GB2398426B - A process for etching a semiconductor,the use thereof to recognise the end point of etching and a device for performing the same - Google Patents

A process for etching a semiconductor,the use thereof to recognise the end point of etching and a device for performing the same

Info

Publication number
GB2398426B
GB2398426B GB0409930A GB0409930A GB2398426B GB 2398426 B GB2398426 B GB 2398426B GB 0409930 A GB0409930 A GB 0409930A GB 0409930 A GB0409930 A GB 0409930A GB 2398426 B GB2398426 B GB 2398426B
Authority
GB
United Kingdom
Prior art keywords
etching
recognise
semiconductor
same
end point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0409930A
Other versions
GB0409930D0 (en
GB2398426A (en
Inventor
Franz Laermer
Klaus Breitschwerdt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10214620A external-priority patent/DE10214620B4/en
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB0409930D0 publication Critical patent/GB0409930D0/en
Publication of GB2398426A publication Critical patent/GB2398426A/en
Application granted granted Critical
Publication of GB2398426B publication Critical patent/GB2398426B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
GB0409930A 2002-04-03 2003-04-01 A process for etching a semiconductor,the use thereof to recognise the end point of etching and a device for performing the same Expired - Fee Related GB2398426B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10214620A DE10214620B4 (en) 2002-04-03 2002-04-03 Process for the plasmaless gas phase etching of a silicon wafer and device for its implementation
GB0307540A GB2388960B (en) 2002-04-03 2003-04-01 A process for etching a semiconductor,the use thereof to recognise the end point of etching and a device for performing the same

Publications (3)

Publication Number Publication Date
GB0409930D0 GB0409930D0 (en) 2004-06-09
GB2398426A GB2398426A (en) 2004-08-18
GB2398426B true GB2398426B (en) 2005-03-23

Family

ID=32737064

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0409930A Expired - Fee Related GB2398426B (en) 2002-04-03 2003-04-01 A process for etching a semiconductor,the use thereof to recognise the end point of etching and a device for performing the same

Country Status (1)

Country Link
GB (1) GB2398426B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8049514B2 (en) 2005-08-31 2011-11-01 Micron Technology, Inc. Integrated circuit inspection system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62115723A (en) * 1985-11-15 1987-05-27 Nec Corp Semiconductor manufacturing equipment
JPH11121573A (en) * 1997-10-15 1999-04-30 Nec Corp Measurement of carrier concentration distribution and evaluation method of junction

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62115723A (en) * 1985-11-15 1987-05-27 Nec Corp Semiconductor manufacturing equipment
JPH11121573A (en) * 1997-10-15 1999-04-30 Nec Corp Measurement of carrier concentration distribution and evaluation method of junction

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8049514B2 (en) 2005-08-31 2011-11-01 Micron Technology, Inc. Integrated circuit inspection system

Also Published As

Publication number Publication date
GB0409930D0 (en) 2004-06-09
GB2398426A (en) 2004-08-18

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20160401