GB2569861A

GB2569861A - Welded screening can

Info

Publication number: GB2569861A
Application number: GB1817755.0A
Authority: GB
Inventors: Langhorne Robert; Benjamin Simpson Brown Andrew; Howarth James
Original assignee: Cambridge Mechatronics Ltd
Current assignee: Cambridge Mechatronics Ltd
Priority date: 2017-11-06
Filing date: 2018-10-31
Publication date: 2019-07-03
Anticipated expiration: 2038-10-31
Also published as: GB2569861A9; GB201817755D0; GB201718330D0; GB2569861B

Abstract

A camera module 100 having an image sensor assembly 118, a metal component 110; and a metal screening can 112. The metal screening can is provided over and/or around and enclosing the image sensor assembly; and the metal screening can is welded to the metal component 114. The use of a weld removes the need for a layer of adhesive between the screening can and the image sensor assembly. In an embodiment, the metal component is an L-shaped bracket and may be coupled to the image sensor assembly by a moulded component 102. In another embodiment, the metal component may be a metal tray (210, fig 2) having at least two sides (210b, fig 2) for welding (214, fig 2) to the metal screening can (212, fig 2). The sides of the tray may be made from a resilient metal, and the image sensor assembly (218, fig 2) may be provided in/on the metal tray. In another embodiment, the metal component may be a flat sheet or plate (406, fig 4A) welded (410, fig 4A) to the metal screening can (412, fig 4A). In an alternative aspect of the invention, there is provided a method of manufacturing the camera module.

Description

Welded Screening Can

The present techniques generally relate to camera modules, and in particular, to camera modules comprising a welded screening can.

In a first aspect of the present techniques, there is provided a camera module comprising: an image sensor assembly; a metal component; and a metal screening can provided around and enclosing the image sensor assembly, and welded to the at least one metal component.

In a second aspect of the present techniques, there is provided a method of manufacturing a camera module, the method comprising: providing a metal screening can over an image sensor assembly and in contact with a metal component; and welding the metal screening can to the metal component.

In a third aspect of the present techniques, there is provided an apparatus comprising a camera module of the type described herein. The apparatus may be any one of: a smartphone, a camera, a foldable smartphone, a foldable image capture device, a foldable smartphone camera, a foldable consumer electronics device, a camera with folded optics, an image capture device, an array camera, a 3D sensing device or system, a consumer electronics device, a domestic appliance, a mobile computing device, a mobile electronic device, a laptop, a tablet computing device, an e-reader (also known as an e-book reader or e-book device), a computing accessory (e.g. webcam), a computing peripheral device, a security system, a gaming system, a gaming accessory (e.g. headset), a robot or robotics device, an augmented reality system, an augmented reality device, a virtual reality system, a virtual reality device, a wearable device, a drone (e.g. aerial, water, underwater, etc.), an autonomous vehicle, and a vehicle.

Preferred features are set out in the appended dependent claims.

Implementations of the present techniques will now be described, by way of example only, with reference to the accompanying drawings, in which:

Figure 1 shows a schematic diagram of a camera module comprising a screening can welded to an L-shaped bracket;

Figure 2 shows a schematic diagram of a camera module comprising a screening can welded to a metal tray;

Figure 3 shows a schematic diagram of a camera module comprising a screening can welded to an L-shaped bracket;

Figure 4A shows a schematic diagram of a camera module comprising a screening can welded to a metal plate; and

Figure 4B shows a schematic diagram of a camera module comprising a screening can welded to a metal component.

Broadly speaking, embodiments of the present techniques provide camera modules comprising a metal screening can which is welded to a metal component of the camera module. One or more camera modules may be provided in any device/apparatus suitable for image capture, 3D sensing, depth mapping, aerial surveying, terrestrial surveying, surveying in or from space, hydrographic surveying, underwater surveying, scene detection, collision warning, security, facial recognition, augmented and/or virtual reality, advanced driver-assistance systems in vehicles, and gesture control/recognition.

Many consumer electronic devices contain one or more camera modules. Typically, the camera modules are contained within portable devices. Portable devices need to withstand a variety of impacts and vibrations, for example when being carried in a pocket or accidently dropped onto the floor. A camera module must therefore be constructed to be strong enough to withstand such impacts and vibrations if it is to be reliable. The metal screening can may advantageously protect the camera module, and in particular the image sensor assembly and actuator assembly of the camera module, from damage and absorb some impact when a device containing the camera module is dropped.

