GB2599045B - Prevention of dripping of material for material injection - Google Patents

Prevention of dripping of material for material injection Download PDF

Info

Publication number
GB2599045B
GB2599045B GB2117677.1A GB202117677A GB2599045B GB 2599045 B GB2599045 B GB 2599045B GB 202117677 A GB202117677 A GB 202117677A GB 2599045 B GB2599045 B GB 2599045B
Authority
GB
United Kingdom
Prior art keywords
dripping
prevention
injection
material injection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB2117677.1A
Other versions
GB202117677D0 (en
GB2599045A (en
Inventor
Aoki Toyohiro
Nakamura Eiji
Hisada Takashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB202117677D0 publication Critical patent/GB202117677D0/en
Publication of GB2599045A publication Critical patent/GB2599045A/en
Application granted granted Critical
Publication of GB2599045B publication Critical patent/GB2599045B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating Apparatus (AREA)
GB2117677.1A 2019-05-13 2020-05-04 Prevention of dripping of material for material injection Active GB2599045B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/410,651 US11298769B2 (en) 2019-05-13 2019-05-13 Prevention of dripping of material for material injection
PCT/IB2020/054214 WO2020229938A1 (en) 2019-05-13 2020-05-04 Prevention of dripping of material for material injection

Publications (3)

Publication Number Publication Date
GB202117677D0 GB202117677D0 (en) 2022-01-19
GB2599045A GB2599045A (en) 2022-03-23
GB2599045B true GB2599045B (en) 2023-06-14

Family

ID=73231028

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2117677.1A Active GB2599045B (en) 2019-05-13 2020-05-04 Prevention of dripping of material for material injection

Country Status (6)

Country Link
US (3) US11298769B2 (en)
JP (1) JP7455145B2 (en)
CN (1) CN113767457A (en)
DE (1) DE112020002366T5 (en)
GB (1) GB2599045B (en)
WO (1) WO2020229938A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11298769B2 (en) * 2019-05-13 2022-04-12 International Business Machines Corporation Prevention of dripping of material for material injection
US11862482B2 (en) * 2021-03-11 2024-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor substrate bonding tool and methods of operation
US11622452B2 (en) 2021-08-24 2023-04-04 Robert Bosch Gmbh Method of manufacturing a conductive track on a board via stencil printing
US11718087B2 (en) 2021-08-24 2023-08-08 Robert Bosch Gmbh Squeegee for stencil printing
US20230064682A1 (en) * 2021-08-24 2023-03-02 Robert Bosch Gmbh Stencil for stencil printing process
US20230154887A1 (en) * 2021-11-18 2023-05-18 International Business Machines Corporation Injection molded solder head with improved sealing performance

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080020451A1 (en) * 2006-07-24 2008-01-24 Fujitsu Limited Material sucking or discharging apparatus and method
KR20090078278A (en) * 2008-01-14 2009-07-17 주식회사 고려반도체시스템 Injectin molding solder apparatus for preventing cavity generation during injection of molten solder into substrate and method thereof
CN102810489A (en) * 2012-08-17 2012-12-05 杭州士兰集成电路有限公司 Chip packaging system, chip packaging method, injecting device, and stamping and injecting linkage device
JP2016201469A (en) * 2015-04-10 2016-12-01 株式会社日立製作所 Local soldering nozzle, solder jet device using the same, and local soldering method

