GB2398426B - A process for etching a semiconductor,the use thereof to recognise the end point of etching and a device for performing the same - Google Patents
A process for etching a semiconductor,the use thereof to recognise the end point of etching and a device for performing the sameInfo
- Publication number
- GB2398426B GB2398426B GB0409930A GB0409930A GB2398426B GB 2398426 B GB2398426 B GB 2398426B GB 0409930 A GB0409930 A GB 0409930A GB 0409930 A GB0409930 A GB 0409930A GB 2398426 B GB2398426 B GB 2398426B
- Authority
- GB
- United Kingdom
- Prior art keywords
- etching
- recognise
- semiconductor
- same
- end point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005530 etching Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10214620A DE10214620B4 (en) | 2002-04-03 | 2002-04-03 | Process for the plasmaless gas phase etching of a silicon wafer and device for its implementation |
GB0307540A GB2388960B (en) | 2002-04-03 | 2003-04-01 | A process for etching a semiconductor,the use thereof to recognise the end point of etching and a device for performing the same |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0409930D0 GB0409930D0 (en) | 2004-06-09 |
GB2398426A GB2398426A (en) | 2004-08-18 |
GB2398426B true GB2398426B (en) | 2005-03-23 |
Family
ID=32737064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0409930A Expired - Fee Related GB2398426B (en) | 2002-04-03 | 2003-04-01 | A process for etching a semiconductor,the use thereof to recognise the end point of etching and a device for performing the same |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2398426B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8049514B2 (en) | 2005-08-31 | 2011-11-01 | Micron Technology, Inc. | Integrated circuit inspection system |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62115723A (en) * | 1985-11-15 | 1987-05-27 | Nec Corp | Semiconductor manufacturing equipment |
JPH11121573A (en) * | 1997-10-15 | 1999-04-30 | Nec Corp | Measurement of carrier concentration distribution and evaluation method of junction |
-
2003
- 2003-04-01 GB GB0409930A patent/GB2398426B/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62115723A (en) * | 1985-11-15 | 1987-05-27 | Nec Corp | Semiconductor manufacturing equipment |
JPH11121573A (en) * | 1997-10-15 | 1999-04-30 | Nec Corp | Measurement of carrier concentration distribution and evaluation method of junction |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8049514B2 (en) | 2005-08-31 | 2011-11-01 | Micron Technology, Inc. | Integrated circuit inspection system |
Also Published As
Publication number | Publication date |
---|---|
GB2398426A (en) | 2004-08-18 |
GB0409930D0 (en) | 2004-06-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20160401 |