GB2412236A - Bimetal finned heatsink - Google Patents

Bimetal finned heatsink Download PDF

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Publication number
GB2412236A
GB2412236A GB0412617A GB0412617A GB2412236A GB 2412236 A GB2412236 A GB 2412236A GB 0412617 A GB0412617 A GB 0412617A GB 0412617 A GB0412617 A GB 0412617A GB 2412236 A GB2412236 A GB 2412236A
Authority
GB
United Kingdom
Prior art keywords
fins
heat dissipating
top portion
base
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0412617A
Other versions
GB0412617D0 (en
Inventor
Yung-Pin Kuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB0412617D0 publication Critical patent/GB0412617D0/en
Publication of GB2412236A publication Critical patent/GB2412236A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • B21J5/06—Methods for forging, hammering, or pressing; Special equipment or accessories therefor for performing particular operations
    • B21J5/068—Shaving, skiving or scarifying for forming lifted portions, e.g. slices or barbs, on the surface of the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The finned heatsink comprises a copper baseplate, which contacts the device to be cooled, and an aluminium upper plate which is bonded to the baseplate using a rolling process. The aluminium top plate is shaped by skiving to form fins.

Description

24 1 2236 NON-INTERFACE Bl-METAL HEAT DISSIPATING DEVICE
FIELD OF THE INVENTION
The present invention relates to a heat dissipating device which includes a cupper-made base and aluminum-made fins which is made by skiving.
BACKGROUND OF THE INVENTION
A conventional heat dissipating device generally includes a base and a plurality of fins which are connected to the base. At least four methods that used to make the conventional heat dissipating device are known to applicant, and which are cutting, forging, skiving and electro-casting. The method of cutting cannot obtain thin fins so that the total weight of the heat dissipating is heavy.
The method of forging has a limitation that the pitches between the fins cannot be controlled to be small enough and the length ofthe fins is limited either. The method of skiving improves the shortcomings of the above mentioned two methods and can obtain more number of fins with small pitches therebetween.
The electro-casting usually cooperates with chemical corrosion to have the long fins. However, the thickness of the fins cannot be controlled to have the desired thickness. Regarding the material of the fins of the conventional heat dissipating device, copper has good heat conduction but less heat dissipation. Aluminum has good heat dissipation but less heat conduction. Cupper is heavy and aluminum is light. I f c upper is u sed t o be t he m aterial o f heat s ink, it is not s uitable t o be machined and involves high cost, the minimized pitch between fins is only 1 mm.
If aluminum is chosen to be the material of heat sink, it is suitable to be machined and a cheap material, the minimized pitch between fins can be 0.8 mm. However, aluminum has less heat dissipation. Some manufacturers try combine copper and aluminum to the fins, wherein the aluminum is electro-plated with nickel and welded to the cupper by welding tin to the capper. There is an interface material between the two metals and the interface material affects the ability of heat dissipation. Furthermore, the material tin includes mercury which is not friendly to the environment. Due to the high speed CPUs are used in different types of computers, the heat dissipating device is correspondingly required to dissipate heat efficiently.
The present invention intends to provide a heat dissipating device that employs includes cupper base so as to have better heat conduction and aluminum fins which dissipate heat efficiently.
SUMMARY OF THE INVENTION
The present invention relates to heat dissipating device which comprises a base made of capper and a top portion made of aluminum, the top portion is connected to a top of the base. The top portion includes a plurality of fins extending therefrom and the fins are made by way of skiving from an outer surface of the top portion.
The present invention will become more obvious from the following description when taken in connection with the accompanying drawings which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 shows an aluminum top portion is to be connected to a cupper base of the heat dissipating device of the present invention; Fig. 2 shows that the aluminum top portion is rolled to be connected to the cupper base of the heat dissipating device of the present invention; Fig. 3 shows that shows the aluminum top portion is connected to the cupper base of the heat dissipating device of the present invention; Fig. 4 shows that the fins are made by way of skiving; Fig. 5 shows that the heat dissipating device is to be put on a CPU; Fig. 6 shows that the heat dissipating device is used in a personal 1 0 computer; Fig. 7 shows a me/allographic of aluminum and cupper of the heat dissipating device of the present invention by using a microscope of low resolution, and Fig. 8 shows a me/allographic of aluminum and copper of the heat dissipating device of the present invention by using a microscope of high resolution.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring to Figs. I to 4, the heat dissipating device of the present invention comprises a base 20 made of cupper and a top portion 10 connected to a top of the base 20. The base 20 and the top portion 10 are connected to each other by rolling or any known method. The top portion 10 includes a plurality of fins I 1 e xtending therefrom which a re made b y w ay o f s Living from a n o uter surface of the top portion 10 as shown in Fig. 4. A pitch between any two adjacent fins 11 can be 0.8 mm. An area of the base 20 is made to be larger than an area on the top portion 10 where the fins 11 extend. It is noted that the cupper has better heat conduction so that the heat dispensed from CPU 30 as shown in Figs. 5 and 6 is conducted to the base 20 and the aluminum fins 11 has better heat dissipation so that heat can be efficiently removed from the CUP 30 within a short period of time.
The weight of the heat dissipating device of the present invention is only 45% of that of cupper-made heat dissipating devices. The efficiency of heat dissipation of the heat dissipating device of the present invention is 20% higher than that of cupper-made heat dissipating devices. The cost is only 60% of that of cupper-made heat dissipating devices.
Figs. 7 and 8 respectively show that there is no interface between the aluminum and the cupper so that the heat may be dissipated from the aluminum-made fins without any barrier.
While we have shown and described the embodiment in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.

Claims (4)

  1. WHAT IS CLAIMED IS: 1. A heat dissipating device comprising: a base made
    of cupper and an aluminum-made top portion connected to a top of the base, the top portion including a plurality of fins extending therefrom which are made by way of skiving from an outer surface of the top portion.
  2. 2. The device as claimed in claim l, wherein an area of the base is larger than an area on the top portion where the fins extend.
  3. 3. The device as claimed in claim l, wherein a pitch between any two adjacent fins is 0.8 mm.
  4. 4. A heat dissipating device substantially as hereinbefore described with reference to and as illustrated in the accompanying drawings. s
GB0412617A 2004-03-15 2004-06-07 Bimetal finned heatsink Withdrawn GB2412236A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93203908 2004-03-15

Publications (2)

Publication Number Publication Date
GB0412617D0 GB0412617D0 (en) 2004-07-07
GB2412236A true GB2412236A (en) 2005-09-21

Family

ID=32710237

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0412617A Withdrawn GB2412236A (en) 2004-03-15 2004-06-07 Bimetal finned heatsink

Country Status (1)

Country Link
GB (1) GB2412236A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010030039A1 (en) * 2000-03-10 2001-10-18 Showa Aluminum Corporation Aluminum-copper clad member, method of manufacturing the same, and heat sink
JP2001352020A (en) * 2000-06-06 2001-12-21 Ricchisutoon:Kk Manufacturing method of heat radiating element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010030039A1 (en) * 2000-03-10 2001-10-18 Showa Aluminum Corporation Aluminum-copper clad member, method of manufacturing the same, and heat sink
JP2001352020A (en) * 2000-06-06 2001-12-21 Ricchisutoon:Kk Manufacturing method of heat radiating element

Also Published As

Publication number Publication date
GB0412617D0 (en) 2004-07-07

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)