GB2616722A

GB2616722A - Devices comprising an M.2 module and a heat sink and method of assembly

Info

Publication number: GB2616722A
Application number: GB2301538.1A
Authority: GB
Inventors: Neukam Wilhelm
Original assignee: Fujitsu Client Computing Ltd
Current assignee: Fujitsu Client Computing Ltd
Priority date: 2022-02-08
Filing date: 2023-02-03
Publication date: 2023-09-20
Also published as: DE102022102886A1; DE102022102886B4; JP2023115916A; FR3132610A1

Abstract

Multiple embodiments are provided for a heatsink assembly fixed to a M.2 module 1 that may comprise a SSD card. Figure 1 shows a, preferably unitary, heat dissipating device 2 comprising a cooling plate portion 2 with fins 2A (fig 3 shows variations) and side walls bent downwards and given projections 2c that act to latch onto the long edges 1c of the module. A thermal interface 2b may be provided between the plate portion 2 and components 1e of the module. Figure 4 shows an alternative where a separate heatsink (2) and frame portion (2d) are assembled such that fins (2a) project though an aperture in the frame. Both embodiments can be fixed (clipped) onto a M.2 module that is already connected and mounted to a computing device (motherboard) and a method of doing so is claimed. A third embodiment is shown in figures 5 to 7, where two part hinged frame is provided that carries at least one, and preferably two heatsinks that can contact both faces of the module. To attach this assembly, the frame is arranged to move the hinge to enclose around the module (in a clam-shell manner) and lock the frames closed together with clips (projections 2c locating in slotted tabs 2f ) located on the opposite edges to the hinge. The heatsink assembly provides fast tool-less mounting.

Description

Devices comprising an M.2 module and a heat sink and method of assembly The present invention relates to a device comprising an M.2 5 module and a heat sink, and an associated assembly method.

M.2, also known as Next Generation Form Factor (NGFF), is a specification for internal computer expansion cards and corresponding ports.

M.2 modules are usually rectangular with a connector on one side and a semicircular recess for fastening with a screw in the center of the opposite side.

An M.2 module is typically plugged into the matching port on a computer system board and fixed there with the screw. Components can be attached on both sides of the module. The module type determines whether components can be attached on one or both sides and how high the components can be on each side.

The M.2 specification was designed to replace mSATA. Due to the smaller and more flexible dimensions combined with extended features, M.2 has advantageous characteristics compared to mSATA. Thus, M.2 is also better suited for connecting SSDs than mSATA, for example.

The doubling of the transfer speed of upcoming SSDs with PCI Express (PCIe) 5.0 is accompanied by a significantly higher power consumption. This increases almost proportionally with the transfer speed, so that high-end SSDs with PCIe 5.0 and 14 to 15 GByte/s come to around 14 watts of power -2 -dissipation. With a further doubling, the fastest SSDs approach a power dissipation of around 30 watts.

Existing M.2 modules emit some of this waste heat via the motherboard: On the one hand via the plug-in connection and on the other hand via the screw typically provided to fix the module. However, this heat dissipation is not enough to sufficiently cool the modules at increasing transfer speeds.

It is therefore an object of the present invention to at least partially solve the problem described above and to provide efficient cooling for an M.2 module.

In one aspect, the present application relates to a device 15 comprising an M.2 module and a heat sink. The cooling plate is for cooling the M.2 module.

The cooling plate has an unbent and bent sections, the bent sections having projections through which the cooling plate 20 is latched to the M.2 module. The unbent section forms a planar center section between the bent sections at its edges.

The cooling plate can be part of a heat sink that includes other components in addition to the cooling plate. A multi-part heat sink can, for example, comprise several cooling plates. The heat transfer from the M.2 module to the cooling plate and further to the environment can also be optimized by different components of a heat sink.

In a preferred embodiment, the heat sink is of one-piece design and comprises only the cooling plate. Such a heat sink is simple and inexpensive to manufacture. -3 -

The cooling plate is preferably made in one piece. The cooling plate is preferably made of a metallic material. In a preferred embodiment, the thermal conductivity of the cooling plate is similar to the thermal conductivity of the M.2 module, so that heat transfer from the M.2 module to the cooling plate is favored. The thermal conductivity of the M.2 module is understood here as the thermal conductivity of a substrate body of the M.2 module.

