GB2417132A - Method of forming a catalyst containing layer over a patterned dielectric - Google Patents

Method of forming a catalyst containing layer over a patterned dielectric Download PDF

Info

Publication number
GB2417132A
GB2417132A GB0513698A GB0513698A GB2417132A GB 2417132 A GB2417132 A GB 2417132A GB 0513698 A GB0513698 A GB 0513698A GB 0513698 A GB0513698 A GB 0513698A GB 2417132 A GB2417132 A GB 2417132A
Authority
GB
United Kingdom
Prior art keywords
forming
containing layer
layer over
catalyst containing
patterned dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0513698A
Other versions
GB2417132B (en
GB0513698D0 (en
Inventor
Markus Nopper
Axel Preusse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10302644A external-priority patent/DE10302644B3/en
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of GB0513698D0 publication Critical patent/GB0513698D0/en
Publication of GB2417132A publication Critical patent/GB2417132A/en
Application granted granted Critical
Publication of GB2417132B publication Critical patent/GB2417132B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H01L21/76846—Layer combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76853—Barrier, adhesion or liner layers characterized by particular after-treatment steps
    • H01L21/76855—After-treatment introducing at least one additional element into the layer
    • H01L21/76859—After-treatment introducing at least one additional element into the layer by ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L21/76873—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroplating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L21/76874—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroless plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/10—Applying interconnections to be used for carrying current between separate components within a device
    • H01L2221/1068—Formation and after-treatment of conductors
    • H01L2221/1073—Barrier, adhesion or liner layers
    • H01L2221/1084—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L2221/1089—Stacks of seed layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
    • H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

A metal layer is maybe formed by means of a plating process on a surface region of an underlying material catalytically activated in that a catalyst is deposited or incorporated by CVD, PVD or ALD at least partially during the deposition of the underlying material. In this way, superior metal seed layers may be formed in high aspect ratio vias of metallization structures.

Description

GB 2417132 A continuation (72) Inventor(s): Markus Napper Axel Preusse
(74) Agent and/or Address for Service: Brookes Batchellor LLP 102-108 Clerkenwell Road, LONDON, EC1M USA, United Kingdom
GB0513698A 2003-01-23 2003-12-22 Method of forming a metal layer over a patterned dielectric by electroless deposition using a catalyst Expired - Lifetime GB2417132B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10302644A DE10302644B3 (en) 2003-01-23 2003-01-23 Process for producing a metal layer over a structured dielectric by means of electroless deposition using a catalyst
US10/602,192 US6951816B2 (en) 2003-01-23 2003-06-24 Method of forming a metal layer over patterned dielectric by electroless deposition using a catalyst
PCT/US2003/041185 WO2004068576A2 (en) 2003-01-23 2003-12-22 Method of forming a catalyst containing layer over a patterned dielectric

Publications (3)

Publication Number Publication Date
GB0513698D0 GB0513698D0 (en) 2005-08-10
GB2417132A true GB2417132A (en) 2006-02-15
GB2417132B GB2417132B (en) 2007-04-04

Family

ID=32826166

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0513698A Expired - Lifetime GB2417132B (en) 2003-01-23 2003-12-22 Method of forming a metal layer over a patterned dielectric by electroless deposition using a catalyst

Country Status (5)

Country Link
JP (1) JP5214092B2 (en)
KR (1) KR101098568B1 (en)
AU (1) AU2003299875A1 (en)
GB (1) GB2417132B (en)
WO (1) WO2004068576A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6943106B1 (en) * 2004-02-20 2005-09-13 Micron Technology, Inc. Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling
JP2006128288A (en) * 2004-10-27 2006-05-18 Tokyo Electron Ltd Film forming method, semiconductor device, manufacturing method thereof, program, and recording medium
EP2067878B1 (en) * 2007-07-31 2017-03-22 JX Nippon Mining & Metals Corporation Plated material having metal thin film formed by electroless plating, and method for production thereof
WO2010087392A1 (en) * 2009-01-30 2010-08-05 日鉱金属株式会社 Substrate comprising alloy film of metal element having barrier function and metal element having catalytic power
US20220344205A1 (en) * 2019-09-25 2022-10-27 Tokyo Electron Limited Substrate liquid processing method and substate liquid processing apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5969422A (en) * 1997-05-15 1999-10-19 Advanced Micro Devices, Inc. Plated copper interconnect structure
US6461675B2 (en) * 1998-07-10 2002-10-08 Cvc Products, Inc. Method for forming a copper film on a substrate

