GB2427680A

GB2427680A - Heat pipe manufacturing method

Info

Publication number: GB2427680A
Application number: GB0513105A
Authority: GB
Inventors: Pei-Pei Ding; Hsiu-Wei Yang; Jao-Ching Lin; Wen-Hwa Yu; Yen-Wen Chen
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2005-06-28
Filing date: 2005-06-28
Publication date: 2007-01-03
Also published as: GB0513105D0

Abstract

A method of manufacturing a heat pipe 3 comprises deaerating a gas and filling a cavity (33, fig 11) of the heat pipe 3 with a working fluid 5 via an opening 312 on a flat surface 311 of the heat pipe 3, and compressing the heat pipe 3 perpendicular to the flat surface 311 to deform a part of the heat pipe 3 to seal the opening 312. Prior to filling the cavity 33, the working fluid 5 may be vaporized (fig 13). Working fluid 5 may be water, methyl alcohol or other liquids. Sealing the opening 312 may comprise of moving a first 71 and/or second 72 loading element (figs 12, 18 & 19), and soldering or spot welding the opening 312. Soldering techniques may include gas, supersonic or laser soldering. Gas may be deaerated by mounting a sucking disk 61 onto opening 312. Sucking disk 61 may comprise of a deformation part 611 having a through hole 612, which receives a pipe 62 for deaerating and filling the cavity 33. Alternatively, a deaerating and filling pipe (67, fig 15) may be soldered to the heat pipe 3 and a clamping (74, fig 16) and clipping device (75) may be used to clip the pipe (67) and its end soldered or welded. Pipe (67) may also be melted using an excimer laser. The method maintains air tightness during deaerating and filling and improves the quality of the heat pipe 3.

Description

HEAT PIPE MANUFACTURING METHOD THROUGH THE USE OF A PRESSURE

DEFORMATION SEALING PROCESS

BACKGROUND OF THE INVENTION

The present invention relates to a heat pipe manufacturing method, and more particularly, to a heat pipe manufacturing system through the use of a pressure deformation sealing process.

A heat pipe is one of the best heat conduction components used in 3C electronic devices, and is therefore usually appliedto aheat source, suchas amicroprocessorof anotebook computer, a host of a play station, or a communication host, which are all not allowed to be installed with large sized heat conduction fins. The heat pipe is used to conduct heat generated by the above heat sources to a heat conductor comprising heat conduction fins. The heat pipe is cheap, and has a lifespan as long as tens of years, for the heat pipe is a kind of passive heat conduction components. Different from copper or aluminum heat conduction components, which have constant conductivities, the heat pipe has a variable conductivity. The longer a length of the heat pipe is, the larger the heat conductivity of the heat pipe becomes.

Moreover, the heat conductivity of a conventional heat pipe is tens or more than tens of thousands times as large as the heat conductivity of copper.

Please refer to Fig.l. A conventional planar heat pipe 1 comprises a hollow package 11, a capillary structure 12 installed in an inner surface of the package 12, and working fluid 13 accommodated in the package 11. The package 11 comprises an endothermic end 111 and a radiating end 112 installed opposite to the endothermic end 111. A pressure inside the package 11 is equal to a saturated vapor pressure of the working fluid 13, which is in a stable equilibrium state when a liquid state and a gas state exist concurrently.

Additionally, the capillary structure 12 comprises a plurality of capillaries 121 infiltrated in the working fluid 13.

When the endothermic end 111 is heated and a temperature of the endothermic end 111 is increased, the stable equilibrium state of the working fluid 13 near the endothermic end 111 is destroyed, causing the liquid working fluid 13 neighboring the endothermic end 111 to be evaporated gradually.

At this moment, the endothermic end 111 has a vapor pressure higher than that of the radiating end 112, so a great volume of gas working fluid 13 is driven to flow from the endothermic end 111 to the radiating end 112. Since the temperature of the radiating end 112 is still low, the radiating end 112 is capable of congealing the gas working fluid 13 neighboring the radiating end 112 flew from the endothermic end 111. The excess congealed working fluid 13 flows along the capillaries 121 back to the endothermic end 111. A heat radiation cycle to radiate heat from the endothermic end 111 to the radiating end 112 is therefore completed.

Since the heat radiation cycle is realized by destroying the stable equilibrium state of the working fluid 13, the heat radiation cycle can still function and radiate considerable quantity of heat continuously, even though the temperatures of the two ends of the package 11 differ from each other slightly.

