GB2429843A - Semiconductor structure processing using multiple laser beam spots - Google Patents
Semiconductor structure processing using multiple laser beam spots Download PDFInfo
- Publication number
- GB2429843A GB2429843A GB0623283A GB0623283A GB2429843A GB 2429843 A GB2429843 A GB 2429843A GB 0623283 A GB0623283 A GB 0623283A GB 0623283 A GB0623283 A GB 0623283A GB 2429843 A GB2429843 A GB 2429843A
- Authority
- GB
- United Kingdom
- Prior art keywords
- links
- rows
- lengthwise direction
- multiple laser
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/143—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using laser-fusible links
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/18—Auxiliary circuits, e.g. for writing into memory
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
- G11C29/027—Detection or location of defective auxiliary circuits, e.g. defective refresh counters in fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
- H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Lasers (AREA)
- Recrystallisation Techniques (AREA)
- Semiconductor Lasers (AREA)
Abstract
Methods and systems process electrically conductive links on or within a semiconductor substrate (740) using multiple laser beams. For example, a method utilizes N series of laser pulses to obtain a throughput benefit, wherein N / 2. The links are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The N series of laser pulses propagate along N respective beam axes until incident upon selected links. The pattern of resulting laser spots may be on links in N distinct rows, on distinct links in the same row, or on the same link, either partially or completely overlapping. The resulting laser spots may be offset from one another in the lengthwise direction of the rows or offset from one another in a direction perpendicular to the lengthwise direction of the rows, or both.
Description
GB 2429843 A continuation (72) Inventor(s): Kelly J Bruland Ho Wai Lo
Brian W Baird Frank G Evans Richard S Harris Yunlong Sun Stephen N Swaringen (74) Agent and/or Address for Service: Hanna Moore & Curley 13 Lower Lad Lane, Dublin 2, Ireland
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58091704P | 2004-06-18 | 2004-06-18 | |
US11/051,958 US7425471B2 (en) | 2004-06-18 | 2005-02-04 | Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset |
US11/051,261 US7633034B2 (en) | 2004-06-18 | 2005-02-04 | Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure |
US11/051,500 US8148211B2 (en) | 2004-06-18 | 2005-02-04 | Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously |
US11/052,000 US7923306B2 (en) | 2004-06-18 | 2005-02-04 | Semiconductor structure processing using multiple laser beam spots |
US11/052,014 US7629234B2 (en) | 2004-06-18 | 2005-02-04 | Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling |
US11/051,262 US7687740B2 (en) | 2004-06-18 | 2005-02-04 | Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows |
US11/051,263 US7935941B2 (en) | 2004-06-18 | 2005-02-04 | Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures |
US11/051,265 US7435927B2 (en) | 2004-06-18 | 2005-02-04 | Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset |
PCT/US2005/021406 WO2006009818A2 (en) | 2004-06-18 | 2005-06-16 | Semiconductor structure processing using multiple laser beam spots |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0623283D0 GB0623283D0 (en) | 2007-01-03 |
GB2429843A true GB2429843A (en) | 2007-03-07 |
GB2429843B GB2429843B (en) | 2009-07-08 |
Family
ID=35785685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0623283A Active GB2429843B (en) | 2004-06-18 | 2005-06-16 | Semiconductor structure processing using multiple laser beam spots |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5294629B2 (en) |
KR (1) | KR101257029B1 (en) |
DE (1) | DE112005001418T5 (en) |
GB (1) | GB2429843B (en) |
WO (1) | WO2006009818A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9678350B2 (en) | 2012-03-20 | 2017-06-13 | Kla-Tencor Corporation | Laser with integrated multi line or scanning beam capability |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8084706B2 (en) * | 2006-07-20 | 2011-12-27 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
US8278595B2 (en) * | 2007-03-16 | 2012-10-02 | Electro Scientific Industries, Inc. | Use of predictive pulse triggering to improve accuracy in link processing |
