GB2623543A - Method of managing heat dissipation for surface mounted devices - Google Patents

Method of managing heat dissipation for surface mounted devices Download PDF

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Publication number
GB2623543A
GB2623543A GB2215437.1A GB202215437A GB2623543A GB 2623543 A GB2623543 A GB 2623543A GB 202215437 A GB202215437 A GB 202215437A GB 2623543 A GB2623543 A GB 2623543A
Authority
GB
United Kingdom
Prior art keywords
surface mounted
assembly
mounted devices
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB2215437.1A
Other versions
GB202215437D0 (en
Inventor
László Hegedüs-Fuchs Gergely
Attila Fodor Tamás
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rolls Royce Deutschland Ltd and Co KG
Original Assignee
Rolls Royce Deutschland Ltd and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rolls Royce Deutschland Ltd and Co KG filed Critical Rolls Royce Deutschland Ltd and Co KG
Priority to GB2215437.1A priority Critical patent/GB2623543A/en
Publication of GB202215437D0 publication Critical patent/GB202215437D0/en
Publication of GB2623543A publication Critical patent/GB2623543A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/11015—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for aligning the bump connector, e.g. marks, spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A method of assembling at least one surface mounted device (SMD) 202 on a PCB 208 where the SMD has a bearing interface 206 for providing a spacer for defining the solder to PCB spacing. After the SMDs are initially soldered to the PCB, a heatsink 218 carrying a thermal interface material 214 for contacting the SMDs is pressed down with a second heating step such that the solder reflows and the spacers help align the SMDs flat between the heatsink and PCB. Figure 1 shows a flowchart.