Although it is not difficult to understand the working principles of a heat pipe, and everyone can obtain materials for a heat pipe from a hardware store and make up a heat pipe forashort-termusebyhjmself in real industryapplications it is very difficult to manufacture a durable heat pipe for a long-term use. In early years, the manufacturing techniques to manufacture a heat pipe are not mature, the manufacturing efficiency being low and the quality of finished products being poor, for in the heat pipe manufacturing system flaws hardly seen by human's eyes are generated inevitably. Though a heat pipe produced by such a heat pipe manufacturing system looks the same as those heat pipes of good quality, an air tightness of the heat pipe is likely to be destroyed after a long- term use. Therefore, maintaining the air tightness inside of the package 11 becomes a key issue to determine whether or not the above heat radiation cycle can be executed successfully. When an outer surface of the package 11 is damaged, a pressure difference between an inner part and an outer part of the package 11 causes air to flow into the package 11 easily, and the stable equilibrium state inside of the package 11 is therefore destroyed. In consequence, most heat pipes lose their original efficiencies gradually as time goes on.

In the following paragraphs, a flow chart shown in Fig.2 is used to illustrate the method to manufacture the conventional planar heat pipe 1.

Please also refer to Fig.l and Fig.3. The method shown in Fig.2 starts fromstep 191. Instep 191, aplanarhollowpackage 11 made of ductile materials is provided. The package 11 comprises a capillary structure 12. In general, both the package 11 and the capillary structure 12 are made of copper or aluminum. The capillary structure 12 can be formed on the inner surface of the package 11 by a stamping process, or is an individual metal network installed at a time when the package ii is formed.

In step 192, a through hole 113 is formed on a side surface of the package ii. A way to form the through hole 113 is to have two slots opposite to each other reserved when manufacturing the package ii, or to drill the package 11 in addition after the package ii is done completely. However, both of the Slot-reserved and the drilling-inadditjo techniques cannot function independently without an auxiliary biting motion provided by a biting device, which is likely to destroy the integrity of the package ii, for the package 11 is small. If the package ii is lack of the integrity, the vacuum degree of the package 11 is low, and the quality of the heat pipe 1 is poor.

In step 193, a steel pipe 14 is jointed into the through hole 113. In order to operate in accord with the following steps, a joint between the steel pipe 14 and the through hole 113 has to have good enough air tightness. However, in practice conventional jointing methods, such as a soldering method or a bonding method, still produce small air holes, which will make an impact on the air tightness. Moreover, this step still has the clamping problem occurred in last step.

In step 194, a working fluid filling process can be performed through the use of the steel pipe 14. In a conventional heat pipe, water is selected as a working fluid 13. In some other heat pipes, methyl alcohol, or acetone, is selected as the working fluid 13. Different kinds of working fluid correspond to different working temperatures, beyond which the heat radiation cycle cannot be performed successfully, for the working fluid 13, if staying in a high temperature environment or a low temperature environment, is either in a liquid state or in a gas state all the time, and cannot perform a phase-changing process. For example, a working temperature of the heat pipe ranges from 24 C to 94 C if the working fluid 13 is pure water, while the working temperature of the heat pipe ranges from 46 C to 125 C if the In order to ensure that the heat radiation cycle can be performed successfully, a working pressure of the package 11 had better to be kept equal to a vapor pressure of the working fluid 13, that is enabling the working fluid 13 to reach the stable equilibrium state. Then, a deaerating process is performed in step 195 to deaerate gas except the gas working fluid 13 in the package 11. In general, as long as a pressure of the package 11 is equal to the vapor pressure of the working fluid 13, the gas except the gas working fluid 13 is determined having been expelled to a region outside of the package 11 completely.

Please refer to Fig.4 and Fig.5. In step 196, a clamping device is used to clamp an end of the steel pipe 14. In step 197, a clipping device is used to clip a flat sealed end 141 formed in step 196. Thus far, the package 11, as shown in Fig.3, has been sealed completely. Note that for the time being the air tightness of the package 11 completely relies on a packing mechanism performed by sheet metal of two sides of the flat sealed end 141. According to such a scenario, when the clamping device releases the flat sealed end 141, gas is leaked out from the package 11.

Therefore, in step 198 the last step, a seaming device is used to spot weld a flat sealed end surface 142 of the flat sealed end 141, to air tighten the package 11 completely.