The welded screening can may provide a camera module which is substantially dust- and/or water-proof, or may significantly limit the ingress of dust and/or liquid into the camera module. This is advantageous because dust and liquid could interfere or inhibit the normal functioning of the camera module and in some cases, permanently damage the camera module. This may be particularly advantageous if the device into which the camera module is provided is itself not dust- and/or water-proof.

As explained in more detail below, the camera module may comprise an actuator assembly for driving movement of an optical component (e.g. a lens or lens stack). In this case, the screening can may advantageously limit or prevent the movement of the moveable components of the actuator assembly beyond a certain distance. Thus, the moveable components may be protected from damage from moving too far in a particular direction, as the screening can may function as a barrier or stop. This may be useful if the camera module or a device containing the camera module is dropped, as the force/impact may otherwise cause the moveable components to move too far.

The screening can may advantageously aid the assembly of a device containing the camera module. Typically, a camera module is manufactured separately and needs to be inserted into a device (e.g. a smartphone) which is to contain the camera module. The screening can may be easier to hold (by a human, or by mechanical or robotic means), manipulate and insert into a device compared to a camera module that does not have a screening can. The screening can may also prevent damage to the components of the camera module when the camera module is being inserted into a device.

It is desirable to increase the quality of the image that is captured by a camera module. However, it is also advantageous to reduce the size of the camera module as device manufacturers attempt to include ever more functionality in the design without changing its overall volume or dimensions. Image quality may be improved by increasing the size of the image sensor and/or the lens within the camera module, but this goes against the desire to reduce the size of the camera module. One consequence of increasing component size while also trying to reduce camera module size is that the space that is available for the bond between the actuator assembly and the image sensor assembly is reduced. Actuators, such as those described in International Patent Publication No. WO2013/175197, may be provided to perform optical image stabilisation and/or autofocus. The image sensor assembly may be attached to other components within the camera module, such as the screening can, with a glue layer. However, reducing the depth of the glue layer may reduce the strength of the bond, which may lead to camera module failure or reduced reliability. Thus, a further advantage of the present techniques is to replace the glue layer with a welded connection between the screening can and the image sensor assembly, which allows the size of the camera module to be decreased without compromising camera module reliability.

The present techniques are now described in more detail with reference to the Figures. Each of the Figures shows a schematic diagram of a camera module comprising: an image sensor assembly; a metal component; and a metal screening can provided around and enclosing the image sensor assembly, and welded to the at least one metal component.

Figure 1 shows a schematic diagram of a camera module 100 comprising a screening can 112 welded to a metal component 110. Here, the metal component 110 may be an L-shaped bracket or may comprise two or more L-shaped brackets. The camera module 100 may comprise other components, such as a lens, lens holder and actuator assembly, but these are not shown for the sake of clarity. The lens, or each lens of a lens stack, may have a diameter of less than or equal to 10mm, more preferably less than or equal to 20mm. The camera module 100 comprises an image sensor assembly 118, a metal component 110 and a metal screening can 112 which is provided around and encloses the image sensor assembly 118 and is welded to the metal component 110. (Element 114 indicates the location of the weld). The use of the weld 114 has removed the need for a layer of adhesive between the can and the camera assembly thereby giving a more robust and compact design. The image sensor assembly 118 comprise an image sensor chip or image sensor 104, which may be mounted on a printed circuit board 106. The image sensor chip 104 is electrically connected to the printed circuit board 106 using, for example, a plurality of wire bonds 108.

In this embodiment, the metal component 110 is, or comprises, L-shaped brackets provided along at least two sides of the image sensor assembly 118. The L-shaped brackets may extend along the full length of the sides of the image sensor assembly 118, or may be longer or shorter. A single L-shaped bracket may be provided along at least two sides of the image sensor assembly 118, or a plurality of L-shaped brackets may be provided along the at least two sides. A first portion of each L-shaped bracket 110 (i.e. one of the arms of the 'L') is coupled to the image sensor assembly 118 and a second portion of each L-shaped bracket 110 (i.e. the other of the arms of the'L') is welded to the metal screening can 112. In this way, the screening can 112 is fixedly attached to the image sensor assembly 118.

Alternatively, the metal component 110 is, or comprises, a single L-shaped bracket or L-shaped component that is provided around all four sides of the image sensor assembly 118. As above, the first portion of the L-shaped bracket 110 is coupled to the image sensor assembly 118 and a second portion of the L-shaped bracket is welded to the metal screening can 112.