Description

I
METHOD OF MANAGING HEAT DISSIPATION FOR SURFACE
MOUNTED DEVICES
Technical field
The present disclosure relates generally to a dissipation of heat more specifically, the present disclosure relates to a method of managing heat dissipation for surface mounted devices.
Background
Thermal Interface Materials (TIMs) are considered important parts in any heat management system. Contemporary, TIMs such as gap fillers, thermal grease, graphite, adhesive films, tapes and the like are used in electronic devices, for example, electronic devices can be laptops, radios, air conditioners, electronic converters, control units and the like to dissipate heat therefrom.
Conventionally, electronic units such as Printed Circuit Boards (PCBs) or Printed Wiring Boards (PWBs) have a sandwich structure with conducting and insulating layers on which Surface Mount Devices (SMDs) are affixed at designated locations on the outer surface. SMDs are miniature in size and are suitable for surface assembly on PCBs. The SMDs can have passive components like resistors, capacitors, discrete components like ICs, transistors and electromechanical devices like switches. Generally, during the operation, the PCBs can get heated up due to power dissipation by the SMDs. Presently, heatsinks are being used on the SMDs to dissipate heat, for the purpose of increasing the reliability, lifetime and power level of PCBs. Typically, TIMs are used between the SMDs and the heatsinks to maintain a temperature within the operating temperature.
However, the TIM applied therebetween is unable to effectively cool the SMDs. This occurs due to the TIMs often have high thicknesses, leading to high thermal resistances of the TIMs during operation. Notably, the distribution of thermal resistance and temperature across the SMDs is also uneven. This affects the efficiency of the electronic devices.
Therefore, to ameliorate the technical problems encountered with known conventional method of dissipating heat from SMDs, there exists a need to provide an improved method of dissipating heat from SMDs employing TIMs that is more effective when in operation.
Summary
The present disclosure seeks to provide an improved a method of managing heat dissipation for surface mounted devices. The present disclosure seeks to provide a solution to the existing problem by providing a method for improving the heat dissipation from surface mounted devices that can be achieved by reducing the thickness of a thermal interface material. An aim of the present disclosure is to provide a solution that overcomes, at least partially, the aforementioned problems encountered in prior art, and to provide a method of managing heat dissipation for surface mounted devices which is more efficient and higher reliability.
In a first aspect, the present disclosure presents a method of assembling an electronic assembly with at least one surface mounted device, the method comprising: - defining a bearing surface on the at least one surface mounted device; - arranging the at least one surface mounted device on a printed circuit board to form a first assembly; - soldering the at least one surface mounted device on the printed circuit board heating the first assembly; - pressing a second assembly on the first assembly.
The present disclosure includes the finding, that by means of a bearing interface, a horizontal arrangement of at least one surface mounted device can be achieved in an improved manner. Such improved horizontal arrangement can particularly be achieved after a prior soldering.
By means of the method, an electronic assembly of a printed circuit board and at least one surface mounted device is provided, that provides for improved dissipation of heat from the at least one surface mounted device to a heat sink. Further, assembly and manufacturing effort for such electronic assembly can be reduced, as a more even arrangement of the at least one surface mounted device in a horizontal plane, i.e. parallel to the printed circuit board, can be achieved. The soldering of surface mounted devices can result in a relatively uneven horizontal arrangement of said surface mounted devices on the printed circuit board. Rather than compensating such uneven arrangement with a higher thickness of the thermal interface material, the present disclosure includes the finding that the horizontal arrangement can be improved by a heating and pressing following the soldering process. By the presented method, the contact between the at least one surface mounted device and the heatsink can be improved, in particular the contact surface can be increased and/or the distance between the at least one surface mounted device and the heatsink can be decreased.
It should be understood that pressing the second assembly on the first assembly includes applying a force to the first and/or second assembly to press the first and second assembly together. Likewise, the first assembly can be pressed to the second assembly, or both assemblies can be pressed to each other.
Optionally, arranging the surface mounted devices on the printed circuit board comprises clamping the second assembly with respect to the first assembly to allow alignment and contact between the thermal interface material and the surface mounted devices. By means of clamping a thermal pathway between the first and second assembly is formed for improved heat dissipation.
Optionally, heating the first assembly is performed using a local heating 10 technique or an overall heating technique. Optionally, the soldering of the surface mounted devices on the printed circuit board comprises the application and/or heating of solder material.
Optionally, the second assembly comprises a heatsink and/or a thermal interface material. Optionally, the second assembly is formed by applying a thermal interface material to a heatsink. Optionally, the second assembly comprises or is an object with an even horizontal surface configured to apply a force to the at least one surface mounted device as to press the at least one surface mounted device to the printed circuit board. Optionally, the even horizontal surface and/or the heatsink covers an area including all surface mounted devices arranged on the printed circuit board. The second assembly comprising the heatsink has the advantage of combining two manufacturing steps, namely the pressing or horizontal alignment of the at least one surface mounted device, and the arranging of the heatsink, in one step.
Optionally, the pressing the second assembly on the first assembly comprises an amount of force that allows interaction between the thermal interface material and the surface mounted devices. Optionally, the pressing the second assembly on the first assembly comprises an amount of force that allows a deforming of the heated solder material.
Optionally, the clamping between the first and second assembly comprises an amount of force that allows interaction between the thermal interface material and the surface mounted devices, and thermal interface material and the surface mounted devices and the printed circuit board.