In order to maintain the air tightness of the package 11 during steps 196 to 198, a clamping process, a clipping process, and a spot welding process have to be performed completely all at a time. Therefore, steps 196 to 198 have to be performed and completed in a single table. However, such a table costs high, consumes more power, and is not cost-effective.

It can be seen from the above procedures that the flow chart of manufacturing the planar heat pipe 1 is not ideal. Not only the quality of the planar heat pipe 1 is not good all the time during the procedures, most of the steps, when executed, are likely to destroy the integrity of the package 11 indirectly, and decrease the lifespan and working efficiency of the planar heat pipe 1. Moreover, the manufacturing process described above is uneconomical.

SUMMARY OF THE INVENTION

It is therefore an objective of the claimed invention to provide a heat pipe manufacturing method through the use of a pressure deformation sealing process to ensure the quality of a finished heat pipe.

Another objective of the claimed invention is to provide a heat pipe manufacturing method without being destroyed by a clamping mechanism performed by a clamping device in a manufacturing process.

Another objective of the claimed invention is to provide a heat pipe manufacturing method capable of maintaining the air tightness in a manufacturing process.

Therefore, the pressure deformation sealing method of the present invention is used to seal in an air tight state a cavity of a ductile package, the package having an outer surface, and an opening installed on the outer surface in communication with the cavity. The method includes the following steps of (A) providing a substantially flat surface encircling the opening, (B) deaerating air in the cavity of the package via the opening to a region outside of the cavity, and (C) compressing the package along a direction perpendicular to the flat surface to deform and extend part of the package to seal the opening.

Additionally, another heat pipe manufacturing method of the present invention through the use of a pressure deformation sealing process include the following steps of (E) forming a planar hollowpackage made of a ductile material, the package comprising a cavity, (F) providing a substantially flat surface installed on the package and forming an opening on the surface for connecting to the cavity, (G) deaerating air in the cavity via the opening, (H) filling working fluid via the opening into the cavity, and (I) compressing the package along a direction perpendicular to the flat surface to deform and extend part of the package to seal the opening.

These and other objectives of the claimed invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

Fig.l is a cross sectional view of a planar heat pipe

according to the prior art.

Fig.2 is a flow chart diagram to manufacture the planar heat pipe shown in Fig.l.

Fig.3 is an explosive view of a package and a conventional steel pipe.

Fig.4 is a cross sectional view of the steel pipe shown in Fig.3.

Fig.5 is another cross sectional view similar to Fig.4.

Fig. 6 is a flow chart diagram of a heat pipe manufacturing method of a first preferred embodiment of the present invention through the use of a pressure deformation sealing process.

Fig.7 is an explosive view of a planar heat pipe of the first preferred embodiment.

Fig.8 is a side cross sectional view of the planar heat pipe shown in Fig. 7.

Fig.9 is a side cross sectional view of the planar heat pipe, a deaerating & filling device, and a sealing device of the first preferred embodiment.

Fig.lO is another side cross sectional view similar to Fig. 9.

Fig.ll is another side cross sectional view similar to Fig.9.

Fig.12 is another side cross sectional view similar to Fig.9.

Fig.13 is a schematic diagram of a vaporizing device of the first preferred embodiment.

Fig.14 is a flow chart diagram of a heat pipe manufacturing method of a second preferred embodiment of the present invention through the use of the pressure deformation sealing process.

Fig.l5 is a side cross sectional view of the planar heat pipe, a deaerating & filling device, and a sealing device of the second preferred embodiment.

Fig.16 is a side cross sectional view of the planar heat pipe, a clamping device, and a clipping device of the second preferred embodiment.

Fig.17 is an incomplete side cross sectional view similar to Fig.9.

Fig.l8 is another incomplete side cross sectional view similar to Fig.9.

DESCRIPTION OF THE PREFERRED EMBODIMENT

The premise and other related technique contents, characteristics, and virtues of the present invention would be presented clearly in accord with detailed descriptions of two preferred embodiments of reference figures.

Before the present invention is described, note that similar components are assigned the same numbers in the following paragraphs.

Please refer to Fig.6. Through the use of a pressure deformation sealing process, a first embodiment of a heat pipe manufacturing method of the present invention is designed to improve a sealing in a planar heat pipe manufacturing process.

The first embodiment comprises steps 801 to 817.

