GB2412499A - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
GB2412499A
GB2412499A GB0412614A GB0412614A GB2412499A GB 2412499 A GB2412499 A GB 2412499A GB 0412614 A GB0412614 A GB 0412614A GB 0412614 A GB0412614 A GB 0412614A GB 2412499 A GB2412499 A GB 2412499A
Authority
GB
United Kingdom
Prior art keywords
fins
heat dissipating
base
connection part
inclined surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0412614A
Other versions
GB0412614D0 (en
Inventor
Yung-Pin Kuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB0412614D0 publication Critical patent/GB0412614D0/en
Publication of GB2412499A publication Critical patent/GB2412499A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink comprises a base 20, e.g. of copper, with inclined sides on which are mounted a heat-dissipating section 10, e.g. of aluminium, with fins 11 formed by skiving. The heat sink may be used in conjunction with a fan 30. In an alternative embodiment (Fig 7A) the base may be omitted.

Description

HEAT DISSIPATING DEVICE WITH FINS INCLINEDLY CONNECTED
TO BASE
FIELD OF THE INVENTION
The present invention relates to a heat dissipating device having a high heat conduction base and fins which have inclined ends connected to the base.
BACKGROUND OF THE INVENTION
A conventional heat dissipating device generally uses aluminum which has better heat dissipation feature and the fins made by aluminum are made by way of extruding. However, the pitches between the fins and the thickness of the fins are limited so that the number of the fins is limited. The less number of the fins reduces the ability of dissipating the heat. Another method for making the fins of the conventional dissipating device is skiving which may have thinner fins and smaller pitches between the fins. A fan is required to increase the speed of the air flow through the fins so as to bring the heat away. Nevertheless, a negative pressure is produced when the air flow goes through the gaps between the fins and that reduces the efficiency of heat dissipating process.
The present invention intends to provide a heat dissipating device that includes a copper made base which has an inclined end to which an aluminum made connection part is connected and a plurality of fins extend from the aluminum made connection part.
SUMMARY OF THE INVENTION
The present invention relates to a heat dissipating device which comprises a base made of high heat conduction material and the base includes at least one inclined side. A heat dissipating portion made of high heat dissipating material has a connection part which has a first inclined surface with which the at least o ne i nclined side o f t he b ase is c onnected, and a second i nclined s urface which is located in opposite to the first inclined surface. A plurality of fins are made by way of skiving from the second inclined surface of the connection part.
The present invention will become more obvious from the following description when taken in connection with the accompanying drawings which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. I is a first embodiment of the heat dissipating device of the present 1 5 invention; Fig. 1A illustrates the method of skiving for making the fins; Fig. 1B is an exploded view to show the heat dissipating device of the present invention as shown in Fig. 1; Fig. 2 shows a fan is located above the fins and a heat source is in contact with the base; Fig. 2A shows the path of the air flow through the gaps between the fins; Fig. 3 is a second embodiment of the heat dissipating device of the present invention; Fig. 3A is a cross sectional view to show the heat dissipating device of the present invention as shown in Fig. 3; Fig. 4 is a third embodiment of the heat dissipating device of the present invention; 5Fig. 4A is a cross sectional view to show the heat dissipating device of the present invention as shown in Fig. 4; Fig. 5 is a fourth embodiment of the heat dissipating device of the present invention; Fig. 5A is a cross sectional view to show the heat dissipating device of 10the present invention as shown in Fig. 5; Fig. 6 shows the heat dissipating device of the present invention is used in a personal computer with a fan connected on the heat dissipating portion; Fig. 7 shows a fifth embodiment of the heat dissipating device of the present invention; 15Fig. 7A shows a sixth embodiment of the heat dissipating device of the present invention, and Fig. 8 shows a fan is cooperated with the heat dissipating device of the present invention as shown in Fig. 7.
Attachment 1: comparison of heat transfer between the heat dissipating 20device of the present invention and the conventional heat dissipating device; Attachment 2: test details of thermal resistance of the heat dissipating device of the present invention; Attachment 3: test details of thermal resistance of a conventional heat dissipating device.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring to Figs. 1, 1A and 1B, the heat dissipating device "A" of the present invention comprises a base 20 made of high heat conduction material such as cupper and having two inclined sides 21. Two heat dissipating portions each include a connection part 10 which has a first inclined surface 100 and a second inclined surface 101 which is located in opposite to the first inclined surface 100.
The connection part 10 is made of high heat dissipating material such as aluminum and connected to the base 20 by connecting the first inclined surface of the connection part 10 to the one of the two inclined sides 21 of the base 20. A plurality of fins 11 is made by way of skiving from the second inclined surface 101 of the connection part 10. The fins 1 1 each have a flat and horizontal upper edge 111 and an upward inclined lower edge 1 10.
l S Further referring to Figs. 2, 2A and 6, the base 20 is put on a heat source 41 on a electric part 40 and a fan 30 is connected to a top of the heat dissipating device "A". The heat is conducted from the heat source 41 to the base 20 and the temperature is dispensed as shown by the shade area and the fan 30 provides air flow to go through the gaps between the fins 11. The heat is brought away from the fins 11 as shown in arrow heads.
As shown in Figs. 3 and 3A, the base 20 may include a groove 210 defined in a top surface thereof so that a locking component (not shown) can be engaged therewith to position the device. The fins 11 extend from the second inclined side 101 of the connection part 10 at an angle relative to a normal line of the second inclined side 101. The fins 11 are orientated symmetrically to a mediate point of the elongate base 20 so that the gaps are wider than those shown in Fig. 1.
Figs. 4 and 4A show that the device "A" is composed of two identical parts and the two respective bases are connected to each other so as to have a groove 210 defined in a top of the base 20 and a ridge extends from an inner bottom of the groove 210. The ridge is designed for being connected to the locking component. Each of the fins 11 of the device "A" has a flat and upward upper edge 1 10.
Figs. 5 and 5A show another embodiment that is similar to the embodiment as disclosed in Figs. 4 and 4A, except for that there is no ridge as disclosed in Fig. 4, in the groove 210 of the base 20.
Referring to Figs. 7 and 8, the connection part 10 may have an extension 102 extending from the first inclined surface 100 and the extension 102 is connected on a top of the base 20. The fins 11 extend horizontally from the second inclined side 101 of the connection part 10. For this embodiment, the fan is located at an end of the device "A" so that the air flow goes through the gaps between the fins 11 horizontally. Fig. 7A shows that the device "A" is composed of two heat dissipating portions wherein the two connection parts 10 are connected directly with each other and to be put on the heat source which is not shown in this drawing.
Attachment 1 shows that the heat dissipating device "A" of the present invention and a conventional heat dissipating device are put on a heat source, wherein the maximum temperature area is shown in red and the lowest temperature area is shown in green. It is obvious that the base 20 of the device "A" of the present invention is shown in red which means the heat of the heat source is transferred to the base 20. The green is shown at the distal edge of the fins 11 and this means the fins 11 of the device "A" has good heat dissipation feature. This result is much better that the conventional heat dissipating device.
Attachment 2 shows that the thermal resistance of the device "A" is 0.218 degree C/W which is better than that the thermal resistance 0.267 degree C/W for the conventional heat dissipating device as shown in the Attachment 3.
While we have shown and described the embodiment in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present 1 5 invention.

