DE202004009233U1 - Heatsink with sloping surfaces - Google Patents
Heatsink with sloping surfaces Download PDFInfo
- Publication number
- DE202004009233U1 DE202004009233U1 DE200420009233 DE202004009233U DE202004009233U1 DE 202004009233 U1 DE202004009233 U1 DE 202004009233U1 DE 200420009233 DE200420009233 DE 200420009233 DE 202004009233 U DE202004009233 U DE 202004009233U DE 202004009233 U1 DE202004009233 U1 DE 202004009233U1
- Authority
- DE
- Germany
- Prior art keywords
- heat sink
- core
- inclined surface
- slats
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Kühlkörper mit
einem Kern und mit mindestens einem Wärmeabfuhr-Bereich, der eine
Vielzahl von Lamellen aufweist,
a) wobei der Kern mindestens
eine geneigte Seite aufweist und aus einem Werkstoff mit hoher Wärmeleitfähigkeit
gefertigt ist,
b) wobei der Wärmeabfuhr-Bereich ein Anschlussstück mit einer
ersten geneigten Oberfläche
und einer gegenüberliegend
angeordneten, zweiten geneigten Oberfläche aufweist,
c) wobei
das Anschlussstück
mit seiner ersten geneigte Oberfläche an der geneigten Seite
des Kerns anliegt,
d) und wobei die Lamellen in einem Skiving-Verfahren
aus der zweiten geneigten Oberfläche
des Anschlussstücks
herausgearbeitet sind.Heatsink with a core and with at least one heat dissipation area, which has a plurality of fins,
a) wherein the core has at least one inclined side and is made of a material with high thermal conductivity,
b) the heat dissipation region having a connection piece with a first inclined surface and an oppositely arranged, second inclined surface,
c) the connection piece resting with its first inclined surface on the inclined side of the core,
d) and the lamellae are worked out from the second inclined surface of the connecting piece in a skiving process.
Description
Die vorliegende Neuerung betrifft einen Kühlkörper mit einem Kern und mit mindestens einem Wärmeabfuhr-Bereich, der eine Vielzahl von Lamellen aufweist.The The present innovation relates to a heat sink with a core and with at least one heat dissipation area, which has a large number of slats.
Ein herkömmlicher Kühlkörper besteht gewöhnlich aus Aluminium, welches sich durch eine gute Wärmeabgabefähigkeit auszeichnet. Die Lamellen bestehen ebenfalls aus Aluminium und sind extrudiert. Der Abstand zwischen den Lamellen und ihre Stärke sind begrenzt, so dass auch die Anzahl der Lamellen ebenfalls begrenzt ist. Eine geringe Anzahl von Lamellen reduziert die Fähigkeit, Wärme abzugeben.On conventional There is a heat sink usually made of aluminum, which is characterized by good heat dissipation. The slats are also made of aluminum and are extruded. The distance between the slats and their thickness are limited so that the number of slats is also limited. A minor one Number of fins reduces the ability to give off heat.
Eine andere Möglichkeit, Lamellen eines herkömmlichen Kühlkörpers herzustellen, sind sogenannte Skiving-Verfahren. Diese ermöglichen dünnere Lamellen und dichtere Abstände zwischen ihnen. Ein Lüfter ist erforderlich, um die Luftbewegung durch die Lamellen zwecks Wärmeabfuhr zu steigern. Jedoch erzeugt die durch die Spalten zwischen den Lamellen strömende Luft einen Unterdruck, der wiederum die Effizienz der Wärmeabfuhr mindert.A different possibility, Slats of a conventional To produce a heat sink, are so-called skiving procedures. These enable thinner slats and denser ones distances between them. A fan is required to allow air movement through the fins heat dissipation to increase. However, this is caused by the gaps between the slats flowing Air a negative pressure, which in turn increases the efficiency of heat dissipation decreases.
Die vorliegende Neuerung macht es sich zur Aufgabe, einen Kühlkörper mit anzugeben, der eine hohe Wärmeabgabeleistung erreicht.The This innovation makes it its task to use a heat sink specify the high heat dissipation reached.
Dies gelingt durch einen Kühlkörper, der einen Kern aus einem hoch wärmeleitfähigen Werkstoff umfasst, der zumindest eine geneigte Seite aufweist. Ein Wärmeabfuhr-Bereich, der aus einem hoch wärmeabgabefähigen Werkstoff besteht, weist ein Anschlussstück mit einer ersten geneigten Oberfläche auf, die an der geneigten Seite des Kerns anliegt. Aus einer zweiten geneigte Oberfläche des Anschlussstücks, die gegenüberliegend der ersten geneigten Oberfläche angeordnet ist, ist eine Vielzahl von Lamellen durch ein Skiving-Verfahren herausgearbeitet.This succeeds through a heat sink, the a core made of a highly thermally conductive material comprises at least one inclined side. A heat dissipation area made of a highly heat-emitting material there is a connector with a first inclined surface on the inclined surface Side of the core. From a second inclined surface of the Fitting, the opposite the first inclined surface is arranged, a plurality of slats by a skiving process worked out.