Please refer to Fig.7. In step 801, a first component 31 and a second component 32 are manufactured through the use of a current metal manufacturing method. An appearance of the first component 31 is complementary to an appearance of the second component 32. Under consideration for efficiency and economy, these two components can be made of copper or aluminum.

Under other considerations, the first component 31, and the second component 32 as well, can be made of ductile materials of good heat conductivity. The first component 31 comprises an opening 312 penetrating through two sides opposite to each other, and provides a substantially flat surface 311 encircling the opening 312.

In step 803, a capillary structure 4 is manufactured through the use of a current metal manufacturing method. The capillary structure 4 can be made of copper, aluminum, or any other materials of good heat conductivity. Of the preferred embodiment, the capillary structure 4 is a metal network, which comprises a plurality of capillaries 41 in communication with each other. The capillaries 41 described here are fine holes capable of inducing liquid to form a capillarity effect.

That is, when a part of the capillary structure 4 contacts with liquid, the liquid can be diffused through the capillaries 41 to the remaining part of the capillary structure 4. Such a diffusion process has nothing to do with a direction of gravity. Therefore, the actual size of the capillaries 41 depend on the materials of the capillary structure and the liquid applied in coordination with the capillary structure 4.

Please refer to Fig.8. In step 805, the first component 31 and the second component 32 are combined to form a hollow package 3 through the use of a current combining technique, such as a bonding technique or a soldering technique. The package 3 comprises a cavity 33. The opening 312 is connected to the cavity 33. In the process of combining the first component 31 and the second component 32, the capillary structure 4 is installed between the first component 31 and the second component 32. After the package 3 is finished, the capillary structure 4 is disposed in the cavity 33, and has two opposite sides contacting with an inner surface of the package 3 respectively. Heat can be conducted from the package 3 to the capillary structure 4, and vice versa.

Moreover, the above-mentioned steps 801 to 805 are only the preferred embodiment. In practice, in step 803 the capillary structure 4 can also be formed between the first component 31 and the second component 32 through the use of another current techniques, such as a stamping technique or a seal cutting technique. Combining the first component 31 and the second component 32 in step 805 can acquire a similar structure.

Please refer to Fig. 9. After the package 3 and the capillary structure 4 are finished, a deaerating & filling process and the sealing process are performed in coordination with a deaerating & filling device 6 and a sealing device 7. The deaerating & filling device 6 comprises a sucking disk 61, a deaerating & filling pipe 62, and a vacuum-pumping device (not shown) . The sucking disk 61 has a virtue similar to that of a vacuum lifter used for job transfer, job air tightness test, job displacement direction detection, stickers sticking automatically, and materials packing & sack opening. The vacuum pumping device, and the vacuum lifter as well makes the use of a pressure difference to absorb an object. The sealing device 7 comprises a first loading element 71, a second loading element 72, and a driving device (not shown) . The first loading element 71, and the second loading element 72 as well, is made of pressure resistant materials of high rigidity. The driving device (not shown) does works by oil pressing, water pressing, or through the use of a servomotor.

Before the deaerating & filling process and the sealing process are performed, in step 807 the sucking disk 61, the first loading element 71, and the second loading element 72 are installed on a surface of the package 3. The sucking disk 61 comprises a deformation part 611 in the form of a bell jar mounted on the opening 312, and a through hole 612 penetrating through the deformation part 611 for insertion of the deaerating & filling pipe 62 and in communication with the opening 312. A sucking ring 613 is formed in an outer ringed region of the deformation part 611 for adhering to the surface 311. Moreover, the suckingdisk6l is made of flexible silicon.

However, in practical application, the sucking disk 61 can be made of other flexible materials such as acrylonitile rubber (NBR) . The first loading element 71 encircles the sucking disk 61, and has one end against the surface 311. The second loading element 72 has one end against the package 3 and is located opposite to the surface 311. The second loading element 72 comprises a projecting part 721 against an end surface of the package 3. The projecting part 721 is located at a position corresponding to the opening 312.

Before the deaerating & filling process is described in detail, note that in the preferred embodiment a popular deaerating & filling sequence is introduced here for description, the sequence comprising step 809, step 811, and step 813. However, a practical application is not limited to the popular sequence. That is, the practical application can have another sequence of step 811, step 813, and step 809.