In further embodiments, a thermally conductive layer may be applied to the heat sink.

The cooling plate preferably has a substantially rectangular shape. In particular, the unbent section of the cooling plate has a rectangular shape. The rectangular shaped first section has two short sides and two long sides. Two bent sections are provided along the longitudinal sides.

Preferably, in one embodiment, two bent sections are provided 20 along the longitudinal sides of the unbent section.

In a preferred embodiment, the bent sections also have the shape of rectangles, but are bent at right angles compared to the unbent section, i.e. are perpendicular to the unbent section.

In further embodiments, the bend of the bent sections may also have a different shape. For example, the bent sections may also have multiple bending edges or have the shape of a cylinder section.

The M.2 module comprises an essentially rectangular plate. The thickness of the plate is significantly less than the -4 -length and width of the rectangular shaped plate. The short sides of the rectangular shaped plate are referred to as the ends of the M.2 module. The extension along the short sides will be referred to as the width and the extension along the long sides will be referred to as the length in the following. The M.2 module has two substantially rectangular shaped surfaces.

The M.2 module has a semicircular recess at a first end for fastening with a screw. The semicircular recess is preferably arranged centrally on one of the narrow sides, which are referred to here as short sides. At a second end of the M.2 module, which is opposite the first end with the semicircular recess, a plug connection is pronounced, for example for connection to the mainboard of a computer.

Preferably, the heat sink or the cooling plate of the heat sink lies flat on a surface of the M.2 module. In particular, the cooling plate preferably lies directly on a surface of 20 the M.2 module on which electronic components are provided.

In one embodiment, the unbent section has cooling fins. The cooling fins serve to increase the surface area of the cooling plate. The cooling fins may have shapes suitable for increasing the surface area. Preferably, the cooling fins are provided on a surface of the cooling plate that faces away from the M.2 module. In one embodiment, a thermally conductive layer is provided on the side of the cooling plate that rests on the M.2 module, and fins are provided on the opposite side of the cooling plate.

A plurality of fins can be arranged in columns and rows on the cooling plate. To form the fins, individual sections can -5 -be bent out of the cooling plate, for example, or the cooling fins comprise separate components which are fixed to the cooling plate, preferably by material bonding, for example by welding.

According to one embodiment, the unbent section of the cooling plate covers an upper surface of the M.2 module. A lower surface of the M.2 module faces towards the computer component on which the M.2 module is arranged, for example the mainboard of a computer. Thus, a large heat transfer surface is created between the M.2 module and the cooling plate so that a comparatively high amount of heat can be dissipated.

In one embodiment, one section along each of the two long sides of the rectangular cooling plate is bent vertically to form the bent sections so that the projections lock with the M.2 module. Latching lugs can be provided on the bent sections of the cooling plate for this purpose, which latch under the lower surface of the M.2 module, which is arranged opposite to the upper surface of the module.

A plurality of latching lugs may be provided on each of the bent sections. Alternatively, a single long latching lug can also be provided. The M.2 module latches between the unborn section and the latching lugs of the bent sections of the cooling plate.

In one embodiment, a thermally conductive layer is arranged on a surface of the cooling plate that covers the upper surface of the M.2 module and rests on the upper surface of the M.2 module. The heat-conducting layer is preferably applied to the surface of the cooling plate that lies flat on -6 -the M.2 module. The thermally conductive layer serves to improve the heat transfer from the M.2 module to the cooling plate. The thermal conductivity of the thermally conductive layer is preferably similar to the thermal conductivity of the M.2 module and preferably further similar to the thermal conductivity of the cooling plate. Thus, the heat transfer from the M.2 module to the cooling plate can be improved.

According to a further aspect, the device comprises an M.2 module and a heat sink comprising a frame lockable to the M.2 module and a cooling plate inserted into the frame. The frame has latching lugs by means of which the frame can be latched to the heat sink. In other respects, the device according to the second aspect can be configured in accordance with embodiments of the device according to the first aspect.