In embodiments, the first portion of the L-shaped bracket 110 may be coupled to the image sensor assembly 118 by a moulded component 102 which contains the L-shaped bracket 110 and which is provided over a portion of the image sensor assembly 118. The image sensor assembly 118 may comprise an image sensor 104 and a printed circuit board (PCB) 106. The edges of the image sensor 104 may be affixed to the PCB 106 by moulded component 102. The moulded component 102 may be an overmoulding, within which the L-shaped bracket(s) 110 is arranged so that a face of the L-shaped bracket 110 (i.e. the second portion) is substantially perpendicular to the image sensor chip 104 and is exposed (i.e. is not completely enveloped in/contained within the overmoulding). The overmoulded component 102 may be provided over other components 116 on the PCB 106.

The moulded component/overmoulded component 102 may be formed of any one of: a plastic, a polymer, polyimide, a polyimide material, polycarbonate, and a liquid crystal polymer. Generally speaking, the overmoulded component 102 is formed from any material which is strong, is suitable for creating small features/details, and to which other components may be adhered using an adhesive.

The overmoulding 102 may comprise a portion which is shaped to form a sensor bracket. In embodiments, the overmoulding 102 may comprise a ledgeshaped portion (as shown in Figure 1) which provides the sensor bracket. The sensor bracket may be arranged to hold an infrared (IR) filter, lens, lens carriage and actuator assembly (not shown) of the camera module 100.

Figure 2 shows a schematic diagram of a camera module 200 comprising a screening can 212 welded to a metal tray 210. The camera module 100 may comprise other components, such as a lens, lens holder and actuator assembly, but these are not shown for the sake of clarity. The camera module 200 comprises an image sensor assembly 218, a metal component 210 and a metal screening can 212 which is provided around and encloses the image sensor assembly 218 and is welded to the metal component 210. (Element 214 indicates the location of the weld). The use of the weld 214 removes the need for a layer of adhesive between the screening can 212 and the image sensor assembly 218. The image sensor assembly 218 comprises an image sensor chip or image sensor 204, which may be attached to or mounted on a printed circuit board 206. The image sensor chip 204 is electrically connected to the printed circuit board 206 with a plurality of wire bonds 208.

In this embodiment, the metal component 210 is, or comprises, a metal tray having a base 210a and at least two sides 210b, where the image sensor assembly 218 is provided in/on the metal tray 210. In other words, a metal plate 210a is attached to the underside of the PCB 206 or image sensor 204. The metal plate 210a comprises one or more tabs 210b which extend beyond the limits of the PCB 206 and are folded around the edge of the PCB 206 so that the tabs 210b are substantially perpendicular to the plane of the image sensor 204. The tabs 210b of the metal plate 210a (or the sides of the metal tray) provide a set of contact points to which the screening can 212 be welded 214. The tabs/sides 210b may folded so that they are bowed away from the edges of the PCB 206, such that the tabs/sides 210b physically engage the screening can 212 when it is pressed onto the tabs 210b. If the tabs 210b are made from resilient metal, then the screening can 212 may be held in place by the tabs 210b, which may improve the quality of the welding process.

The two sides or tabs 210b of the metal component 210 may extend from adjacent edges of the metal base or plate 210a. Alternatively, the two sides or tabs 210b may extend from opposite edges of the metal base or plate 210a. In embodiments, the metal tray 210 comprises three sides or tabs 210b. That is, the metal tray 210 may have tabs 210b along three sides of the metal tray 210, such that the image sensor assembly 319 is surrounded by tabs 210b along three sides only.

The image sensor assembly 318 may be coupled to the metal tray 310 by an adhesive. The adhesive may be a thermal adhesive or an ultraviolet light cured adhesive.

The sides or tabs 210b of the metal tray 210 may be resilient and may exert a force on the metal screening can 312.

The camera module 200 may further comprise a sensor bracket 202, which may comprise a ledge-shaped portion 220. The sensor bracket 202 may be arranged to hold an infrared (IR) filter, lens, lens carriage and actuator assembly (not shown) of the camera module 200. The sensor bracket 202 may be attached to the PCB 206, the image sensor assembly 218 and/or to the screening can 212. The ledge-shaped portion 220 of the sensor bracket 202 may extend over the wire bonds 208 and may therefore protect the wire bonds.