Please refer to Fig.l0. In step 809, a deaerating process is performed by taking the advantage of a characteristic of the sucking disk 61 able to be air tightened to the surface 311. Through the use to the vacuum-pumping device (not shown) to reduce the pressures of the deaerating & filling pipe 62 and the cavity 33, the air inside of the cavity 33 can be expelled to a region outside of the cavity 33. At this moment, the deformation part 611 is deformed and absorbed to the surface 311, so as to achieve the efficiency of air tightness.

Please refer to Fig.11 and Fig.13. Both of step 811 and step 813 are used to perform the filling process in coordination with the deaerating & filling device 6. Since for the time now the pressures of the deaerating & filling pipe 62 and the cavity 33 are very low, when a pipe line carrying working fluid 5 manufactured in advance is connected to the deaerating & filling pipe 62, the working fluid 5 is compressed and flows into the cavity 33. In many practical applications, because the package 3 is very thin (0.8 mm in thickness), the working fluid 5 flew into the cavity 33 is piled and adhered to the capillaries 41 away from the opening 312. The surface tension generated by the capillaries 41 is large enough to resist a pressure difference generated in step 809. This interrupts the filling process to fill the working fluid 5.

In order that the working fluid 5 can be filled into the cavity 33 successfully, the deaerating & filling device 6 further comprises a vaporizing device 65 for vaporizing the working fluid 5. The vaporizing device 65 comprises a first heat conduction element 651, a second heat conduction element 652, a vaporizing channel 653 formed in the first heat conduction element 651, an airtight seal strip 654 installed between the first heat conduction element 651 and the second heat conduction element 652, a flow-guiding hole 655 installed in the second heat conduction element 652 for guiding the working fluid 5 to flow to the vaporizing channel 653, and an operating hole 656 installed in the second heat conduction element 652 in communication with the vaporizing channel 653 and the vacuum pumping device (not shown) The working fluid 5 can be pure water, methyl alcohol, or other liquids. For the convenience of description, the pure water, as the working fluid 5, is described in the following paragraphs. Therefore, in step 811, both the first heat conduction element 651 and the second heat conduction element 652 are heated up to 200 C, and the vaporizing channel 653 is used to prolong the period when the working fluid 5 is stayed in the first heat conduction element 651 and the second heat conduction element 652, so as to vaporize the working fluid completely. Next in step 813, the working fluid 5 is poured through the flow-guiding hole 655, and the working fluid 5 flows into the cavity 33 due to a pressure difference. Since the package 3 is still at room temperature, the gas working fluid 5 flew into the cavity 33 is congealed through the conduction of the excess heat to the package 3 and the capillary structure 4, and is adhered to the capillaries 41. Because the sucking disk 61 used in step 807 is made of silicon, which is high temperature (250 C) resistant, in the filling process the air tightness of the entire system can be maintained.

In other practical applications, that is when the package 3 is thick (8 mm in thickness), the phenomenon of piled and adhered working fluid 5 will not happen, so the vaporizing device 65 and step 811 can be omitted, and the working fluid is filled directly in step 813.

Additionally, in step 813, a plunger pump controls a filling quantity of the working fluid 5. However, under a circumstance that the filling quantity of the working fluid is required as precise as possible, a peristaltic pump is used to replace the plunger pump.

Please refer to Fig.l8. In step 815, the first loading element 71 and the second loading element 72 combine to perform a pressure deformation process. The pressure deformation process means, at room temperature, to proceed a plastic deformation on blank, but without breaking the blank, with external pressure. A detailed description of the pressure deformation process will be described in following three embodiments. A first embodiment of the pressure deformation process, when maintaining at the air tightness described previously, makes the use of the driving device (not shown) to drive the first and the second loading elements 71, 72 to move closer to each other to compress the package 3, and to deform parts of the first loading element 71 and the second loading element 72 corresponding to the surface 311. The first loading element 71 enables an area mounted onto the opening 312 to generate a downward inward compression deformation, while the projecting part 721 enables a part on the second component 32 corresponding to the opening 312 to deform upward and to form a convex deformation. The projecting part 721 further compresses a convex part toward a center of the opening 312, so as to seal, together with the downward inward compression deformation, the opening 312 completely.

Please refer to Fig. 12. A second embodiment of the pressure deformation process, when maintaining at the air tightness described previously, drives only the first loading element 71 to move toward the second loading element 72 to compress the package 3 under a support provided by the second loading elements 72, making a part of the package 3 located on the surface 311 to be deformed completely and be compressed toward the center of the opening 312 to seal the opening 312. Note that, since the second loading element 72 is not in operation, the projecting part 721 of the second embodiment can be omitted.