In particular, the heat sink includes a frame and an unbent cooling sheet, the frame having an unbent section and bent sections, the bent sections having projections that are latching lugs by which the heat sink is latched to the M.2 module, and the unbent section securing the cooling sheet between the frame and the M.2 module.

The unbent cooling plate can then have cooling fins.

Preferably, the unbent cooling plate covers an upper surface of the M.2 module.

Preferably, the unbent cooling plate is rectangular and inserted into a rectangular recess of the unbent section of the frame. -7 -

Further, a section along both long sides of the unbent section of the frame may be bent perpendicularly to form the bent sections so that the protrusions interlock with the M.2 module.

In one embodiment, the frame can be made of plastic to save costs. The frame can, for example, be manufactured additively and thus be precisely adapted to the shape of the M.2 module.

According to another aspect, the device comprises an M.2 module, two frames connected by a hinge, and at least a first cooling plate inserted into one of the two frames.

In a closed state, the M.2 module is then embedded between 15 the two frames. The first cooling plate covers the upper surface of the M.2 module. The two frames are fixed to each other via a snap lock on one side, where there is no hinge.

In other respects, the device according to the third aspect 20 may be configured according to embodiments of the devices according to the first and second aspects.

In one embodiment, the frames can again be made of plastic to save costs. The frame can, for example, be manufactured additively and thus be precisely adapted to the shape of the M.2 module. A frame made of plastic preferably has a lower thermal conductivity than the cooling plates, so that the waste heat of the M.2 module is dissipated specifically via the cooling plates.

Preferably, the device further comprises a second cooling plate, wherein the two cooling plates are inserted into the two frames. -8 -

In a closed state, the M.2 module is then embedded between the first and second cooling plates, with the first cooling plate covering an upper surface of the M.2 module and the second cooling plate covering a lower surface of the M.2 module. Such an arrangement is particularly advantageous when electrical components requiring cooling are provided on both surfaces of the M.2 module. When the M.2 module has high power, for example due to high transfer speeds, two cooling plates can provide a higher cooling capacity than one cooling plate.

At least one of the cooling plates may have cooling fins in one embodiment. Preferably, both cooling plates have cooling fins. The cooling fins of the two cooling plates can be 15 designed differently.

The two cooling plates can furthermore be designed differently and comprise different materials. The cooling plate arranged on the lower surface of the M.2 module preferably has narrower fins than the other cooling plate. This allows the cooling plate to be located between the M.2 module and the computer component on which the module is placed.

The two cooling plates that rest on the two different surfaces of the M.2 module can cool the M.2 module from two opposite sides.

In one embodiment, a surface of the first or second cooling 30 plate that covers a surface of the M.2 module has a thermally conductive layer disposed thereon. -9 -

The thermally conductive layer can be designed analogously to the preceding embodiments. The thermally conductive layer preferably has a similar thermal conductivity to the M.2 module.

In various embodiments, for example, a thermally conductive layer may be applied to only one of the cooling plates, or two different types of thermally conductive layers may be applied to the two cooling plates, which have different thermal conductivities, so that, for example, more heat is dissipated from the M.2 module to one of the cooling plates than to the other cooling plate, thus promoting directional heat dissipation.

According to a further aspect, the present invention relates to a method for fixing a cooling plate or heat sink to an M.2 module. In particular, the present invention relates to a method for fixing one of the cooling plates or heat sinks according to the aforementioned aspects to an M.2 module.

In one step of the method, a computer component, for example a motherboard, is provided, to which a provided M.2 module is attached in a further step.

After being attached, the M.2 module is preferably plugged into a slot provided for this purpose on the mainboard via a plug connection at one of the short ends of the computer component. As an alternative to the mainboard, the M.2 module can also be attached to any other computer component that has a slot for an M.2 module. At its other short end, opposite the plug-in connection, the M.2 module typically has a semicircular recess where it can be fixed to the corresponding computer component, for example the mainboard, with a screw.

-10 -In the fixed state, a lower surface of the M.2 module faces the mainboard and an upper surface of the M.2 module faces away from the mainboard. The slot is preferably arranged so that a free gap remains between the lower surface of the M.2 module and a surface of the computer component, for example the mainboard.