Figure 3 shows a schematic diagram of a camera module 300 comprising a screening can 312 welded to a metal component 310. Here, the metal component 310 may be an L-shaped bracket or may comprise two or more L-shaped brackets. The camera module 300 may comprise other components, such as a lens, lens holder and actuator assembly, but these are not shown for the sake of clarity. The camera module 300 comprises an image sensor assembly 318, a metal component 310 and a metal screening can 312 which is provided around and encloses the image sensor assembly 318 and is welded to the metal component 310. (Element 314 indicates the location of the weld). The use of the weld 314 has removed the need for a layer of adhesive between the can and the camera assembly thereby giving a more robust and compact design. The image sensor assembly 318 comprises an image sensor chip or image sensor 304, which may be mounted on or attached to a PCB 306. The image sensor 304 is electrically connected to the printed circuit board 306 by a plurality of wire bonds 308.

In this embodiment, the metal component 310 is, or comprises, L-shaped brackets provided along at least two sides of the image sensor assembly 318. The L-shaped brackets may extend along the full length of the sides of the image sensor assembly 318, or may be longer or shorter. A single L-shaped bracket may be provided along at least two sides of the image sensor assembly 318, or a plurality of L-shaped brackets may be provided along the at least two sides. A first portion of each L-shaped bracket 310 (i.e. one of the arms of the 'L') is coupled to the image sensor assembly 318 and a second portion of each L-shaped bracket 310 (i.e. the other of the arms of the 'L') is welded to the metal screening can 312. In this way, the screening can 312 is fixedly attached to the image sensor assembly 318.

Alternatively, the metal component 310 is, or comprises, a single L-shaped bracket or L-shaped component that is provided around all four sides of the image sensor assembly 318. As above, the first portion of the L-shaped bracket 310 is coupled to the image sensor assembly 318 and a second portion of the L-shaped bracket is welded to the metal screening can 312.

The camera module 300 may further comprise a sensor bracket 302, which may comprise a ledge-shaped portion 320. The sensor bracket 302 may be arranged to hold an infrared (IR.) filer, lens, lens carriage and actuator assembly (not shown) of the camera module 300. The sensor bracket 302 may be provided over the L-shaped bracket(s) 310, as shown in Figure 3. The sensor bracket 302 may be attached to the L-shaped bracket and/or to the screening can 312. The ledge-shaped portion 320 of the sensor bracket 302 may extend over the wire bonds 308 and may therefore protect the wire bonds.

In Figures 1 and 3, the first portion of the L-shaped bracket(s) 110, 310 may be coupled to the image sensor assembly 118 by an adhesive. The adhesive may be a thermal adhesive or an ultraviolet light cured adhesive.

In Figures 1 and 3, the second portion of the L-shaped bracket(s) 110, 310 may be resilient and may exert a force on the metal screening can.

In a further embodiment (not shown), the metal component of the camera module may be a screening component that is electrically isolated. As described in International Patent Publication No. WO2018/015762, a camera module may comprise a screening component to shield the image sensor assembly of a camera module from noise which arises when pulse width modulated (PWM) signals are used to drive an actuator. Thus, in embodiments where the camera module comprises a PWM screening component, which may be made from a metal or metallic material, the screening can may be welded to the PWM screening component.

Figure 4A shows a schematic diagram of a camera module 400 comprising a screening can 412 welded to a metal component 406. The metal component 406 may be a substantially flat sheet or plate. The camera module 400 may comprise other components, such as a lens, lens holder and actuator assembly, but these are not shown for the sake of clarity. The camera module 400 comprises an image sensor assembly, a metal plate or metal component 406, and a metal screening can 412 which is provided around and encloses the image sensor assembly and is welded to the metal component 406. (Element 410 indicates the location of the weld). The use of the weld 410 removes the need for a layer of adhesive between the screening can 412 and the image sensor assembly. The image sensor assembly comprises an image sensor chip or image sensor 404, which may be attached to or mounted on a printed circuit board. In embodiments, the metal plate 406 may be a printed circuit board. Alternatively, the printed circuit board may be sandwiched between the image sensor 404 and the metal plate 406. The metal plate 406 may be a base plate.

The screening can 412 may comprise two sides which are welded to two edges or two lengths of the metal component 406, e.g. two opposite or two adjacent sides. The screening can 412 may comprise more than two sides. The screening can 412 may have four sides.

The image sensor assembly may be coupled to the metal component 406 by an adhesive. The adhesive may be a thermal adhesive or an ultraviolet light cured adhesive.