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US1960067A (en) * 1931-12-19 1934-05-22 Gen Electric Method of and apparatus for applying solder
US4004733A (en) * 1975-07-09 1977-01-25 Research Corporation Electrostatic spray nozzle system
US5129579A (en) * 1990-10-25 1992-07-14 Sun Microsystems, Inc. Vacuum attachment for electronic flux nozzle
US6540154B1 (en) * 1991-04-24 2003-04-01 Aerogen, Inc. Systems and methods for controlling fluid feed to an aerosol generator
US5244143A (en) 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
US6231333B1 (en) 1995-08-24 2001-05-15 International Business Machines Corporation Apparatus and method for vacuum injection molding
JP3066963B1 (en) * 1999-03-31 2000-07-17 インターナショナル・ビジネス・マシーンズ・コーポレ−ション Method and apparatus for forming solder bumps
JP4142800B2 (en) 1999-04-07 2008-09-03 株式会社ルネサステクノロジ Bump forming apparatus and bump forming method
US6270019B1 (en) * 1999-10-29 2001-08-07 Nordson Corporation Apparatus and method for dispensing liquid material
JP3824470B2 (en) 2000-04-24 2006-09-20 松下電器産業株式会社 Viscous material recovery method
DE10054526A1 (en) * 2000-11-03 2002-05-16 Bosch Gmbh Robert injection
SE0101503D0 (en) * 2001-04-27 2001-04-27 Mydata Automation Ab Method device and use of the device
US6967315B2 (en) * 2002-06-12 2005-11-22 Steris Inc. Method for vaporizing a fluid using an electromagnetically responsive heating apparatus
US7150412B2 (en) * 2002-08-06 2006-12-19 Clean Earth Technologies Llc Method and apparatus for electrostatic spray
TWI245739B (en) 2002-12-05 2005-12-21 Ibm Method and device for flowing a liquid on a surface
US7410092B2 (en) 2006-04-21 2008-08-12 International Business Machines Corporation Fill head for injection molding of solder
US7410090B2 (en) * 2006-04-21 2008-08-12 International Business Machines Corporation Conductive bonding material fill techniques
JP4247919B2 (en) * 2006-09-25 2009-04-02 Ｔｄｋ株式会社 Conductive material supply apparatus and method
US8622261B2 (en) * 2008-08-14 2014-01-07 Hitachi Metals, Ltd. Molten metal supply cylinder, molten metal supply apparatus incorporating such a supply cylinder and molten metal supply method
US7931187B2 (en) 2008-11-12 2011-04-26 International Business Machines Corporation Injection molded solder method for forming solder bumps on substrates
JP5467630B2 (en) * 2009-02-27 2014-04-09 株式会社ミマキエンジニアリング Inkjet printer, inkjet head, and printing method
US7980446B2 (en) * 2009-03-06 2011-07-19 International Businss Machines Corporation Micro-fluidic injection molded solder (IMS)
US9498837B2 (en) 2009-09-01 2016-11-22 International Business Machines Corporation Vacuum transition for solder bump mold filling
US9346075B2 (en) * 2011-08-26 2016-05-24 Nordson Corporation Modular jetting devices
TWI552824B (en) 2011-10-18 2016-10-11 千住金屬工業股份有限公司 Method and apparatus for forming solder bump
US8740040B2 (en) * 2012-07-31 2014-06-03 Samsung Electro-Mechanics Co., Ltd. Solder injection head
JP6163535B2 (en) 2013-02-19 2017-07-12 富士機械製造株式会社 Viscous fluid supply device and viscous fluid supply device
DE102014119682A1 (en) 2014-12-29 2016-06-30 Ersa Gmbh Device for soldering electrical or electronic components
US10632492B2 (en) * 2015-01-13 2020-04-28 Senju Metal Industry Co., Ltd. Fluid discharge device, fluid discharge method, and fluid application device
JP6579343B2 (en) * 2015-12-15 2019-09-25 千住金属工業株式会社 Fluid ejection device and fluid ejection method
US10388566B2 (en) 2016-03-11 2019-08-20 International Business Machines Corporation Solder fill into high aspect through holes
US11298769B2 (en) * 2019-05-13 2022-04-12 International Business Machines Corporation Prevention of dripping of material for material injection

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080020451A1 (en) * 2006-07-24 2008-01-24 Fujitsu Limited Material sucking or discharging apparatus and method
KR20090078278A (en) * 2008-01-14 2009-07-17 주식회사 고려반도체시스템 Injectin molding solder apparatus for preventing cavity generation during injection of molten solder into substrate and method thereof
CN102810489A (en) * 2012-08-17 2012-12-05 杭州士兰集成电路有限公司 Chip packaging system, chip packaging method, injecting device, and stamping and injecting linkage device
JP2016201469A (en) * 2015-04-10 2016-12-01 株式会社日立製作所 Local soldering nozzle, solder jet device using the same, and local soldering method

Also Published As

Publication number Publication date
DE112020002366T5 (en) 2022-01-27
JP7455145B2 (en) 2024-03-25
US11684988B2 (en) 2023-06-27
US20230241700A1 (en) 2023-08-03
WO2020229938A1 (en) 2020-11-19
JP2022531967A (en) 2022-07-12
US20200361013A1 (en) 2020-11-19
US11969828B2 (en) 2024-04-30
GB202117677D0 (en) 2022-01-19
US11298769B2 (en) 2022-04-12
CN113767457A (en) 2021-12-07
US20220193805A1 (en) 2022-06-23
GB2599045A (en) 2022-03-23

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