A further step comprises providing a rectangular cooling plate having bent sections along both longitudinal sides, the bent sections each having projections. The cooling plate may be according to the embodiments in the aspects previously mentioned. In particular, the cooling plate may be part of a heat sink comprising various components.

Preferably, the heat sink is made in one piece and includes the heat sink plate.

With the help of the projections, the cooling plate can be attached to the M.2 module in a further step.

In a further step, the cooling plate is placed on the M.2 module, with the cooling plate covering the upper surface of the M.2 module and with the projections on the bent sections of the cooling plate engaging between the lower surface of the M.2 module and the mainboard so that the cooling plate is fixed to the M.2 module. The projections can be designed as latching lugs for this purpose. The M.2 module is clamped between the unbent section of the cooling plate and the projections on the bent sections of the cooling plate and the cooling plate is thus fixed to the M.2 module.

Preferably, the aforementioned steps are carried out in the sequence mentioned. Particularly preferably, the steps are carried out directly one after the other.

In a further method according to the invention, the M.2 module is fixed to the cooling plate before it is attached to the computer component, for example the mainboard. For this purpose, the cooling plate is fixed to the M.2 module as described above. Only then is the M.2 module fixed to the computer component.

The same cooling plate can preferably be attached to the M.2 module both before and after fixing the M.2 module to the computer component. The cooling plate or the heat sink of which the cooling plate is a part is dimensioned for this purpose in such a way that devices on the M.2 module which are necessary for fixing it to the computer component are not covered by the cooling plate or heat sink. These include, for example, the plug connection and the semicircular recess at the two short ends of the M.2 module.

Another aspect of the invention further relates to a method of attaching a heat sink according to the second aspect to the M.2 module.

The method of fixing a cooling plate to an M.2 module includes at least the following steps and may otherwise be modified as the methods described before and after: - Provide a computer component and the M.2 module, 30 -Mounting the M.2 module on the computer component with a lower surface of the M.2 module facing the computer component, - Providing a heat sink comprising a frame and a separate cooling sheet, the frame having bent sections along both -12 -longitudinal sides, the bent sections each having projections, -Placing the cooling plate onto the M.2 module, with the cooling plate covering an upper surface of the M.2 module, -Placing the frame over the cooling plate on the upper surface, with the projections on the bent sections of the frame engaging between the lower surface of the M.2 module and the computer component so that the cooling plate is fixed between the frame and the M.2 module.

A further aspect of the invention further relates to a method for attaching a heat sink according to the third aspect to the M.2 module. For this purpose, the following steps are preferably carried out in the order indicated and more preferably directly after each other. Unless otherwise indicated, the following method has the same features as the previously described method.

An M.2 module is provided. The M.2 module may already be attached to a computer component or may be present outside of a computer.

A heat sink according to the third aspect, comprising two frames connected by a hinge and at least one cooling plate 25 inserted therein, is provided.

The heat sink is in the open state, i.e. the two frames are pivoted along the hinge so that they are adjacent to each other on one long side. One or two cooling plates can be inserted into the two frames or replaced by alternative cooling plates or removed from the frames. Before closing the heat sink, at least one cooling plate must be inserted into one of the frames.

-13 -In an optional embodiment, the inserted cooling plate is fixed by locking lugs inside one of the frames. When inserting, optional cooling fins of the cooling plate face outward and an optional heat-conducting layer of the cooling plate faces inward.

The M.2 module, which is sized so that it can be embedded in the frame without slipping, is placed in the frames on one of the cooling plates. The frames are then pivoted along the hinge and transferred to the closed state. The two frames then rest on top of each other and are connected and fixed to each other on one long side via the hinge and on the other long side via latches provided for this purpose.

In the following, embodiments of the present invention are explained in more detail with reference to figures. The invention is not limited to the described embodiments and figures. The features described below are combined by way of example and may also be present in other combinations.

The figures show the following: Figure 1 shows an M.2 module and a first embodiment of a heat sink in the unassembled state.

Figure 2 shows the M.2 module and the first embodiment of the heat sink in the installed state on a computer component.