Moreover, an objective of the second embodiment is to drive the first loading element 71 to move only, the pressure is smaller, and the second embodiment is suit for thin packages especially.

Please refer to Fig.17. A third embodiment of the pressure deformation process, when maintaining at the air tightness described previously, drives the second loading element 72 only to move toward the first loading element 71, and, under a support provided by the first loading element 71, makes the use of the projecting part 721 to compress the package 3, and deforming a part of the second component 32 corresponding to the surface 311 completely and compressing toward the center of the opening 312 to seal the opening 312. Moreover, an objective of the third embodiment is to drive the second loading element 72 to move only, since a convex point has a small unit area and a corresponding large applied pressure, and the third embodiment is suit for thick packages 3 especially.

When the sealed opening 312 can maintain an air tightness to a certain extent, the deaerating & filling device 6, the first loading element 71, and the second loading element 72 can all be removed. In step 817, the opening 312 is soldered to be air tightened forever, which can be achieved by the use of a spot welding technique or a soldering technique. The spot welding technique puts epoxy resin, silicon gel, or IA' gel onto the opening 312 to attain a goal of air tightness forever.

One of the soldering techniques hot welds the opening 312 with solder paste or silver tin, that is, to paste the solder paste or the silver tin in the opening 312 and send the opening 312 into a reflow or heat the opening 312 with a heating gun, so as to melt and adhere the solder paste or the silver tin to the opening 312 and to air tighten the opening 312 forever.

Another of the soldering techniques solders the opening 312 with a supersonic soldering machine or a laser finisher. As known for those skilled, the techniques applied to metal soldering are not limited to the above techniques. Those techniques described above are the preferred embodiment and do not limit other possible implementing methods.

Note that step 817 can be independent from the heat pipe manufacturing system of the present invention, and can be realized by modern soldering mechanisms and techniques, therefore overcoming current problems such as consuming too much power, and speeding the whole manufacturing flow chart.

Please refer to Fig.14. Through the use of a pressure deformation sealing process, a second embodiment of a heat pipe manufacturing method of the present invention is also designed to improve a sealing in a planar heat pipe manufacturing process. The second embodiment comprises steps 901 to 921, wherein steps 901, 903, 905, 911, and 915 are similar to steps 801, 803, 805, 811, and 815 respectively, further description of these steps hereby omitted. Only the steps different from the steps in the first embodiment are described in the following paragraphs. Please refer to Fig.15. In the preferred embodiment, the sealing process

is performed in accord with the sealing device 7 described in the first preferred embodiment, and the deaerating & filling process is performed with a current way.

Therefore, in step 907 a deaerating & filling pipe 67, the first clamping device 71, and the second clamping device 72 are installed in the package 3. Of the second preferred embodiment, the deaerating & filling pipe 67 is a steel pipe, and is jointed to the opening 312 through the use of high temperature resistant viscose or soldering techniques to provide a good enough air tightness. The viscose or the soldering techniques are similar to those described in step 817 of the first preferred embodiment, further description hereby omitted. The first clamping device 71 encircles the deaerating & filling pipe 67, and has one end against the surface 311. The second clamping device 72 has one end against the package 3 and disposed in a region corresponding to the surface 311.

In step 909, the vacuum-pumping device (not shown) reduces a pressure of the deaerating & filling pipe 67 and the cavity 33, and expels air in the cavity 33 to a region outside of the cavity 33.

Step 913 is similar to step 813 of the first preferred embodiment. A slight difference is that step 913 performs the deaerating & filling process through the use of the deaerating & filling pipe 67 directly, without using the sucking disk 61 in step 913 shown in Fig.ll, for both the viscose and the soldered place is high temperature resistant, and can maintain the air tightness of the whole system during the filling process.

Please refer to Fig.l6. In step 917, a clamping device 74 is used to clamp the deaerating & filling pipe 67. In step 919, a clipping device 75 is used to clip the deaerating & filling pipe 67 to form a clipped end surface 671. In step 921, the clipped end surface 671 is to be sealed. Detailed implementing ways are similar to step 817 described in the first preferred embodiment, further description hereby omitted.

