GB2437848B - Substrate-free chip light emitting diode and manufacturing method thereof - Google Patents

Substrate-free chip light emitting diode and manufacturing method thereof

Info

Publication number
GB2437848B
GB2437848B GB0708932A GB0708932A GB2437848B GB 2437848 B GB2437848 B GB 2437848B GB 0708932 A GB0708932 A GB 0708932A GB 0708932 A GB0708932 A GB 0708932A GB 2437848 B GB2437848 B GB 2437848B
Authority
GB
United Kingdom
Prior art keywords
substrate
manufacturing
light emitting
emitting diode
chip light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0708932A
Other versions
GB2437848A (en
GB0708932D0 (en
Inventor
Chin-Chung Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chunghwa Picture Tubes Ltd
Original Assignee
Chunghwa Picture Tubes Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW094114854A external-priority patent/TWI246786B/en
Application filed by Chunghwa Picture Tubes Ltd filed Critical Chunghwa Picture Tubes Ltd
Priority to GB0708932A priority Critical patent/GB2437848B/en
Publication of GB0708932D0 publication Critical patent/GB0708932D0/en
Publication of GB2437848A publication Critical patent/GB2437848A/en
Application granted granted Critical
Publication of GB2437848B publication Critical patent/GB2437848B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Devices (AREA)
GB0708932A 2005-05-09 2006-04-25 Substrate-free chip light emitting diode and manufacturing method thereof Expired - Fee Related GB2437848B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0708932A GB2437848B (en) 2005-05-09 2006-04-25 Substrate-free chip light emitting diode and manufacturing method thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW094114854A TWI246786B (en) 2005-05-09 2005-05-09 Substrate-free flip chip light emitting diode and manufacturing method thereof
GB0708932A GB2437848B (en) 2005-05-09 2006-04-25 Substrate-free chip light emitting diode and manufacturing method thereof
GB0608131A GB2426123B (en) 2005-05-09 2006-04-25 Substrate-free flip chip light emitting diode and manufacturing method thereof

Publications (3)

Publication Number Publication Date
GB0708932D0 GB0708932D0 (en) 2007-06-20
GB2437848A GB2437848A (en) 2007-11-07
GB2437848B true GB2437848B (en) 2008-04-09

Family

ID=38578548

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0708932A Expired - Fee Related GB2437848B (en) 2005-05-09 2006-04-25 Substrate-free chip light emitting diode and manufacturing method thereof

Country Status (1)

Country Link
GB (1) GB2437848B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003088320A2 (en) * 2002-04-09 2003-10-23 Oriol, Inc. A method of fabricating vertical devices using a metal support film
US20040188791A1 (en) * 2003-03-31 2004-09-30 Ray-Hua Horng Light emitting diode and method for producing the same
US20040211972A1 (en) * 2003-04-22 2004-10-28 Gelcore, Llc Flip-chip light emitting diode
US20040227148A1 (en) * 1997-06-03 2004-11-18 Camras Michael D. III-Phosphide and III-Arsenide flip chip light-emitting devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040227148A1 (en) * 1997-06-03 2004-11-18 Camras Michael D. III-Phosphide and III-Arsenide flip chip light-emitting devices
WO2003088320A2 (en) * 2002-04-09 2003-10-23 Oriol, Inc. A method of fabricating vertical devices using a metal support film
US20040188791A1 (en) * 2003-03-31 2004-09-30 Ray-Hua Horng Light emitting diode and method for producing the same
US20040211972A1 (en) * 2003-04-22 2004-10-28 Gelcore, Llc Flip-chip light emitting diode

Also Published As

Publication number Publication date
GB2437848A (en) 2007-11-07
GB0708932D0 (en) 2007-06-20

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20160425