DE102007032903A1 (en) * | 2007-07-14 | 2009-01-15 | Schepers Gmbh + Co. Kg | Method for operating a laser engraving device |
KR101420703B1 (en) * | 2007-09-19 | 2014-07-23 | 지에스아이 그룹 코포레이션 | Link processing with high speed beam deflection |
WO2010091100A1 (en) | 2009-02-03 | 2010-08-12 | Abbott Cardiovascular Systems Inc. | Multiple beam laser system for forming stents |
JP2011092956A (en) * | 2009-10-27 | 2011-05-12 | Fujifilm Corp | Optical head device, and laser beam machining method using the optical head device |
US8461479B2 (en) * | 2009-12-23 | 2013-06-11 | Electro Scientific Industries, Inc. | Adaptive processing constraints for memory repair |
JP5901265B2 (en) * | 2011-11-10 | 2016-04-06 | 東芝機械株式会社 | Pulse laser processing apparatus and pulse laser processing method |
JP6022223B2 (en) * | 2012-06-14 | 2016-11-09 | 株式会社ディスコ | Laser processing equipment |
JP5940906B2 (en) * | 2012-06-19 | 2016-06-29 | 株式会社ディスコ | Laser processing equipment |
US20170008126A1 (en) * | 2014-02-06 | 2017-01-12 | United Technologies Corporation | An additive manufacturing system with a multi-energy beam gun and method of operation |
JP6218770B2 (en) * | 2014-06-23 | 2017-10-25 | 三菱電機株式会社 | Laser processing equipment |
US10307867B2 (en) | 2014-11-05 | 2019-06-04 | Asm Technology Singapore Pte Ltd | Laser fiber array for singulating semiconductor wafers |
KR101612508B1 (en) * | 2015-02-03 | 2016-04-14 | 동서대학교산학협력단 | Probing system with dual mode laser for fault injection attacks |
KR20240010086A (en) * | 2015-09-09 | 2024-01-23 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | Laser processing apparatus, methods of laser-processing workpieces and related arrangements |
KR101987192B1 (en) * | 2017-06-14 | 2019-09-30 | 주식회사 이오테크닉스 | Wafer cutting device |
US10615044B1 (en) * | 2018-10-18 | 2020-04-07 | Asm Technology Singapore Pte Ltd | Material cutting using laser pulses |
JP6843219B1 (en) * | 2019-12-25 | 2021-03-17 | 浜松ホトニクス株式会社 | Light source for laser processing and laser processing equipment |
CN115335965A (en) * | 2020-03-24 | 2022-11-11 | 东京毅力科创株式会社 | Substrate processing method and substrate processing apparatus |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02137682A (en) * | 1988-11-16 | 1990-05-25 | Nec Kyushu Ltd | Laser repair device for semiconductor integrated circuit |
TW279229B (en) * | 1994-12-29 | 1996-06-21 | Siemens Ag | Double density fuse bank for the laser break-link programming of an integrated-circuit |
JP3353520B2 (en) * | 1995-02-27 | 2002-12-03 | ソニー株式会社 | Semiconductor device |
JPH10328873A (en) * | 1997-06-04 | 1998-12-15 | Nikon Corp | Laser beam machining device |
JPH11245073A (en) * | 1998-03-04 | 1999-09-14 | Nikon Corp | Laser processing device |
US6567219B1 (en) * | 1999-08-13 | 2003-05-20 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus |
US6368945B1 (en) * | 2000-03-16 | 2002-04-09 | The Trustees Of Columbia University In The City Of New York | Method and system for providing a continuous motion sequential lateral solidification |
KR100773070B1 (en) * | 2000-07-12 | 2007-11-02 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | Laser system and method for single pulse severing of ?? fuses |
JP3935775B2 (en) * | 2002-05-21 | 2007-06-27 | 日立ビアメカニクス株式会社 | Laser processing equipment |
JP4014498B2 (en) * | 2002-12-17 | 2007-11-28 | 日立ビアメカニクス株式会社 | Multi-axis laser processing machine |
-
2005
- 2005-06-16 DE DE112005001418T patent/DE112005001418T5/en not_active Withdrawn
- 2005-06-16 JP JP2007516763A patent/JP5294629B2/en not_active Expired - Fee Related
- 2005-06-16 GB GB0623283A patent/GB2429843B/en active Active
- 2005-06-16 KR KR1020067026513A patent/KR101257029B1/en active IP Right Grant
- 2005-06-16 WO PCT/US2005/021406 patent/WO2006009818A2/en active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9678350B2 (en) | 2012-03-20 | 2017-06-13 | Kla-Tencor Corporation | Laser with integrated multi line or scanning beam capability |
Also Published As
Publication number | Publication date |
---|---|
GB2429843B (en) | 2009-07-08 |
DE112005001418T5 (en) | 2008-02-21 |
JP2008503877A (en) | 2008-02-07 |
WO2006009818A3 (en) | 2007-03-01 |
GB0623283D0 (en) | 2007-01-03 |
KR101257029B1 (en) | 2013-04-22 |
WO2006009818A2 (en) | 2006-01-26 |
JP5294629B2 (en) | 2013-09-18 |
KR20070036747A (en) | 2007-04-03 |
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