Further, in the preferred embodiment, step 919 and step 921 can be implemented through the use of an excimer laser machine (not shown) to emit laser beams of high energy onto the deaerating & filling pipe 67 to cut the projecting part 34 and melt the clipped end surface 671, so as to obtain the effect of air tightness.

In summary, through the use of the opening 312 formed on the surface, the heat pipe manufacturing system of the present invention overcomes the problem that the air tightness is not ensured after the clamping force is removed. Therefore, the heat pipe manufacturing system of the present invention is surely capable of achieving the goals and virtues of the invention.

Following the detailed description of the present invention above, those skilled in the art will readily observe that numerous modifications and alterations of the device may be made while retaining the teachings of the invention.

Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.

Claims

1. A pressure deformation sealing method to seal in an air tight state a cavity of a ductile package, the package comprising an outer surface, and an opening installed on the outer surface in communication with the cavity, the method comprising the following steps of: (A) Providing a substantially flat surface encircling the opening; (B) Deaerating air in the cavity of the package via the opening to a region outside of the cavity; and (C) Compressing the package along a direction perpendicular to the flat surface to deform and extend part of the package to seal the opening.

2. The pressure deformation sealing method as recited in claim 1 wherein step (C) comprises the following sub-steps of: (C-i) providing a first clamping device and a second clamping device, both of which have calibers larger than that of the opening; (C-2) installing the first clamping device and the second clamping device, so that the first clamping device and the second clamping device are against the package, and one end of the first clamping device is against the surface; and (C-3) driving the first clamping device and the second clamping device to move toward each other to compress and deform the package.

3. The pressure deformation sealing method as recited in claim 1 further comprising (D) welding the opening, so as to seal the cavity of the package.

4. The pressure deformation sealing method as recited in claim 3, wherein step (D) welds the opening through the use of a spot welding technique.

5. The pressure deformation sealing method as recited in claim 3, wherein step (D) welds the opening through the use of a soldering technique.

6. The pressure deformation sealing method as recited in claim 1, wherein step (B) comprises the following sub-steps of: (B-l) mounting a sucking disk onto the opening, the sucking disk comprising a deformation part and a through hole penetrating through the deformation part, a sucking ring being formed in an outer region of the deformation part for adhering to the surface; and (B-2) inserting a deaerating & filling pipe into the through hole; and (B-3) reduce an inner pressure of the deaerating & filling pipe to perform a deaerating process, when the deformation part is deformed and absorbed to the surface to maintain air tightness.

7. A heat pipe manufacturing method through the use of a pressure deformation sealing process, the method comprising the following steps of: (E) Forming a planar hollow package made of a ductile material, the package comprising a cavity; (F) Providing a substantially flat surface installed on the package and forming an opening on the surface for connecting to the cavity; (G) Deaerating air in the cavity via the opening; (H) Filling working fluid via the opening into the cavity; and (I) Compressing the package along a direction perpendicular to the flat surface to deform and extend part of the package to seal the opening.

8. The heat pipe manufacturing method as recited in claim 7, wherein step (I) comprises the following sub-steps of: (1-1) providing a first clamping device and a second clamping device, both of which have calibers larger than that of the opening; (1-2) installing the first clamping device and the second clamping device, so that the first clamping device and the second clamping device are against the package, and one end of the first clamping device is against the surface; and (1-3) driving the first clamping device and the second clamping device to move toward each other to compress and deform the package.

9. The heat pipe manufacturing method as recited in claim 7 further comprising (J) welding the opening, so as to seal the cavity of the package.

10. The heat pipe manufacturing method as recited in claim 9, wherein step (J) welds the opening through the use of a spot welding technique.

11. The heat pipe manufacturing method as recited in claim 9, wherein step (J) welds the opening through the use of a spot soldering technique.

12. The heat pipe manufacturing method as recited in claim 7, wherein step (G) comprises the following sub-steps of: (G-1) mounting a sucking disk onto the opening, the sucking disk comprising a deformation part and a through hole penetrating through the deformation part, a sucking ring being formed in an outer region of the deformation part for adhering to the surface; and (G-2) inserting a deaerating & filling pipe into the through hole; and (G-3) reduce an inner pressure of the deaerating & filling pipe to perform a deaerating process, when the deformation part is deformed and absorbed to the surface to maintain air tightness.

13. The heat pipe manufacturing method as recited in claim 7, wherein step (H) fills working fluid via the opening into the cavity through the use of a deaerating & filling pipe to insert into the through hole.