In a second aspect, the present disclosure presents an electronic assembly, comprising, - a first assembly comprising at least one surface mounted device and a printed circuit board, wherein the at least one surface mounted 10 device is soldered to the printed circuit board, - a second assembly comprising a heatsink and a thermal interface material, - a bearing interface configured to arrange the at least one surface mounted device in a defined distance from the printed circuit board.
Optionally, the bearing interface is arranged on the surface mounted device. Optionally, the bearing interface is formed integrally in or on the surface mounted device. Optionally, the bearing interface comprises (or is) at least one protrusion extending perpendicular (or vertically) from the surface mounted device. "Vertically" refers to a direction perpendicular to the printed circuit board in a mounted state of the surface mounted device. Optionally, the electronic assembly comprises a plurality of, i.e. more than one, surface mounted devices, such as an amount of two, four, eight, nine, 12, 16, 24 or any other number. Optionally, the bearing interface comprises a rim, edge, or the like line-shaped structure formed on an outer horizontal cross-section of the surface mounted device. In other words, such line-shaped structure is partly or fully arranged along the outline of the horizontal cross-section of the surface mounted device. Optionally, the bearing interface comprises a plurality of at least three, preferably four, point-like vertically extending protrusions to provide a horizontally even bearing of the surface mounted device on the printed circuit board. It should be understood that disclosed features of the invention can be combined, 5 even if not explicitly mentioned. In particular, features presented in the context of the method according to the first aspect of the invention can be combined with the electronic assembly of the second aspect of the invention, and vice versa features presented in the context of the electronic assembly of the second aspect of the invention can be 10 combined with the method according to the first aspect of the invention.
Embodiments of the present disclosure substantially eliminate or at least partially address the aforementioned problems in the prior-art, and provides a method of managing heat dissipation for surface mounted devices to provide better cooling for the surface mounted devices and also helps to achieve better thermal-resistance distribution therebetween.
Additional aspects, advantages, features and objects of the present disclosure would be made apparent from the drawings and the detailed description of the illustrative embodiments construed in conjunction 20 with the appended claims that follow.
It will be appreciated that features of the present disclosure are susceptible to being combined in various combinations without departing from the scope of the present disclosure as defined by the appended claims.
Brief description of the drawings
The summary above, as well as the following detailed description of illustrative embodiments, is better understood when read in conjunction with the appended drawings. For the purpose of illustrating the present disclosure, exemplary constructions of the disclosure are shown in the drawings. However, the present disclosure is not limited to specific methods and instrumentalities disclosed herein. Moreover, those skilled in the art will understand that the drawings are not to scale. Wherever possible, like elements have been indicated by identical numbers.
Embodiments of the present disclosure will now be described, by way of example only, with reference to the following diagrams wherein: FIG. 1 is a flowchart of a method of managing heat dissipation for 10 surface mounted devices, in accordance with an embodiment of the present disclosure; and FIG. 2 is a schematic illustration of a method of managing heat dissipation for surface mounted devices, in accordance with an embodiment of the present disclosure.
In the accompanying drawings, an underlined number is employed to represent an item over which the underlined number is positioned or an item to which the underlined number is adjacent. A non-underlined number relates to an item identified by a line linking the non-underlined number to the item. When a number is non-underlined and accompanied by an associated arrow, the non-underlined number is used to identify a general item at which the arrow is pointing.
Detailed description
The following detailed description illustrates embodiments of the 25 present disclosure and ways in which they can be implemented. Although some modes of carrying out the present disclosure have been disclosed, those skilled in the art would recognize that other embodiments for carrying out or practicing the present disclosure are also possible.
FIG. 1 is a flowchart of a method of managing heat dissipation for surface mounted devices, in accordance with an embodiment of the 5 present disclosure. With reference to FIG. 1, there is shown a flowchart of a method 100 that includes steps 102 to 112.
There is provided the method 100 of assembling an electronic assembly 10 with at least one surface mounted device. In an implementation, the heat dissipation enables the heat away from the surface mounted devices to the surrounding environment. It will be appreciated that the heat dissipation may be done using conduction, radiation or convection. Herein, the conduction of heat is done from the surface mount devices to the surrounding. Notably, heat is generated when a current flows through the surface mounted devices. Moreover, the surface mounted devices may include but to limited to an inductor, resistor, transistor, condenser and the like. Thus, the method 100 of managing heat dissipation for surface mounted devices provides an efficient and reliable way of dissipating the heat from the surface mounted devices.
At step 102, the method 100 comprises defining a bearing interface on the surface mounted devices. Notably, the bearing interface is protrusions that protrude from each side of the surface mounted devices. Optionally, the bearing interface may protrude from the center of the surface mounted devices. Optionally, the bearing interface may have a cylindrical, a cuboidal, or any other polygonal shape cross-section. Moreover, the bearing interface is configured to provide an added height to the surface mounted devices that can be arranged over the printed circuit board. Optionally, the bearing interface may be a stopper. The bearing interface provides the surface mounted devices with a surface to prevent the surface mounted devices from being pushed beside the protrusions of the bearing interface. Beneficially, the bearing interface also helps in protecting the surface mounted devices.