Claims (10)

  1. WHAT IS CLAIMED IS: 1. A heat dissipating device comprising: a base having
    at least one inclined side and made of high heat conduction material, and a heat dissipating portion having a connection part which has a first inclined surface and a second inclined surface which is located in opposite to the first inclined surface, the connection part connected to the base by connecting the first inclined surface of the connection part to the at least one inclined side of the base, a plurality of fins made by way of skiving from the second inclined surface of the connection part.
  2. 2. The device as claimed in claim 1, wherein the fins each have an upward inclined lower edge.
  3. 3. The device as claimed in claim 1, wherein the fins each have a flat and horizontal upper edge.
  4. 4. The device as claimed in claim 1, wherein the fins each have a flat and upward upper edge.
  5. 5. The device as claimed in claim 1, wherein the connection part has an extension extending from the first inclined surface and the extension is connected on a top of the base.
  6. 6. The device as claimed in claim 1, wherein the base is made by copper.
  7. 7. The device as claimed in claim 1, wherein the heat dissipating portion is made by aluminum.
  8. 8. The device as claimed in claim 1, wherein the base includes a groove defined in a top surface thereof.
  9. 9. The device as claimed in claim 1, wherein the fins extend from the second inclined side of the connection part at an angle relative to a normal line of the second inclined side.
  10. 10. A heat dissipating device substantially as hereinbefore described with reference to and as illustrated in the accompanying drawings.
GB0412614A 2004-03-26 2004-06-07 Heat sink Withdrawn GB2412499A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93204650U TWM254653U (en) 2004-03-26 2004-03-26 Novel tilted heat sink structure of composite type