Die vorliegende Neuerung soll nun anhand der folgenden Beschreibung unter Einbeziehung der beiliegenden Zeichnungen verdeutlicht werden. Es sei darauf hingewiesen, dass die Zeichnungen lediglich der Illustration dienen, sie stellen bevorzugte Ausführungsformen der vorliegenden Neuerung dar:The This innovation is now based on the following description with the help of the accompanying drawings. It should be noted that the drawings are for illustration only serve, they represent preferred embodiments of the present Innovation is:
Zu
den
Zu
den
Zu
den
Die
Die
Bezüglich der
Es sei darauf hingewiesen, dass die vorgestellten Ausführungsformen für die Ausführung der vorliegenden Neuerung nur beispielhaft sind. Dem Fachmann gelingt es, weitere Ausführungsformen im Wesen der Neuerung zu gestalten.It it should be noted that the presented embodiments for the execution the present innovation are only exemplary. The specialist succeeds it, other embodiments to shape in the nature of innovation.
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093204650 | 2004-03-26 | ||
TW93204650U TWM254653U (en) | 2004-03-26 | 2004-03-26 | Novel tilted heat sink structure of composite type |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202004009233U1 true DE202004009233U1 (en) | 2004-09-09 |
Family
ID=32986295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200420009233 Expired - Lifetime DE202004009233U1 (en) | 2004-03-26 | 2004-06-14 | Heatsink with sloping surfaces |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE202004009233U1 (en) |
GB (1) | GB2412499A (en) |
TW (1) | TWM254653U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2384108A3 (en) * | 2010-04-27 | 2011-12-14 | Giga-Byte Technology Co., Ltd. | Dust-disposal heat-dissipation device with double cooling fans |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102236397B (en) * | 2010-04-30 | 2015-04-01 | 技嘉科技股份有限公司 | Double-fan heat dissipation device with dust extraction function as well as control circuit and fin group thereof |
TWI635385B (en) * | 2012-11-09 | 2018-09-11 | 技嘉科技股份有限公司 | Heat sink and method of manufacturing thereof |
TWI578671B (en) * | 2014-01-10 | 2017-04-11 | 技嘉科技股份有限公司 | Heat sink with heat pipe and manufacturing method thereof |
TWI556088B (en) * | 2014-12-31 | 2016-11-01 | Giga Byte Tech Co Ltd | Radiator structure |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2362353A1 (en) * | 1973-12-14 | 1975-06-26 | Siemens Ag | Heat sink for semiconductor component - has massive core column with component receiving surface and lateral cooling fins |
JP3431004B2 (en) * | 2000-01-14 | 2003-07-28 | 松下電器産業株式会社 | Heat sink and cooling device using the same |
JP2000353889A (en) * | 1999-06-09 | 2000-12-19 | Nec Ibaraki Ltd | Cooler |
JP2001148450A (en) * | 1999-11-19 | 2001-05-29 | Hiromi Kataoka | Forced-air cooling heat sink and method of manufacturing the same |
US6550531B1 (en) * | 2000-05-16 | 2003-04-22 | Intel Corporation | Vapor chamber active heat sink |
JP2003078081A (en) * | 2001-09-05 | 2003-03-14 | Nakamura Mfg Co Ltd | Forming method of heatsink |
TW530993U (en) * | 2002-01-14 | 2003-05-01 | Chia Cherne Industry Co Ltd | Dual tilted-side heat sink base structure to reduce the fan pressure reduction |
US6816373B2 (en) * | 2002-10-04 | 2004-11-09 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation device |
-
2004
- 2004-03-26 TW TW93204650U patent/TWM254653U/en not_active IP Right Cessation
- 2004-06-07 GB GB0412614A patent/GB2412499A/en not_active Withdrawn
- 2004-06-14 DE DE200420009233 patent/DE202004009233U1/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2384108A3 (en) * | 2010-04-27 | 2011-12-14 | Giga-Byte Technology Co., Ltd. | Dust-disposal heat-dissipation device with double cooling fans |
Also Published As
Publication number | Publication date |
---|---|
GB0412614D0 (en) | 2004-07-07 |
TWM254653U (en) | 2005-01-01 |
GB2412499A (en) | 2005-09-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20041014 |
|
R150 | Term of protection extended to 6 years |
Effective date: 20070903 |
|
R157 | Lapse of ip right after 6 years |
Effective date: 20110101 |