Figure 3 shows various designs of cooling plates with 30 different fin geometries.

Figure 4 shows the M.2 module and a second embodiment of a heat sink with a frame and a cooling plate.

-14 -Figure 5 shows a third embodiment of a heat sink with two frames connected by a hinge and two cooling plates.

Figure 6 shows the M.2 module and the third embodiment of the 5 heat sink with two frames and two cooling plates in an open state.

Figure 7 shows the M.2 module and the third embodiment of the heat sink with two frames and two cooling plates in a closed state.

Figure 1 shows a first embodiment example of the M.2 module 1 according to the invention with heat sink before assembly. Figure 2 shows the same embodiment after assembly.

The M.2 module 1 comprises a substantially rectangular plate. The thickness of the plate is significantly less than the length and width of the rectangular shaped plate. The short sides of the rectangular shaped plate are referred to as the ends 1D of the M.2 module 1. The extent along the short sides is hereinafter referred to as the width, and the extent along the long sides is referred to as the length. The M.2 module 1 has two substantially rectangular shaped surfaces.

The M.2 module 1 has a semicircular recess at a first end 1D for fastening with a screw 5. The semicircular recess is preferably arranged centrally on one of the short sides. At a second end 1D of the M.2 module, which is opposite the first end 1D with the semicircular recess, a plug connection is pronounced, for example for connection to the mainboard of a computer.

-15 -The M.2 module 1 may include a plurality of electrical and electronic components 1E substantially disposed on an upper surface 1A of the rectangular plate. On the surface of the rectangular plate opposite to the upper surface 1A, hereinafter referred to as the lower surface 1B, no components 1E are arranged in the present embodiment. In further embodiments, components 1E may also be arranged on the lower surface 1B.

Figure 1 further shows a first embodiment example of a heat sink for the M.2 module 1. The heat sink is formed as a one-piece cooling plate 2, which is preferably formed from a metallic sheet. Alternatively, the heat sink may be formed of any material that provides sufficient thermal conductivity and mechanical stability. Such a one-piece heat sink can be easily manufactured.

The cooling plate 2 has a first rectangular shaped section whose dimensions slightly exceed the dimensions of the M.2 20 module 1 in the width direction.

Along each of the two long sides of the first section of the cooling plate 2, second sections of the cooling plate 2 are pronounced. The two second sections are preferably perpendicular to the first section of the cooling plate. The second sections each have the same length but a shorter width than the first section of the cooling plate 2. The two second sections are parallel to each other and are aligned in the direction of the M.2 module 1, so that the cooling plate 2 can be easily placed on the M.2 module 1.

The first section of the cooling plate 2, when assembled (cf. Figure 2), then covers the upper surface lA of the M.2 module -16 - 1 with the components 1E applied thereto, and the second sections of the cooling plate 2 cover the long sides of the M.2 module 1 and extend to the side of the lower surface 1B of the M.2 module.

The side of the heat sink that rests on the M.2 module 1 is referred to as the inner side of the heat sink in the following. The opposite side of the heat sink is referred to as the outside of the heat sink.

In the present example, a plurality of projections 2C are formed on the inner side of each of the two second sections, so that the M.2 module 1 is engaged between the first section of the cooling plate 2 and the projections 2C on the second sections of the cooling plate 2 in the installed state.

In the embodiment example, the surface of the cooling plate 2 has cooling fins 2A to improve heat dissipation. The cooling fins 2A can have different shapes and serve to increase the surface area of the cooling surface. The cooling fins 2A are preferably shaped to improve heat transfer between the cooling plate 2 and its surroundings. The cooling fins 2A are preferably arranged in rows and columns on the surface of the cooling plate 2. In particular, the cooling fins 2A are configured in the form of three-dimensionally configured projections. In particular, cutouts can also be cut out of the cooling plate 2 and bent out to form the cooling fins 2A.

Alternatively, the cooling fins 2A are made of additional components which are then joined to the cooling plate 2, for example by welding. Various possible shapes for cooling fins 2A are shown in Figure 3. However, the invention is not limited to cooling plates with the cooling fins 2A shown.