Publications (2)

Publication Number Publication Date
GB0412614D0 GB0412614D0 (en) 2004-07-07
GB2412499A true GB2412499A (en) 2005-09-28

Family

ID=32986295

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0412614A Withdrawn GB2412499A (en) 2004-03-26 2004-06-07 Heat sink

Country Status (3)

Country Link
DE (1) DE202004009233U1 (en)
GB (1) GB2412499A (en)
TW (1) TWM254653U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102236397A (en) * 2010-04-30 2011-11-09 技嘉科技股份有限公司 Double-fan heat dissipation device with dust extraction function as well as control circuit and fin group thereof

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL2384108T3 (en) * 2010-04-27 2014-06-30 Giga Byte Tech Co Ltd Dust-disposal heat-dissipation device with double cooling fans
TWI635385B (en) * 2012-11-09 2018-09-11 技嘉科技股份有限公司 Heat sink and method of manufacturing thereof
TWI578671B (en) * 2014-01-10 2017-04-11 技嘉科技股份有限公司 Heat sink with heat pipe and manufacturing method thereof
TWI556088B (en) * 2014-12-31 2016-11-01 Giga Byte Tech Co Ltd Radiator structure

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2362353A1 (en) * 1973-12-14 1975-06-26 Siemens Ag Heat sink for semiconductor component - has massive core column with component receiving surface and lateral cooling fins
JP2000353889A (en) * 1999-06-09 2000-12-19 Nec Ibaraki Ltd Cooler
JP2001148450A (en) * 1999-11-19 2001-05-29 Hiromi Kataoka Forced-air cooling heat sink and method of manufacturing the same
EP1117130A2 (en) * 2000-01-14 2001-07-18 Matsushita Electric Industrial Co., Ltd. Heatsink method of manufacturing the same and cooling apparatus using the same
JP2003078081A (en) * 2001-09-05 2003-03-14 Nakamura Mfg Co Ltd Forming method of heatsink
US6550531B1 (en) * 2000-05-16 2003-04-22 Intel Corporation Vapor chamber active heat sink
GB2385661A (en) * 2002-01-14 2003-08-27 Yung-Pin Kuo Heat dissipation device for electronic parts
US20040066624A1 (en) * 2002-10-04 2004-04-08 Lee Hsieh Kun Heat dissipation device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2362353A1 (en) * 1973-12-14 1975-06-26 Siemens Ag Heat sink for semiconductor component - has massive core column with component receiving surface and lateral cooling fins
JP2000353889A (en) * 1999-06-09 2000-12-19 Nec Ibaraki Ltd Cooler
JP2001148450A (en) * 1999-11-19 2001-05-29 Hiromi Kataoka Forced-air cooling heat sink and method of manufacturing the same
EP1117130A2 (en) * 2000-01-14 2001-07-18 Matsushita Electric Industrial Co., Ltd. Heatsink method of manufacturing the same and cooling apparatus using the same
US6550531B1 (en) * 2000-05-16 2003-04-22 Intel Corporation Vapor chamber active heat sink
JP2003078081A (en) * 2001-09-05 2003-03-14 Nakamura Mfg Co Ltd Forming method of heatsink
GB2385661A (en) * 2002-01-14 2003-08-27 Yung-Pin Kuo Heat dissipation device for electronic parts
US20040066624A1 (en) * 2002-10-04 2004-04-08 Lee Hsieh Kun Heat dissipation device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102236397A (en) * 2010-04-30 2011-11-09 技嘉科技股份有限公司 Double-fan heat dissipation device with dust extraction function as well as control circuit and fin group thereof
CN102236397B (en) * 2010-04-30 2015-04-01 技嘉科技股份有限公司 Double-fan heat dissipation device with dust extraction function as well as control circuit and fin group thereof

Also Published As

Publication number Publication date
TWM254653U (en) 2005-01-01
GB0412614D0 (en) 2004-07-07
DE202004009233U1 (en) 2004-09-09

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Legal Events

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WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)