The camera module 400 may further comprise a sensor bracket 402, which may comprise a ledge-shaped portion 420. The sensor bracket 402 may be arranged to hold an infrared (IR.) filter 414, lens, lens carriage and actuator assembly of the camera module 200. The sensor bracket 402 may be attached to the PCB, the image sensor assembly and/or to the screening can 412. As shown in Figures 1 to 3, the ledge-shaped portion 420 of the sensor bracket 402 may extend over wire bonds between the PCB and image sensor 404, and may therefore protect the wire bonds. Optionally, the sensor bracket 402 may be formed of plastic and may contain a metal layer 408 to strengthen the sensor bracket.

Figure 4B shows a schematic diagram of a camera module 450 comprising a screening can 462 welded to a metal component 466. The metal component 466 may be a substantially flat sheet or plate. The camera module 450 may comprise other components, such as a lens, lens holder and actuator assembly, but these are not shown for the sake of clarity. The camera module 450 comprises an image sensor assembly, a metal plate or metal component 466, and a metal screening can 462 which is provided around and at least partly encloses the image sensor assembly and is welded to the metal component 466. (Element 460 indicates the location of the weld). The use of the weld 460 removes the need for a layer of adhesive between the screening can 462 and the image sensor assembly. The image sensor assembly comprises an image sensor chip or image sensor 454, which may be attached to or mounted on a printed circuit board 456.

The screening can 462 may comprise two sides which are welded to two edges or two lengths of the metal component 466, e.g. two opposite or two adjacent sides. The screening can 462 may comprise more than two sides. The screening can 462 may have four sides.

The image sensor 454 may be coupled to the PCB 456 by an adhesive. The adhesive may be a thermal adhesive or an ultraviolet light cured adhesive.

The camera module 450 may further comprise a sensor bracket 452, which may comprise a ledge-shaped portion 470. The sensor bracket 452 may be arranged to hold an infrared (IR) filter 464, lens, lens carriage and actuator assembly of the camera module 450. The sensor bracket 452 may be attached to the PCB 456, the image sensor assembly and/or to the screening can 462. As shown in Figures 1 to 3, the ledge-shaped portion 470 of the sensor bracket 452 may extend over wire bonds between the PCB 456 and image sensor 454, and may therefore protect the wire bonds. Optionally, the sensor bracket 452 may be formed of plastic and may contain a metal layer 458 to strengthen the sensor bracket.

The metal component 466 may be coupled to the sensor bracket 452 by an adhesive. The adhesive may be a thermal adhesive or an ultraviolet light cured adhesive.

In each of the camera modules described above, the metal component may be welded to the screening can using a laser welder. It will be understood that this is a non-limiting example technique, and any other suitable welding technique may be used.

The camera modules described herein may comprise an infrared (IR.) filter, and may further comprise a lens and an actuator assembly for driving movement of the lens relative to the image sensor. The lens, or each lens of a lens stack, may have a diameter of less than or equal to 10mm, more preferably less than or equal to 20mm. The actuator assembly may comprise shape memory alloy (SMA) actuator wire. The camera modules described herein may comprise a sensor bracket. In particular embodiments, where the camera module comprises a moulded/overmoulded component, the moulded component may be shaped to form a sensor bracket. The sensor bracket may be arranged to hold the infrared filter, lens and actuator assembly.

Further embodiments of the present techniques are set out in the following numbered clauses:

1. A camera module including: a screening can; an image sensor assembly including: an image sensor, a printed circuit board, a sensor bracket; and at least one metal plates wherein the screening can is welded to the at least one metal plate.

2. The camera module of clause 1 where the metal plates are contained within the sensor bracket.

3. The camera module of clauses 1 or 2 whereby the metal plate is overmoulded to form the sensor bracket.

4. The camera module of clause 1 whereby the image sensor is affixed to a first face of the pcb and the metal plate is affixed to the opposite face of the pcb and the metal plate extends past the edge of the pcb in at least one location and is folded to form a face that is substantially perpendicular to the pcb.

5. The camera module of claim 1 whereby the image sensor is affixed to a first face of a pcb and at least one metal contact for welding to the screen can are affixed to the same face of the pcb.

6. The camera module of any proceeding claim whereby the metal insert is formed to be resilient so that the contact is sprung against the shielding can to form a contact.

7. The camera module of claim 6 wherein the metal insert is a resilient material.

Those skilled in the art will appreciate that while the foregoing has described what is considered to be the best mode and where appropriate other modes of performing present techniques, the present techniques should not be limited to the specific configurations and methods disclosed in this description of the preferred embodiment. Those skilled in the art will recognise that present techniques have a broad range of applications, and that the embodiments may take a wide range of modifications without departing from any inventive concept as defined in the appended claims.