-17 -A thermally conductive layer 2B may additionally be applied to the inner surface of the first section to improve heat transfer from the M.2 module 1 to the heat sink. In the installed state, the thermally conductive layer 2B rests directly on the upper surface lA of the M.2 module 1 and the electronic components 1E placed thereon. The thermally conductive layer 2B preferably comprises a material that has both a similar thermal conductivity as the M.2 module 1 and, more preferably, a similar thermal conductivity as the cooling plate 2, so that the heat transfer between the M.2 module 1 and the cooling plate 2 is further improved.

The heat-conducting layer 2B essentially transfers the heat absorbed by the M.2 module 1 to the cooling plate 2. The thermally conductive layer 2B may also comprise multiple layers, including layers of different materials. The thermally conductive layer 2B preferably comprises a silicone material. The silicone material is preferably a silicone sheet made of filled silicone. Particularly preferably, the thermally conductive layer comprises such filled silicone sheets.

Figure 2 shows the M.2 module 1 and the heat sink in the installed state on a computer component 3. The second end 1D of the M.2 module 1 computer component is plugged into an exemplary slot 4 of a 3. The slot 4 may be, for example, the slot 4 of the main of the M.2 module 1 component 3 in the board of a computer. The lower surface usually lies flat on the corresponding 1B computer housing, for example on the mainboard.

For fastening in the computer, the M.2 module 1 is already partially fixed at its second end 1D by the plug-in -18 -connection and additionally fixed at its first end 1D by a screw 5, so that the M.2 module 1 can no longer be moved. The plug-in connection is generally arranged in such a way that a gap remains between the M.2 module 1 and the surface of the computer component 3. The screw 5 is arranged in the semicircular recess at the first end 1D of the m.2 module 1.

The heat sink according to the invention described and already shown in Figure 1 can be easily placed on the M.2 module 1 without loosening or moving the M.2 module 1, wherein the inner side of the first section with the optional heat conducting layer 2B, covers the upper surface 1A of the M.2 module 1 and wherein the second sections of the heat sink cover the longitudinal sides 10 of the M.2 module 1.

The M.2 module is secured to the computer by projections 2C on the second sections that engage between the lower surface 1B of the M.2 module 1 and the underlying computer component 3, such as the surface of a motherboard.

Due to the usually correspondingly arranged plug connection, the M.2 module 1 is usually arranged on the surface of a computer component 3 in such a way that a gap exists between the lower surface 1B of the M.2 module 1 and the surface of the computer component 3. In this gap, the projections 2C of the heat sink can be easily engaged. Alternatively or additionally, in further embodiment examples, special recesses may also be provided on the longitudinal sides 10 of the M.2 module 1 in which the projections 2C of the heat sink are latched.

The projections 2C of the heat sink may be configured in various ways. For example, a plurality of individual -19 -projections 2C may be pronounced, such as two, four, eight, or any other suitable number along each of the two second sections, or a long, continuous second projection 2C may be pronounced.

The heat sink of the current embodiment has the advantage that it can also be placed on the M.2 module 1 already installed in the computer and can thus be easily retrofitted. Furthermore, the heat sink is designed in such a way that it can also be placed outside the computer housing on the M.2 module 1 that is not installed and the latter can then be installed in the computer housing. This facilitates the installation of the heat sink. The heat sink does not block slot 4 or the semicircular recess where screw 5 is placed.

For this purpose, the heat sink is preferably designed shorter along the long side of the M.2 module 1 than the M.2 module 1.

Figure 4 shows a second embodiment example of an M.2 module 1 20 with heat sink. The M.2 module 1 corresponds to the M.2 module 1 of the first embodiment.

According to the second embodiment example, the heat sink is designed in two parts. The heat sink comprises a frame whose shape corresponds essentially to the heat sink of the first embodiment. In a first section of the frame, a rectangular recess is provided into which a cooling plate 2 can be inserted. Further, the frame 2D has second portions which are perpendicular to the first portion of the frame and which substantially correspond to the second portions of the cooling plate 2 in the first embodiment of the heat sink.

