GB2493177A

GB2493177A - An LED package for increasing side illumination or providing spotlighting

Info

Publication number: GB2493177A
Application number: GB201112890A
Authority: GB
Inventors: Chao-Chuan Chen
Original assignee: RUIYUN OPTOELECTRONICS LIGHTING TECHNOLOGY CO Ltd
Current assignee: RUIYUN OPTOELECTRONICS LIGHTING TECHNOLOGY CO., LT
Priority date: 2011-07-27
Filing date: 2011-07-27
Publication date: 2013-01-30
Also published as: GB201112890D0

Abstract

An LED package comprises a base 10 attached to which, and providing an electrical connection, is an LED chip 20. Also on the base and positioned around the chip, is an enclosure 30 into which is formed a lens element, preferably formed by pouring in to the enclosure a material that packages the LED chip and then hardens in to give a lens shape 40. The enclosure 30 is preferably made of an optically transparent silicone which thus allows more light to exit the package laterally than if the enclosure was opaque. Alternatively, an additional element shown in figures 2 and 3 can be provided by curving the surface 31 on an inner wall of the enclosure 30 facing the LED chip 20 and coating this surface with a reflecting layer (32 figure 3) so that light which would exit the enclosure laterally across the base is instead directed upwards away from the base. The reflector 32,31 of the enclosure helps form a spotlight by concentrating the emitting light more in a certain orientation, preferably more perpendicular to the base 10.

Description

LED PACKAGE FOR INCREASING ILLUMINATION AND

SPOTLIGHTING

I. Field of the Invention

The present invention relates to an LED packaging design, more particularly to an LED packaging design for increasing illumination and spotlighting.

2. Description of Related Art

Recently, the poor emitting efficiency of the light emitting diodes is improved by scientists so that the light emitting diodes are not only used in some appliance for indicating ON/OFF, but also used in the apparatus for lighting today The current for emitting the conventional LED illuminants is only about mA, but the current for emitting the latest LED illuminants has reached more than 2 A. The power of one latest LED illuminant is more than 100 times relative to the power of one conventional LED illuminant. ThUs, the illumination of one latest LED illuminant is brighter than 100 conventional LED illunilnants lighting up simultaneously. The illumination of the latest LED illuminants even reaches lumens. Moreover, the lower electricity cost, the compact size, the fast switching speed, and the duration of the lifetime... etc, all of the advantage mentioned above make the latest LED iliurninants be applied extensively in the communication field, electronic devices and domestic appliances.

Refen-ing to the drawings to Fig. 4, the conventional LED package comprises a base (51), a LED chip (52) and an enclosure (53). The LED chip (52) is placed on the base (51) and is electrically connecting to the base (51). The LED chip (52) is enclosed by the enclosure (53) on the base (51). A filling material is poured into the enclosure (53) and solidified to form a filling lens (54). However, the enclosure (53) of tile conventional LED package is a rubber which impedes die light to pass through freely. Therefore, the partial emitting light from the LED chip (52) cannot pass through the enclosure (53), and the illumination of the LED chip (52) is decreased by the enclosure (53) (as the dashed arrow lines shown in Fig. 4).

The present invention has arisen to mitigate and/or obviate the disadvantages of the conventional.

The main objective of the present invention is to provide an improved LED package for increasing illumination and spotlighting.

To achieve the objective, an LED package for increasing illumination and spotlighting comprises a base, an LED chip and an enclosure, the enclosure being made of an optically transparent silicone, the sub layer being made from an optical niicrostructure which reflects the light; wherein the LED chip is placed on the base and is electrically connecting to the base, the LED chip enclosed by the enclosure on the base, a filling material poured into the enclosure and solidified to form a filling lens such that the LED chip is packaged hi the filling lens, an inner side of the enclosure having a light-guide curved surface deposited thereon, the light-guide curved surface having a sub layer coated thereon for reflecting the emitting light from the LED chip.

Further benefits and advantages of tile present invention will become apparent after a careftil reading of the detailed description with appropriate reference to the accompanying drawings.

