GB592443A - Improvements in or relating to electro-plating - Google Patents

Improvements in or relating to electro-plating

Info

Publication number
GB592443A
GB592443A GB1759544A GB1759544A GB592443A GB 592443 A GB592443 A GB 592443A GB 1759544 A GB1759544 A GB 1759544A GB 1759544 A GB1759544 A GB 1759544A GB 592443 A GB592443 A GB 592443A
Authority
GB
United Kingdom
Prior art keywords
betaine
alpha
dimethyl
copper
trimethyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1759544A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric International Co
Original Assignee
Westinghouse Electric International Co
Filing date
Publication date
Application filed by Westinghouse Electric International Co filed Critical Westinghouse Electric International Co
Publication of GB592443A publication Critical patent/GB592443A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/58Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

592,443. Electro-deposition of alloys. SHEPHERD, G. R. (Westinghouse Electric International Co.). Sept. 14, 1944, No. 17595. [Class 41] An alloy of copper zinc and tin is deposited from a bath containing cyanides of the metals using an anode composed of- 50-75 per cent copper, 15-30 per cent tin and 5-20 per cent zinc. Preferred anode proportions are 55-65 per cent copper, 20-30 per cent tin and 8-20 per cent zinc. The bath may contain per U.S.A. gallon free cyanide 0.5-5.0 oz., copper 0.2-0.5 oz., tin 0.05-0.20 oz., zinc 0.1-0.5 oz., sodium carbonate 2-12 oz. and may be made up by dissolving appropriate proportions of copper, zinc and sodium cyanides, sodium stannate and sodium carbonate. The bath is maintained at pH 11-13. Alkali metal thiocyanate in amount 0.5-2 oz. per U.S.A. gallon may be added as a brightener. A complexing agent such as Rochelle salts or citric acid may also be added. As an anti-pitting and brightening agent there may be added 0.01-1 oz. per U.S.A. gallon of a betaine having at least one non-cyclic hydrocarbon radical which contains 10-20 carbon atoms. Examples of such betaines are : trimethyl-C-decyl alpha betaine, trimethyl-C-cetyl alpha betaine, trimethyl-C- cetyl gamma betaine, dimethyl beta-hydroxyethyl-C-cetyl alpha betaine, methyl di-(betahydroxyethyl)-C-cetyl alpha betaine, trimethyl- C - lauryl alpha betaine, trimethyl - C - lauryl gamma betaine, trimethyl - C - stearyl alpha betaine, dimethyl-N-stenyl alpha betaine, dimethyl - N - stenyl - C - methyl alpha betaine, methyl-N-distenyl alpha betaine, dimethyl-N- stenyl-C-cetyl beta betaine, dimethyl-N-decyl beta - hydroxy gamma betaine, dimethyl - N - heptadecyl alpha betaine, dimethyl - N - octa - decyl - C - methyl alpha betaine, dimethyl - N - octadecyl beta betaine, dimethyl - N - octadecyl beta-hydroxy gamma betaine. Alternatively, there may be added 0.01-5 oz. per U.S.A. gallon of a water-soluble surface active agent having a minimum of 15 carbon atoms connected in a long chain selected from the group consisting of oleates, palmitates, stearates, sulphonated oils, ricinoleates, polyoxyalkylene ethers, and quaternary ammonium compounds. Satisfactory quaternary ammonium compounds are those having either of the formulas where X is a halogen, n is 12 or greater and m is 14 or greater. Sodium thiocyanate, sodium disulphate, tri-sodium phosphate and sodium sulphate may be present in addition to the organic agents. A voltage of 3-5 may be employed with the electrodes 4-6 inches apart. Insoluble anodes of steel or carbon may be employed in addition to the alloy anode, the latter constituting 15 per cent of the total anode area. Supporting hooks of steel may be cast into the anodes or the anodes may be cast into balls for insertion in a supporting frame. The .bath has high throwing power. The plating applied to copper may be readily soldered. It is non-magnetic and has high corrosion resistance. The plating may be applied to steel directly or with an intermediate copper coating. Objects 24 to be plated may be mounted on hooks 26 on a support 22 coated with insulation except at contact surfaces.
GB1759544A 1944-09-14 Improvements in or relating to electro-plating Expired GB592443A (en)

Publications (1)

Publication Number Publication Date
GB592443A true GB592443A (en) 1947-09-18

Family

ID=1733233

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1759544A Expired GB592443A (en) 1944-09-14 Improvements in or relating to electro-plating

Country Status (1)

Country Link
GB (1) GB592443A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2334844A1 (en) * 2008-09-26 2011-06-22 Assa Ab Method for the electrolytic plating of an article, and an electrolytic solution
USRE45297E1 (en) 1996-03-22 2014-12-23 Ronald Redline Method for enhancing the solderability of a surface
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
USRE45881E1 (en) 1996-03-22 2016-02-09 Ronald Redline Method for enhancing the solderability of a surface

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE45297E1 (en) 1996-03-22 2014-12-23 Ronald Redline Method for enhancing the solderability of a surface
USRE45881E1 (en) 1996-03-22 2016-02-09 Ronald Redline Method for enhancing the solderability of a surface
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
EP2334844A1 (en) * 2008-09-26 2011-06-22 Assa Ab Method for the electrolytic plating of an article, and an electrolytic solution
EP2334844A4 (en) * 2008-09-26 2014-08-27 Assa Ab Method for the electrolytic plating of an article, and an electrolytic solution

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