GB2437515B - Method for bonding member to glass article - Google Patents
Method for bonding member to glass articleInfo
- Publication number
- GB2437515B GB2437515B GB0610957A GB0610957A GB2437515B GB 2437515 B GB2437515 B GB 2437515B GB 0610957 A GB0610957 A GB 0610957A GB 0610957 A GB0610957 A GB 0610957A GB 2437515 B GB2437515 B GB 2437515B
- Authority
- GB
- United Kingdom
- Prior art keywords
- glass article
- bonding member
- bonding
- article
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011521 glass Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/04—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Structural Engineering (AREA)
- Joining Of Glass To Other Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006125950A JP4813246B2 (en) | 2006-04-28 | 2006-04-28 | Method for joining members to glass article |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0610957D0 GB0610957D0 (en) | 2006-07-12 |
GB2437515A GB2437515A (en) | 2007-10-31 |
GB2437515B true GB2437515B (en) | 2011-06-22 |
Family
ID=36694874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0610957A Expired - Fee Related GB2437515B (en) | 2006-04-28 | 2006-06-02 | Method for bonding member to glass article |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4813246B2 (en) |
GB (1) | GB2437515B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2922125B1 (en) * | 2007-10-11 | 2009-12-04 | Univ Paris Curie | METHOD FOR ATTACHING SLABS OF A LAMELLAR MATERIAL TO AN APPROPRIATE SUBSTRATE |
FR2944787A1 (en) * | 2009-04-28 | 2010-10-29 | Saint Gobain | Pole material comprises a glass substrate coated with discontinuous enamel pole on part of its surface, where the enamel is formed in the form of parallel lines, or points |
TWI551560B (en) * | 2010-11-30 | 2016-10-01 | 康寧公司 | Glass ribbons, methods of splicing glass ribbons, and methods of preparing coated glass ribbons for splicing |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4452624A (en) * | 1982-12-21 | 1984-06-05 | The United States Of America As Represented By The Secretary Of The Navy | Method for bonding insulator to insulator |
JPS60240160A (en) * | 1984-05-15 | 1985-11-29 | Nec Corp | Electrostatic bonding method |
US5141148A (en) * | 1990-07-20 | 1992-08-25 | Mitsubishi Denki Kabushiki Kaisha | Method of anodic bonding a semiconductor wafer to an insulator |
US5673476A (en) * | 1992-10-22 | 1997-10-07 | Canon Kabushiki Kaisha | Anode bonding method for selected regions |
US5747169A (en) * | 1995-11-09 | 1998-05-05 | David Sarnoff Research Center, Inc. | Field-assisted sealing |
WO2003097552A1 (en) * | 2002-04-30 | 2003-11-27 | Agency For Science Technology And Research | A method of wafer/substrate bonding |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005350311A (en) * | 2004-06-11 | 2005-12-22 | Sharp Corp | Anode connection method |
JP2006073780A (en) * | 2004-09-02 | 2006-03-16 | Bondotekku:Kk | Normal-temperature joint method, equipment, and device |
-
2006
- 2006-04-28 JP JP2006125950A patent/JP4813246B2/en not_active Expired - Fee Related
- 2006-06-02 GB GB0610957A patent/GB2437515B/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4452624A (en) * | 1982-12-21 | 1984-06-05 | The United States Of America As Represented By The Secretary Of The Navy | Method for bonding insulator to insulator |
JPS60240160A (en) * | 1984-05-15 | 1985-11-29 | Nec Corp | Electrostatic bonding method |
US5141148A (en) * | 1990-07-20 | 1992-08-25 | Mitsubishi Denki Kabushiki Kaisha | Method of anodic bonding a semiconductor wafer to an insulator |
US5673476A (en) * | 1992-10-22 | 1997-10-07 | Canon Kabushiki Kaisha | Anode bonding method for selected regions |
US5747169A (en) * | 1995-11-09 | 1998-05-05 | David Sarnoff Research Center, Inc. | Field-assisted sealing |
WO2003097552A1 (en) * | 2002-04-30 | 2003-11-27 | Agency For Science Technology And Research | A method of wafer/substrate bonding |
Also Published As
Publication number | Publication date |
---|---|
JP2007297234A (en) | 2007-11-15 |
GB2437515A (en) | 2007-10-31 |
GB0610957D0 (en) | 2006-07-12 |
JP4813246B2 (en) | 2011-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20130602 |