In the drawings: Fig. 1 is an assembled view of au LED package for increasing illumination and spotlighting iii accordance with tile present invention; Fig. 2 is an assembled view of the LED package for increasing illumination and spotlighting for showing a light-guide curved surface deposited on an inner side of an enclosure; Fig. 3 is a partial enlarged view of the LED package for increasing ilumination and spothghting for showing a sub layer coated n the hght-guide curved surface as shown in Fig. 2; and

Fig. 4 is an assembled view of the prior art.

Referring to the drawings to Fig. 1, an LED package for increasing illumination and spotlighting in accordance with the present invention comprises a base (10), an LED chip (20) and an enclosure (30). The LED chip (20) is placed on the base (10) and is electrically connecting to the base (10). [he LED chip (20) is enclosed by the enclosure (30) on the base (10). A filling material is poured into the enclosure (30) and solidified to form a filling lens (40) such that the LED chip (20) is packaged in the filling lens (40). The enclosure (30) is made of an optically transparent silicone. Therefore, the emitting light from the LED chip (20) can pass through the enclosure (30) and the emitting light is emitted above the base (10) in all directions (as the dashed arrow lines shown in Fig. 1).

Referring to the drawings to Figs. 2-3, the LED package for increasing illumination and spotlighting can focus the emitting light on a certain orientation.

The LED package for increasing illumination and spotlighting further comprises a base (10), an LED chip (20) and an enclosure (30). The LED chip (20) is placed on the base (10) and is electrically coirnecting to the base (10). The LED chip (20) is enclosed by the enclosure (30) on the base (10). A filling material is poured into tile enclosure (30) and solidified to form a filling lens (40) such that the LED chip (20) is packaged in the filling lens (40). An inner side of the enclosure (30) has a light-guide curved surface (3 I) deposited thereon. The light-guide curved surface (3 1) has a sub layer (32) coated thereon for reflecting the emitting light from the LED chip (20). The sub layer (32) is made from an optical microstructure which reflects the light. Therefore, the emitting light from the LED chip (20) is reflected by the light-guide curved surface (3 1) and the sub layer (32). The reflecting light can travel toward a certain orientation for spotlighting when the curvature of the light-guide curved surface (31) is at a suitable value (as shown in Fig. 2-3, the reflecting light is toward the upside for spotlighting).

Furthermore, the filling material for forming the filling lens (40) can be epoxy resins, spin-on glass (SOG), polyiniide, B-staged bisbenzocyclobutene, cermet, or glass to form a uniforni filling lens (40) or to form multilayer filling lens (40).

Although the invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention as hereinafler claimed.

Claims

<claim-text>Claim(s) 1. An LED package for increasing illumination and spotlighting comprising: a base (10), an LED chip (20), and an enclosure (30) being made of an optically transparent silicone; wherein the LED chip (20) is placed on the base (10) and is electrically connecting to the base (10), the LED chip (20) enclosed by the enclosure (30) on the base (10), a filling material poured into the enclosure (30) and solidified to form a filling lens (40) such that the LED chip (20) is packaged in the filling lens (40).</claim-text> <claim-text>2. An LED package for increasing illumination and spotlighting comprising: a base (10), an LED chip (20) and an enclosure (30); wherein tile LED chip (20) is placed on the base (10) and is electrically connecting to the base (10), the LED chip (20) enclosed by the enclosure (30) on the base (10), a filling material poured into the enclosure (30) and solidified to form a filling lens (40) such that the LED chip (20) is packaged in the filling lens (40), an inner side of the enclosure (30) having a light-guide curved surface (31) deposited thereon, the light-guide curved surface (3 1) having a sub layer (32) coated thereon for reflecting the emitting light from the LED chip (20).</claim-text> <claim-text>3. The LED package for increasing illumination and spotlighting as claimed in claim 2, wherein the sub layer (32) is made from an optical microstructure which reflects the light.</claim-text> <claim-text>4. An LED package substantially as hereinbefore described with reference to and as shown hi Figures I to 3 of the accompanying drawings.</claim-text>