At step 104, the method 100 comprises arranging the surface mounted devices on a printed circuit board to form a first assembly. The surface mounted devices are arranged on the printed circuit board using a soldering technique. The soldering is done on the terminals of the surface mounted devices to arrange the surface mounted devices on the printed circuit board and ensure the proper fitting thereof. Typically, the terminals are damped using solder material to create surface protection.
Further, a flux (such as an oxide removal agent) is added to the surfaces to be soldered and heat is applied for a predetermined time to make the flux active. Furthermore, the heat is removed and allows a solder joint to cool down to improve the quality and reliability of the solder joint and form the first assembly.
At step 106, the method 100 comprises applying a thermal interface material to a heatsink to form a second assembly. The thermal interface material dissipates heat produced during the operations of the surface mounted devices and allows an efficient transfer of heat from the first assembly to the second assembly. Notably, the thermal interface material draws heat from the surface mounted devices as quickly as possible and also ensures the elimination of air, as air is a bad conductor of heat, between the surface mounted devices and the heatsink for optimum transfer. The thermal interface material is made of zinc oxide and silicone. Moreover, the heatsink is arranged on the second assembly to increase the heat flow from the surface mount device. Optionally, the heatsink may comprise the plurality of fins to dissipate heat.
At step 108, the method 100 comprises heating the first assembly. The heating is done to remelt the solder material applied between the 30 surface mounted devices and the printed circuit board of the first assembly to increase the surface to allow the solder material to reach the surface mounted devices to improve the tilting thereof. Moreover, the heating is done such that to avoid damage to the surface mounted devices and the printed circuit board. At step 110, the method 100 comprises pressing the second assembly, arranged on the first assembly. It will be appreciated that the pressing is done after remelting the solder material to ensure the proper contact of the thermal interface material with the surface mount devices. Moreover, a homogeneous amount of force is applied, which is less than or equal to the clamping force and is applied at a minimum distance to avoid squeezing out of the solder material when being melted. Furthermore, the bearing interface is configured to prevent the surface mounted devices from being excessively pressed during the pressing of the second assembly over the first assembly and helps in improving the tilting and swimming of the surface mounted devices.
At step 112, the method 100 comprises clamping the second assembly with respect to the first assembly to allow alignment and contact between the thermal interface material and the surface mounted devices forming a thermal pathway therebetween for heat dissipation.
Moreover, clamping enables in reduction of the thickness of the thermal interface material and also provides equalized contact of the surface mount devices. It will be appreciated that the reduced thickness results in lower thermal resistance and lower temperature.
FIG. 2 is a schematic illustration of a method 200 of assembling an electronic assembly 10 with at least one surface mounted device 202, in accordance with an embodiment of the present disclosure. With reference to FIG. 2, there is shown the surface mounted devices 202 having terminals 204A and 204B collectively referred as 204. The surface mounted devices 202 further having a bearing interface 206 protrudes from the surface mounted devices 202 from each side of the surface mounted devices 202. The surface mounted devices 202 is configured to be arranged on a printed circuit board 208. Optionally, arranging the surface mounted devices 202 on the printed circuit board 208 comprises soldering the terminals 204 of the surface mounted devices 202 on the printed circuit board 208. Herein, the soldering the surface mounted devices 202 on the printed circuit board 208 using a solder material 210 to form a first assembly 212. Suitably, the soldering of the terminals 204 of the surface mounted devices 202 is done such that either the bearing interface 206 is in contact with the printed circuit board 208 or the bearing interface 206 is not in contact with the printed circuit board 208 in order to prevent the surface mounted devices 202 to be in contact with the printed circuit board 208. Moreover, applying a thermal interface material 214 to a heatsink 216 to form a second assembly 218. Furthermore, a heater 220 is arranged for heating of the first assembly. The heater 220 is arranged to remelt the solder material 210. Optionally, the heating the first assembly 212 is performed using a local heating technique or an overall heating technique. Also, the heating improves the tilting, swimming of the surface mounted devices 202. In addition, the second assembly 218 is pressed using an amount of force 222 on the first assembly 212 such that the thermal interface material 214 and the surface mounted devices 202 forming a thermal pathway therebetween. It will be appreciated that the bearing interface 206 protrudes outwards such that to prevent the excess pressing of the first assembly 212 by and also enables the second assembly 218 to press the surface mounted devices 202 uniformly to avoid tilting and swimming thereof. Optionally, the pressing the second assembly 218 on the first assembly 212 comprises the amount of force 222 that allows interaction between the thermal interface material 214 and the surface mounted devices 202. In this regard, the thickness of the thermal interface material 214 is reduced to achieve better thermal-resistance distribution or temperature-distribution between the thermal interface material 214 and the surface mounted devices 202.
Furthermore, a clamp 224 is arranged to join the second assembly 218 with respect to the first assembly 212 to allow alignment thereof.
Optionally, the clamping 224 the first assembly 212 and the second assembly 218 comprises an amount of force 222 that allows interaction between the thermal interface material 210 and the surface mounted devices 202, and the thermal interface material 214 and the surface mounted devices 202 and the printed circuit board 208.
Modifications to embodiments of the present disclosure described in the foregoing are possible without departing from the scope of the present disclosure as defined by the accompanying claims. Expressions such as "including", "comprising", "incorporating", "have", "is" used to describe and claim the present disclosure are intended to be construed in a non-exclusive manner, namely allowing for items, components or elements not explicitly described also to be present. Reference to the singular is also to be construed to relate to the plural.

