and Fuller's earth. The suspensoids are preferably incorporated when making the hydrogel, being added to the sol after the silicate solution has been neutralized and before setting to the hydrogel. The siloxane may be added as a solution to the organo-gel, particularly if of high viscosity, the solvent being distilled off. If the water-miscible solvent is not compatible with the siloxane it may first be replaced by a compatible solvent which is then replaced by the siloxane. The siloxane may be added to the silica organo-gel and the solvent distilled off, or the solvent extracted by washing with siloxane. The composition may be milled to improve its uniformity and more siloxane added at this stage if required for thinning. Water-miscible solvents specified are the lower alcohols, ketones, ethers and amines. Siloxane solvents specified are chloroform, carbon tetrachloride, toluene, benzene, ethers and petroleum ethers. Several examples of gels according to the invention are given together with figures for penetrometer readings, bleed, flow after working, arc resistance and dielectric strength. Comparable figures are given for a siloxane/aerogel composition. Specification 605,036 is referred to.ALSO:A composition for use as a dielectric sealing material, e.g for sparking plug terminals, which will not flow after being subjected to mechanical shear, is made by replacing the water in a silica hydrogel with a water-imiscible organic solvent, and then replacing the solvent with a liquid polysiloxane having a viscosity not less than 50 c.s. at 25 DEG C and having between 1.9 and 2.1 hydrocarbon radicals per silicon atom, at least 50 per cent of the radicals being methyl and the remainder phenyl. The initial hydrogel has from 1-35 per cent silica and the final composition also has from 1-35 per cent silica. Other ingredients which may be present are aluminium, iron, copper and titanium oxides (in the form of cogels with the silica), and suspensoids such as silica, titanium oxide, clay, kaolin, mica, talc, graphite, distanaceous earth and Fuller's earth. The suspensoids are preferably incorporated when making the hydrogel, being added to the sol after the silicate solution has been neutralized and before setting to the hydrogel. The siloxane may be added as a solution to the organogel, particularly if of high viscosity, the solvent being distilled off. If the water-imiscible solvent is not compatible with the siloxane it may first be replaced by a compatible solvent which is then replaced by the siloxane. The composition may be milled to improve its uniformity and more siloxane added at this stage if required for thinning. Water-miscible solvents specified are the lower alcohols, ketones, ethers and amines. Siloxane solvents specified are chloroform, carbon tetrachloride, toluene benzene, ethers and petroleum ethers. Several examples of gels according to the invention are given together with figures for penetriometer readings, bleed, flow after working, arc resistance and dielectric strength. Comparable figures are given for a siloxane/aerogel composition. Specification 605,036, [Group IV(a)], is referred to.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US690888XA | 1950-03-09 | 1950-03-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB690888A true GB690888A (en) | 1953-04-29 |
Family
ID=22086675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1432/51A Expired GB690888A (en) | 1950-03-09 | 1951-01-18 | Compositions comprising organopolysiloxanes and silica gels |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB690888A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1186389B (en) * | 1959-07-24 | 1965-01-28 | A P Green Fire Brick Company | Metal clad refractory brick and method of making the same |
EP0774612A1 (en) * | 1995-11-16 | 1997-05-21 | Elf Aquitaine Production | Thermal and/or acoustic insulation system for a pipe |
EP3011836A1 (en) * | 2014-10-20 | 2016-04-27 | Stichting Top Institute Food and Nutrition | Protein-stabilised oleogels |
-
1951
- 1951-01-18 GB GB1432/51A patent/GB690888A/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1186389B (en) * | 1959-07-24 | 1965-01-28 | A P Green Fire Brick Company | Metal clad refractory brick and method of making the same |
EP0774612A1 (en) * | 1995-11-16 | 1997-05-21 | Elf Aquitaine Production | Thermal and/or acoustic insulation system for a pipe |
FR2741420A1 (en) * | 1995-11-16 | 1997-05-23 | Elf Aquitaine | THERMAL AND / OR ACOUSTIC INSULATION SYSTEM OF A CONDUIT |
US5858489A (en) * | 1995-11-16 | 1999-01-12 | Elf Aquitaine Production | System for thermal and/or acoustic insulation of a tube |
EP3011836A1 (en) * | 2014-10-20 | 2016-04-27 | Stichting Top Institute Food and Nutrition | Protein-stabilised oleogels |
WO2016062685A1 (en) | 2014-10-20 | 2016-04-28 | Stichting Top Institute Food And Nutrition | Protein-stabilised oleogels |
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