GB2419895B - Shielding design for backside metal deposition - Google Patents
Shielding design for backside metal depositionInfo
- Publication number
- GB2419895B GB2419895B GB0521968A GB0521968A GB2419895B GB 2419895 B GB2419895 B GB 2419895B GB 0521968 A GB0521968 A GB 0521968A GB 0521968 A GB0521968 A GB 0521968A GB 2419895 B GB2419895 B GB 2419895B
- Authority
- GB
- United Kingdom
- Prior art keywords
- metal deposition
- backside metal
- shielding design
- shielding
- design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001465 metallisation Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0424371A GB0424371D0 (en) | 2004-11-04 | 2004-11-04 | Shielding design for backside metal deposition |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0521968D0 GB0521968D0 (en) | 2005-12-07 |
GB2419895A GB2419895A (en) | 2006-05-10 |
GB2419895B true GB2419895B (en) | 2010-09-22 |
Family
ID=33523157
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0424371A Ceased GB0424371D0 (en) | 2004-11-04 | 2004-11-04 | Shielding design for backside metal deposition |
GB0521968A Active GB2419895B (en) | 2004-11-04 | 2005-10-28 | Shielding design for backside metal deposition |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0424371A Ceased GB0424371D0 (en) | 2004-11-04 | 2004-11-04 | Shielding design for backside metal deposition |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102005052027A1 (en) |
GB (2) | GB0424371D0 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9194038B2 (en) * | 2009-12-28 | 2015-11-24 | Canon Anelva Corporation | Thin film forming apparatus, thin film forming method, and shield component |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0553691A1 (en) * | 1992-01-22 | 1993-08-04 | Applied Materials, Inc. | Passive shield for CVD wafer processing which prevents frontside edge and backside deposition |
US5275683A (en) * | 1991-10-24 | 1994-01-04 | Tokyo Electron Limited | Mount for supporting substrates and plasma processing apparatus using the same |
US5411624A (en) * | 1991-07-23 | 1995-05-02 | Tokyo Electron Limited | Magnetron plasma processing apparatus |
US5529657A (en) * | 1993-10-04 | 1996-06-25 | Tokyo Electron Limited | Plasma processing apparatus |
US5942042A (en) * | 1997-05-23 | 1999-08-24 | Applied Materials, Inc. | Apparatus for improved power coupling through a workpiece in a semiconductor wafer processing system |
US6051122A (en) * | 1997-08-21 | 2000-04-18 | Applied Materials, Inc. | Deposition shield assembly for a semiconductor wafer processing system |
GB2350374A (en) * | 1999-05-11 | 2000-11-29 | Trikon Holdings Ltd | Deposition apparatus |
US6159299A (en) * | 1999-02-09 | 2000-12-12 | Applied Materials, Inc. | Wafer pedestal with a purge ring |
US6306244B1 (en) * | 1996-09-30 | 2001-10-23 | Lam Research Corporation | Apparatus for reducing polymer deposition on substrate support |
US6344105B1 (en) * | 1999-06-30 | 2002-02-05 | Lam Research Corporation | Techniques for improving etch rate uniformity |
US20020066531A1 (en) * | 1996-11-29 | 2002-06-06 | Applied Materials, Inc. | Shield or ring surrounding semiconductor workpiece in plasma chamber |
US6475336B1 (en) * | 2000-10-06 | 2002-11-05 | Lam Research Corporation | Electrostatically clamped edge ring for plasma processing |
US20040083975A1 (en) * | 2002-09-20 | 2004-05-06 | Lam Research Corporation | Apparatus for reducing polymer deposition on a substrate and substrate support |
-
2004
- 2004-11-04 GB GB0424371A patent/GB0424371D0/en not_active Ceased
-
2005
- 2005-10-28 GB GB0521968A patent/GB2419895B/en active Active
- 2005-10-31 DE DE102005052027A patent/DE102005052027A1/en not_active Ceased
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5411624A (en) * | 1991-07-23 | 1995-05-02 | Tokyo Electron Limited | Magnetron plasma processing apparatus |
US5275683A (en) * | 1991-10-24 | 1994-01-04 | Tokyo Electron Limited | Mount for supporting substrates and plasma processing apparatus using the same |
EP0553691A1 (en) * | 1992-01-22 | 1993-08-04 | Applied Materials, Inc. | Passive shield for CVD wafer processing which prevents frontside edge and backside deposition |
US5529657A (en) * | 1993-10-04 | 1996-06-25 | Tokyo Electron Limited | Plasma processing apparatus |
US6306244B1 (en) * | 1996-09-30 | 2001-10-23 | Lam Research Corporation | Apparatus for reducing polymer deposition on substrate support |
US20020066531A1 (en) * | 1996-11-29 | 2002-06-06 | Applied Materials, Inc. | Shield or ring surrounding semiconductor workpiece in plasma chamber |
US5942042A (en) * | 1997-05-23 | 1999-08-24 | Applied Materials, Inc. | Apparatus for improved power coupling through a workpiece in a semiconductor wafer processing system |
US6051122A (en) * | 1997-08-21 | 2000-04-18 | Applied Materials, Inc. | Deposition shield assembly for a semiconductor wafer processing system |
US6159299A (en) * | 1999-02-09 | 2000-12-12 | Applied Materials, Inc. | Wafer pedestal with a purge ring |
GB2350374A (en) * | 1999-05-11 | 2000-11-29 | Trikon Holdings Ltd | Deposition apparatus |
US6344105B1 (en) * | 1999-06-30 | 2002-02-05 | Lam Research Corporation | Techniques for improving etch rate uniformity |
US6475336B1 (en) * | 2000-10-06 | 2002-11-05 | Lam Research Corporation | Electrostatically clamped edge ring for plasma processing |
US20040083975A1 (en) * | 2002-09-20 | 2004-05-06 | Lam Research Corporation | Apparatus for reducing polymer deposition on a substrate and substrate support |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9194038B2 (en) * | 2009-12-28 | 2015-11-24 | Canon Anelva Corporation | Thin film forming apparatus, thin film forming method, and shield component |
Also Published As
Publication number | Publication date |
---|---|
GB0521968D0 (en) | 2005-12-07 |
GB0424371D0 (en) | 2004-12-08 |
DE102005052027A1 (en) | 2006-05-24 |
GB2419895A (en) | 2006-05-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) |
Free format text: REGISTERED BETWEEN 20150716 AND 20150722 |