Claims (10)

  1. CLAIMS1. A method (100,200) of assembling an electronic assembly with at least one surface mounted device (202), the method comprising: - defining a bearing interface (206) for the surface mounted devices; - arranging the at least one surface mounted device on a printed circuit board (208) to form a first assembly (212); - soldering the at least one surface mounted device on the printed circuit board; - heating the first assembly; - pressing a second assembly on the first assembly.
  2. 2. The method (100,200) according to claim 1, wherein arranging the surface mounted devices (202) on the printed circuit board (208) comprises clamping the second assembly with respect to the first assembly to allow alignment and contact between the thermal interface material and the surface mounted devices.
  3. 3. The method (100,200) according to claim 1, wherein heating the first assembly (212) is performed using a local heating technique or an 20 overall heating technique.
  4. 4. The method (100,200) according to claim 1, wherein the pressing the second assembly (218) on the first assembly (212) comprises an amount of force that allows interaction between the thermal interface material (214) and the surface mounted devices (202).
  5. 5. The method (100,200) according to claim 1, wherein the clamping the first assembly (212) and the second assembly (218) comprises an amount of force that allows interaction between the thermal interface material (214) and the surface mounted devices (202), and thermal interface material and the surface mounted devices and the printed circuit board (208).
  6. 6. The method (100,200) according to one of the preceding claims, wherein the second assembly (218) is formed by applying a thermal 5 interface material (214) to a heatsink (216).
  7. 7. An electronic assembly (10), comprising a first assembly (212) comprising at least one surface mounted device (202) and a printed circuit board (208), wherein the at least one 10 surface mounted device (202) is soldered to the printed circuit board (208), a second assembly (218) comprising a heatsink (216) and a thermal interface material (214), a bearing interface (206) configured to arrange the at least one 15 surface mounted device (202) in a defined distance from the printed circuit board (208).
  8. 8. The electronic assembly (10) according to claim 7, wherein the bearing interface (206) is arranged on the surface mounted device (202).
  9. 9. The electronic assembly (10) according to claim 8, wherein the bearing interface (206) comprises at least one protrusion (207) extending perpendicular from the surface mounted device (202).
  10. 10. The electronic assembly (10) according to claim 8 or 9, wherein the electronic assembly (10) was assembled according to the method 25 according to one of claims 1 to 7.
GB2215437.1A 2022-10-19 2022-10-19 Method of managing heat dissipation for surface mounted devices Pending GB2623543A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2215437.1A GB2623543A (en) 2022-10-19 2022-10-19 Method of managing heat dissipation for surface mounted devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2215437.1A GB2623543A (en) 2022-10-19 2022-10-19 Method of managing heat dissipation for surface mounted devices

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GB202215437D0 GB202215437D0 (en) 2022-11-30
GB2623543A true GB2623543A (en) 2024-04-24

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020043711A1 (en) * 2000-06-08 2002-04-18 Salman Akram Stereolithographic method and apparatus for fabricating stabilizers for flip-chip type semiconductor devices and resulting structures
US20030038157A1 (en) * 2001-07-25 2003-02-27 Uta Gebauer Electronic component with a semiconductor chip and method for producing the electronic component
US20050040520A1 (en) * 2003-08-18 2005-02-24 Tong-Hong Wang Heat dissipation apparatus for package device
US20150049450A1 (en) * 2013-08-19 2015-02-19 Fujitsu Limited Electronic device and method of manufacturing electronic device
US10117335B1 (en) * 2017-05-25 2018-10-30 Mitsubishi Electric Corporation Power module
US20200203315A1 (en) * 2018-12-19 2020-06-25 Nanya Technology Corporation Semiconductor structure
US20210202358A1 (en) * 2019-12-26 2021-07-01 Taiwan Semiconductor Manufacturing Co., Ltd. Fan-Out Packages and Methods of Forming the Same
US20210202329A1 (en) * 2019-12-31 2021-07-01 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package and method for making the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020043711A1 (en) * 2000-06-08 2002-04-18 Salman Akram Stereolithographic method and apparatus for fabricating stabilizers for flip-chip type semiconductor devices and resulting structures
US20030038157A1 (en) * 2001-07-25 2003-02-27 Uta Gebauer Electronic component with a semiconductor chip and method for producing the electronic component
US20050040520A1 (en) * 2003-08-18 2005-02-24 Tong-Hong Wang Heat dissipation apparatus for package device
US20150049450A1 (en) * 2013-08-19 2015-02-19 Fujitsu Limited Electronic device and method of manufacturing electronic device
US10117335B1 (en) * 2017-05-25 2018-10-30 Mitsubishi Electric Corporation Power module
US20200203315A1 (en) * 2018-12-19 2020-06-25 Nanya Technology Corporation Semiconductor structure
US20210202358A1 (en) * 2019-12-26 2021-07-01 Taiwan Semiconductor Manufacturing Co., Ltd. Fan-Out Packages and Methods of Forming the Same
US20210202329A1 (en) * 2019-12-31 2021-07-01 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package and method for making the same

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