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4574095A (en) * 1984-11-19 1986-03-04 International Business Machines Corporation Selective deposition of copper
JPH0762545A (en) * 1993-08-30 1995-03-07 Mitsubishi Cable Ind Ltd Wiring board and its production
US6197688B1 (en) * 1998-02-12 2001-03-06 Motorola Inc. Interconnect structure in a semiconductor device and method of formation
US6380083B1 (en) * 1998-08-28 2002-04-30 Agere Systems Guardian Corp. Process for semiconductor device fabrication having copper interconnects
US6610596B1 (en) * 1999-09-15 2003-08-26 Samsung Electronics Co., Ltd. Method of forming metal interconnection using plating and semiconductor device manufactured by the method
JP2001240960A (en) * 1999-12-21 2001-09-04 Nippon Sheet Glass Co Ltd Article coated with photocatalytic film, method of manufacturing for the article, and sputtering target used for depositing the film
KR100338112B1 (en) * 1999-12-22 2002-05-24 박종섭 Method of forming a copper wiring in a semiconductor device
CN1174118C (en) * 2000-01-07 2004-11-03 株式会社日矿材料 Method for metal plating, pretreating agent, and semiconductor wafer and semiconductor device using same
JP2001335952A (en) * 2000-05-31 2001-12-07 Rikogaku Shinkokai Electroless plating method, wiring device and its production method
JP2002004081A (en) * 2000-06-16 2002-01-09 Learonal Japan Inc Electroplating method to silicon wafer
US6479902B1 (en) * 2000-06-29 2002-11-12 Advanced Micro Devices, Inc. Semiconductor catalytic layer and atomic layer deposition thereof
JP2002025943A (en) * 2000-07-12 2002-01-25 Ebara Corp Substrate film forming method
JP2002053971A (en) * 2000-08-03 2002-02-19 Sony Corp Plating method, plating structure, method for producing semiconductor device, and semiconductor device
EP1180553A1 (en) * 2000-08-15 2002-02-20 Air Products And Chemicals, Inc. CVD process for depositing copper on a barrier layer
JP4083968B2 (en) * 2000-11-02 2008-04-30 株式会社東芝 Manufacturing method of semiconductor device
US20020064592A1 (en) * 2000-11-29 2002-05-30 Madhav Datta Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
US6596344B2 (en) * 2001-03-27 2003-07-22 Sharp Laboratories Of America, Inc. Method of depositing a high-adhesive copper thin film on a metal nitride substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5969422A (en) * 1997-05-15 1999-10-19 Advanced Micro Devices, Inc. Plated copper interconnect structure
US6461675B2 (en) * 1998-07-10 2002-10-08 Cvc Products, Inc. Method for forming a copper film on a substrate

Also Published As

Publication number Publication date
GB2417132B (en) 2007-04-04
WO2004068576A2 (en) 2004-08-12
JP5214092B2 (en) 2013-06-19
KR20050088363A (en) 2005-09-05
KR101098568B1 (en) 2011-12-26
WO2004068576A3 (en) 2004-09-10
GB0513698D0 (en) 2005-08-10
AU2003299875A1 (en) 2004-08-23
JP2006513325A (en) 2006-04-20

Similar Documents

Publication Publication Date Title
WO2002103782A3 (en) Barrier enhancement process for copper interconnects
WO2003031679A3 (en) Method for depositing metal layers employing sequential deposition techniques
WO2007021527A3 (en) Microfabrication using replciated patterned topography and self-assembled monolayers
WO2006102180A3 (en) Contact metallization methods and processes
EP1094503A3 (en) Barrier layer for aluminium metallisation
WO2003076678A3 (en) Ald method and apparatus
GB2425308A (en) Tantalum amide complexes for depositing tantalum-containing films, and method of making same
WO2002079537A3 (en) W-cvd with fluorine-free tungsten nucleation
EP1077484A3 (en) Barrier layer for electroplating processes
TW200644164A (en) Method for forming a barrier/seed layer for copper metallization
TW200717709A (en) A method for forming a ruthenium metal layer on a patterned substrate
JP2002011700A5 (en)
AU2002217822A1 (en) Electroless method of seed layer deposition, repair, and fabrication of cu interconnects
JP2004536225A5 (en)
EP0890659A3 (en) Process for applying protective and decorative coating on an article
EP1201787A3 (en) Plating catalysts
EP0831523A3 (en) Semi-selective chemical vapor deposition of conducting material
EP1249861A3 (en) A multi-step method for metal deposition
WO2003038875A3 (en) Method for photolithographic structuring by means of a carbon hard mask layer which has a diamond-like hardness and is deposited by means of a plasma method
EP1094504A3 (en) PVD-IMP tungsten and tungsten nitride as a liner, barrier, and/or seed layer
EP0386658A3 (en) Wear resistant coating for sharp-edged tools and the like
WO2006044446A3 (en) Organometallic compounds and processes for preparation thereof
CA2553564A1 (en) Coated abrasives
EP1179843A3 (en) Plasma treatment of tantalum nitride compound films formed by chemical vapor deposition
EP1426328A3 (en) Method for manufacturing of uniformly sized and controled semi-conductor nano structures by CVD process on dieletric

Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20231221