Claims

1. A camera module comprising:

an image sensor assembly;

a metal component; and a metal screening can provided around and enclosing the image sensor assembly, and welded to the metal component.

2. The camera module as claimed in claim 1 wherein the metal component comprises L-shaped brackets provided along at least two sides of the image sensor assembly, where a first portion of each L-shaped bracket is coupled to the image sensor assembly and a second portion of each L-shaped bracket is welded to the metal screening can.

3. The camera module as claimed in claim 1 wherein the metal component is an L-shaped bracket provided around four sides of the image sensor assembly, where a first portion of the L-shaped bracket is coupled to the image sensor assembly and a second portion of the L-shaped bracket is welded to the metal screening can.

4. The camera module as claimed in claim 2 or 3 wherein the first portion of the L-shaped bracket is coupled to the image sensor assembly by a moulded component which contains the L-shaped bracket and which is provided over a portion of the image sensor assembly.

5. The camera module as claimed in claim 4 wherein the moulded component is overmoulded.

6. The camera module as claimed in claim 4 or 5 wherein the moulded component is formed of any one of: a plastic, a polymer, polyimide, a polyimide material, polycarbonate, and a liquid crystal polymer.

7. The camera module as claimed in claim 2 or 3 wherein the first portion of the L-shaped bracket is coupled to the image sensor assembly by an adhesive.

8. The camera module as claimed in claim 7 wherein the adhesive is a thermal adhesive or an ultraviolet light cured adhesive.

9. The camera module as claimed in any of claims 2 to 8 wherein the second portion of the L-shaped bracket is resilient and exerts a force on the metal screening can.

10. The camera module as claimed in claim 1 wherein the metal component is a metal tray having a base and at least two sides, where the image sensor assembly is provided in the metal tray.

11. The camera module as claimed in claim 10 wherein the two sides extend from adjacent edges of the metal tray.

12. The camera module as claimed in claim 10 wherein the two sides extend from opposite edges of the metal tray.

13. The camera module as claimed in claim 10 wherein the metal tray comprises three sides.

14. The camera module as claimed in any one of claims 10 to 13 wherein the image sensor assembly is coupled to the metal tray by an adhesive.

15. The camera module as claimed in claim 14 wherein the adhesive is a thermal adhesive or an ultraviolet light cured adhesive.

16. The camera module as claimed in any one of claims 10 to 15 wherein the sides of the metal tray are resilient and exert a force on the metal screening can.

17. The camera module as claimed in claim 1 wherein the metal component is a screening component that is electrically isolated or grounded.

18. The camera module as claimed in claim 1 wherein the metal component is a metal sheet or plate.

19. The camera module as claimed in claim 1 further comprising a sensor bracket, wherein the metal component is attached to the sensor bracket.

20. The camera module as claimed in any preceding claim wherein the image sensor assembly comprises an image sensor and a printed circuit board.

21. The camera module as claimed in claim 20 further comprising an infrared filter, a lens, and an actuator assembly for driving movement of the lens relative to the image sensor.

22. The camera module as claimed in claim 21 wherein the lens has a diameter of at most 20mm.

23. The camera module as claimed in claim 21 or 22 wherein the actuator assembly comprises shape memory alloy (SMA) actuator wire.

24. The camera module as claimed in any one of claims 20 to 23 further comprising a sensor bracket.

25. The camera module as claimed in any one of claims 20 to 23, when dependent on claims 4, 5 or 6, wherein the moulded component comprises a portion shaped to form a sensor bracket.

26. The camera module as claimed in claim 24 or 25 wherein the sensor bracket is arranged to hold the infrared filter, lens and actuator assembly.

27. A method of manufacturing a camera module, the method comprising: providing a metal screening can over an image sensor assembly and in contact with a metal component; and welding the metal screening can to the metal component.

28. An apparatus comprising a camera module according to any of claims 1 to 26, wherein the apparatus is any one of: a smartphone, a camera, a foldable smartphone, a foldable image capture device, a foldable smartphone camera, a foldable consumer electronics device, a camera with folded optics, an image capture device, an array camera, a 3D sensing device or system, a consumer electronics device, a domestic appliance, a mobile computing device, a mobile electronic device, a laptop, a tablet computing device, an e-reader, a computing accessory, a computing peripheral device, a security system, a gaming system, a 5 gaming accessory, a robot or robotics device, an augmented reality system, an augmented reality device, a virtual reality system, a virtual reality device, a wearable device, a drone, an autonomous vehicle, and a vehicle.