-20 -The frame 2D is rectangular and has slightly wider dimensions than the M.2 module 1. The frame 2D preferably comprises at least four latching lugs 2C, two on each longitudinal side, so that the M.2 module 1 and the frame 2D can be latched in analogy to the first embodiment example.

The cooling plate 2 is inserted into the frame 2D before the frame is locked 2F to the M.2 module 1. The cooling plate 2 preferably has fins 2A on its outer surface. A thermally conductive layer 2B may in turn be arranged on the inner surface of the cooling plate 2.

By manufacturing the frame 2D and the cooling plate separately, these two components can each be optimized. For example, an individually manufactured cooling plate 2 can have a more elaborate and optimized fin shape, which enables a higher cooling capacity. Furthermore, the cooling plate 2 and the frame 2D may be made of different materials so that directional heat dissipation is enabled via the cooling plate 2 on the upper surface lA of the M.2 module 1 rather than via the side panels and the frame 2D. The frame 2D is then made of a less thermally conductive material than the cooling plates.

The frame 2D, in turn, can be optimized with respect to its shape so that the mechanical stability of the latching 2F between the frame 2D and the M.2 module 1 is optimized. The frame 2D can have any number of projections 2C of different sizes and latching lugs 2C or even movable hinges, with the aid of which the frame 2D can be fixed to the M.2 module 1.

The heat sink according to the second embodiment is also preferably dimensioned in such a way that it has a shorter -21 -longitudinal side 10 than the M.2 module 1 and the M.2 module 1 can thus already be latched to the heat sink before it is installed in the computer. Alternatively, the heat sink can also be retrofitted without having to remove the M.2 module 1 from the computer, since the latching 2F between the heat sink and the M.2 module 1 uses the already existing gap between the inserted M.2 module 1 and the computer component 3, analogously to the first embodiment example.

Figures 5 to 7 show a further embodiment example. In the present third embodiment example, the heat sink comprises two frames shaped substantially analogously to the second embodiment example and connected along their longitudinal sides 10 by a hinge 2E. A cooling plate 2 can be inserted into each of the two frames 2D, analogously to the second embodiment example.

The same cooling plate 2 can be used in each case, or different cooling plates can be used. The cooling plates can be of different shapes, comprise different materials and have different fin 2A shapes. The cooling plates are used in each case so that the cooling fins 2A face outward and optional, heat-conducting layers 2B face inward.

In contrast to the first and second embodiment examples, the frame 2D here does not have latching lugs 2C for latching 2F to the M.2 module 1. Rather, one longitudinal side 1C of the frames 2D has the described hinge 2E along which the two individual frames 2D are pivotally connected. The other side long side 10 of each of the two frames 2D have complementary latching lugs 2C and latches 2F.

-22 -The two frames 2D can be folded together by pivoting at the hinge 2E so that the two inner surfaces of the cooling plates inserted in the frames 2D face each other and each face inwards. On the long sides, which do not have a hinge 2E, the two frames 2D can then be latched via the latching lugs 2C and latches 2F. Figure 7 illustrates this closed state of the heat sink of the third embodiment example.

The M.2 module 1 can be placed on an inner surface of one of the cooling plates in the open state and the heat sink can then be closed. The cavity in the heat sink in the closed state between the inner surfaces of the two cooling plates is dimensioned so that the M.2 module 1 is embedded and fixed in the heat sink in the closed state. The heat sink then encloses the M.2 module 1 in the closed state along its rectangular surfaces and its longitudinal sides 10. The two ends 1D, i.e. the short sides, of the M.2 module 1, on the other hand, protrude out of the heat sink, so that the M.2 module 1 can still be installed in the computer after being embedded in the heat sink, analogously to the previous embodiment examples.

In a preferred embodiment, the cooling fins 2A of the cooling plate that rests on the lower surface 1B of the M.2 module 1 are of smaller size than the cooling fins 2A on the opposite surface, so that the M.2 module 1 can be fixed in the computer in the usual configuration as in the previous embodiment examples. Here, the existing gap between the M.2 module 1 and the computer component 3 on which the module is mounted is again utilized.

