GB547755A - Method for joining metallic bodies - Google Patents

Method for joining metallic bodies

Info

Publication number
GB547755A
GB547755A GB6635/41A GB663541A GB547755A GB 547755 A GB547755 A GB 547755A GB 6635/41 A GB6635/41 A GB 6635/41A GB 663541 A GB663541 A GB 663541A GB 547755 A GB547755 A GB 547755A
Authority
GB
United Kingdom
Prior art keywords
brazing
pieces
parts
silver solder
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6635/41A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Publication of GB547755A publication Critical patent/GB547755A/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

547,755. Brazing parts of vacuum tubes &c. STANDARD TELEPHONES & CABLES, Ltd. May 23, 1941, No. 6635. Convention date, July 13, 1940. [Classes 83 (ii) and 83 (iv)] In brazing together two pieces of metal, such as the copper parts of a vacuum tube of the electron discharge type prior to heating to a high temperature to effect degasifying, the pieces are first each coated with a thin film of a metal with which the brazing material has a lower rate of alloying than with the metal of the pieces, placing the coated pieces in close proximity, heating to brazing temperature and applying brazing material. The coating ensures the capillary flow of brazing material completely between the pieces instead of soaking into the pieces adjacent the point of application of the brazing material and thus renders the joint gas tight. Copper pieces may be coated with nickel or iron and the brazing material may consist of silver solder containing 70 per cent of silver and 30 per cent of copper. A pair of two inch copper discs may be electrolytically coated with nickel for five minutes at a rate of 20 amperes per sq. ft. current density. The parts are then placed together leaving a space not exceeding 0.002 inch and preferably 0.001 inch and the silver solder applied round the periphery and the parts heated for 2-5 minutes at brazing temperature which may be from 100-300‹ C. in excess of the melting point of the silver solder. Brazing may be effected in the presence of fluxes such as borax or fluorides or in an atmosphere of hydrogen. The silver solder may alternatively be deposited as one or more globules in one of the parts prior to assembly. A wire 8 of silver solder may be held at the joint between a pair of closed nickel plated copper tubes 6, 7 by a corrugated spring clip 9 consisting of a wire of an alloy which does not melt at the brazing temperature such as a nickel-chromium alloy. Two apertured discs 10, 11 to be brazed to a tube 12 have their apertures flared to leave a space to receive a wire 13 of silver solder, the parts being previously nickel plated.
GB6635/41A 1940-07-13 1941-05-23 Method for joining metallic bodies Expired GB547755A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US547755XA 1940-07-13 1940-07-13

Publications (1)

Publication Number Publication Date
GB547755A true GB547755A (en) 1942-09-09

Family

ID=21993458

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6635/41A Expired GB547755A (en) 1940-07-13 1941-05-23 Method for joining metallic bodies

Country Status (1)

Country Link
GB (1) GB547755A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2609598A (en) * 1947-09-27 1952-09-09 Chrysler Corp Method of forming a composite structure comprising a chromecontaining member
US2770033A (en) * 1951-06-14 1956-11-13 Machlett Lab Inc Method of soldering a thin beryllium member to a metal part
US3675310A (en) * 1971-04-20 1972-07-11 Us Interior Soldering method
CN115415626A (en) * 2022-11-03 2022-12-02 诚联恺达科技有限公司 Optimization method of vacuum reflow soldering process

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2609598A (en) * 1947-09-27 1952-09-09 Chrysler Corp Method of forming a composite structure comprising a chromecontaining member
US2770033A (en) * 1951-06-14 1956-11-13 Machlett Lab Inc Method of soldering a thin beryllium member to a metal part
US3675310A (en) * 1971-04-20 1972-07-11 Us Interior Soldering method
CN115415626A (en) * 2022-11-03 2022-12-02 诚联恺达科技有限公司 Optimization method of vacuum reflow soldering process

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