In particular, the frame 2D with the cooling plate 2 is arranged in the gap, which cools the lower surface 1B of the -23 -M.2 module 1. This is particularly useful if electronic components 1E that need to be cooled are arranged on the lower surface 1B of the M.2 module 1.

In another embodiment, for example, when no other components lE are arranged on the lower surface lB of the M.2 module 1 and the cooling capacity of a cooling plate is sufficient, no second cooling plate 2 is provided on the lower surface lB of the M.2 module 1. Only in the frame 2D on the side of the upper surface lA of the M.2 module 1 is a cooling plate 2 then inserted.

In the second and third embodiments, optional latching lugs are provided on the inside of the frame to secure the cooling 15 plates in the inserted condition.

-24 -Reference sign 1 M.2 module lA upper surface of the M.2 module 1B lower surface of the M.2 module 10 long sides of the M.2 module 1D short ends of the M.2 module lE electrical components 2 cooling plate 2A cooling fins 2B thermally conductive layer 2C projection/ latching lug 2D frame 2E hinge 2F latching 3 computer component 4 slot screw

Claims

-25 -Claims 1. Device comprising an M.2 module (1) and a heat sink comprising a frame (2D) and an unbent cooling plate (2), wherein the frame (2D) has an unbent and bent sections, the bent sections having projections (2C) being latching lugs by which the heat sink is locked to the M.2 module (1), and wherein the unbent section fixes the cooling sheet (2) between the frame (2D) and the M.2 module (1).
2. Device according to claim 1, wherein the unbent cooling plate (2) comprises cooling fins (2A).
3. Device according to any one of claims 1 or 2, wherein the 15 unbent cooling plate (2) covers an upper surface (1A) of the M.2 module (1).
4. Device according to claim 3, wherein the unbent cooling plate (2) is rectangular and is inserted into a rectangular recess of the unbent section of the frame (2D).
5. Device according to claim 3 or 4, wherein a portion along each of the two longitudinal sides of the unbent section frame (2D) is bent perpendicularly to form the bent sections so that the projections (2C) lock with the M.2 module (1).
6. Device according to any one of claims 3 to 5, wherein on a surface of the cooling plate (2) covering the upper surface (1A) of the M.2 module (1) a thermally conductive layer (2B) is arranged to rest on the upper surface (1A) of the M.2 module (1).
-26 - 7. Device comprising an M.2 module (1), two frames (2D) connected by a hinge (2E), and at least a first cooling plate (2) inserted into one of the two frames (2D), wherein in a closed state the M.2 module (1) is embedded between the two frames (2D), the first cooling plate (2) covers an upper surface (1A) of the M.2 module (1), and the two frames (2D) are fixed to each other via a snap lock (2F) on a side where there is no hinge (2E).
8. Device according to claim 7 comprising a second cooling plate (2), wherein the two cooling plates (2) are inserted into the two frames (2D), wherein in a closed state the M.2 module (1) is embedded between the first and second cooling plates (2), wherein the second cooling plate (2) covers a lower surface of the M.2 module (1).
9. Device according to any one of claims 7 or 8, wherein at least one of the cooling plates (2) comprises cooling fins (2A).
10. Device according to any one of claims 7 to 9, wherein on a surface of the first or second cooling plate (2) covering a surface of the M.2 module (1), a thermally conductive layer (2B) is applied which rests on the surface of the M.2 module (1).
11. Method of fixing a cooling plate (2) to an M.2 module (1), comprising the steps: -Providing a computer component (3) and the M.2 module (1), -Mounting the M.2 module (1) on the computer component (3) with a lower surface (1B) of the M.2 module (1) facing the computer component (3), -27 - -Providing a heat sink comprising a frame (2D) and a separate cooling sheet (2), the frame having bent sections along both longitudinal sides, the bent sections each having projections (2C), -Placing the cooling plate (2) onto the M.2 module (1), with the cooling plate covering an upper surface (1A) of the M.2 module (1), -Placing the frame (2B) over the cooling plate (2) on the upper surface (1A), with the projections (20) on the bent sections of the frame (2) engaging between the lower surface (1B) of the M.2 module (1) and the computer component (3) so that the cooling plate (2) is fixed between the frame and the M.2 module (1).