GB2393730A - Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition - Google Patents

Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition Download PDF

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Publication number
GB2393730A
GB2393730A GB0403011A GB0403011A GB2393730A GB 2393730 A GB2393730 A GB 2393730A GB 0403011 A GB0403011 A GB 0403011A GB 0403011 A GB0403011 A GB 0403011A GB 2393730 A GB2393730 A GB 2393730A
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United Kingdom
Prior art keywords
adhesive composition
cationic polymerizable
carbon atoms
anisotropically electroconductive
stabilizer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
GB0403011A
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GB2393730B (en
GB0403011D0 (en
Inventor
Hiroaki Yamaguchi
Yuji Hiroshige
Ryota Akiyama
Tetsu Kitamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of GB0403011D0 publication Critical patent/GB0403011D0/en
Publication of GB2393730A publication Critical patent/GB2393730A/en
Application granted granted Critical
Publication of GB2393730B publication Critical patent/GB2393730B/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

A cationic polymerizable adhesive composition comprising a cationic polymerizable monomer selected from an epoxy monomer, a vinyl ether monomer and a mixture thereof, a cationic polymerization catalyst and a stabilizer, wherein the stabilizer is at least one acid amide represented by the following Formula (I) wherein R<1> is an alkyl group having from 1 to 30 carbon atoms or an alkenyl group containing one or two unsaturated bond(s) and having from 2 to 30 carbon atoms, and each R<2> is independently hydrogen or an alkyl group having from 1 to 10 carbon atoms.

Description

GB 2393730 A continuation (74) Agent and/or Address for Service: Lloyd
Wise Commonwealth House, 1-19 New Oxford Street, LONDON, WC1A 1LW, United Kingdom
GB0403011A 2001-09-13 2002-07-19 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition Expired - Fee Related GB2393730B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001278507A JP2003082318A (en) 2001-09-13 2001-09-13 Cationically polymerizable adhesive composition and anisotropically electroconductive adhesive composition
PCT/US2002/022998 WO2003022949A1 (en) 2001-09-13 2002-07-19 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition

Publications (3)

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GB0403011D0 GB0403011D0 (en) 2004-03-17
GB2393730A true GB2393730A (en) 2004-04-07
GB2393730B GB2393730B (en) 2005-05-18

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CN (1) CN1289621C (en)
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WO (1) WO2003022949A1 (en)

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KR100732017B1 (en) * 2003-06-25 2007-06-25 히다치 가세고교 가부시끼가이샤 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
JP5323310B2 (en) * 2005-11-10 2013-10-23 日立化成株式会社 Connection structure and manufacturing method thereof
JP2011049612A (en) * 2006-01-16 2011-03-10 Hitachi Chem Co Ltd Method of manufacturing solar cell module
JP2007214533A (en) * 2006-01-16 2007-08-23 Hitachi Chem Co Ltd Conductive bonding film and solar cell module
EP2058868A4 (en) 2006-08-29 2010-01-27 Hitachi Chemical Co Ltd Conductive adhesive film and solar cell module
CN101529603B (en) * 2006-10-10 2010-12-29 日立化成工业株式会社 Connected structure and method for manufacture thereof
CN100402620C (en) * 2006-11-13 2008-07-16 浙江理工大学 Method of preparing high performance conductive glue
JP2008135654A (en) * 2006-11-29 2008-06-12 Sanyo Electric Co Ltd Solar battery module
JP4564977B2 (en) * 2007-04-05 2010-10-20 東京応化工業株式会社 Photosensitive resin composition, method for producing resist pattern, laminate, and device
JP6047437B2 (en) * 2012-03-30 2016-12-21 積水化学工業株式会社 Conductive material, connection structure, and manufacturing method of connection structure
CN102719199A (en) * 2012-04-23 2012-10-10 苏州异导光电材料科技有限公司 Preparation method of three-dimensional anisotropic conductive film
TWI583769B (en) * 2012-06-29 2017-05-21 Tatsuta Electric Wire & Cable Co Ltd Conductive adhesive composition, conductive adhesive film, bonding method and circuit substrate
KR101706818B1 (en) * 2014-04-30 2017-02-15 제일모직주식회사 A composition for use of anisotropic conductive film, anisotropic conductive film, and semiconductor device
KR101712703B1 (en) * 2014-07-18 2017-03-06 삼성에스디아이 주식회사 Adhesive composition, anisotropic conductive film and the semiconductor device using thereof
KR101706821B1 (en) * 2014-09-01 2017-02-14 삼성에스디아이 주식회사 An anisotropic conductive film and a semi-conductive device connected by the film
JP7013638B2 (en) * 2016-05-31 2022-02-01 昭和電工マテリアルズ株式会社 Adhesive composition and film-like adhesive composition
TWI672351B (en) 2018-08-21 2019-09-21 財團法人工業技術研究院 Photosensitive adhesive composition, photosensitive conductive adhesive composition and electrical device employing the photosensitive conductive adhesive composition

Citations (4)

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Publication number Priority date Publication date Assignee Title
US3386956A (en) * 1966-01-14 1968-06-04 American Cyanamid Co Low temperature curable epoxy resin adhesive compositions with long storage stability
DE3508601A1 (en) * 1985-03-11 1986-09-11 Dynamit Nobel Ag, 5210 Troisdorf Metal foil having an adhesive-agent coating for base materials for printed circuits, and a method for producing the base material
EP0200678A2 (en) * 1985-04-02 1986-11-05 Ciba-Geigy Ag Method for glueing surfaces with a curable epoxy resin composition
JPH05262815A (en) * 1992-03-18 1993-10-12 Nippon Oil & Fats Co Ltd Reactive composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3386956A (en) * 1966-01-14 1968-06-04 American Cyanamid Co Low temperature curable epoxy resin adhesive compositions with long storage stability
DE3508601A1 (en) * 1985-03-11 1986-09-11 Dynamit Nobel Ag, 5210 Troisdorf Metal foil having an adhesive-agent coating for base materials for printed circuits, and a method for producing the base material
EP0200678A2 (en) * 1985-04-02 1986-11-05 Ciba-Geigy Ag Method for glueing surfaces with a curable epoxy resin composition
JPH05262815A (en) * 1992-03-18 1993-10-12 Nippon Oil & Fats Co Ltd Reactive composition

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, Vol. 018, No. 32 (C-1154), 18 Jan 1994; & JP 05 262815 A (NIPPON OIL & FATS CO LTD) (12-10-1993) *

Also Published As

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CN1289621C (en) 2006-12-13
CN1555405A (en) 2004-12-15
GB2393730B (en) 2005-05-18
JP2003082318A (en) 2003-03-19
GB0403011D0 (en) 2004-03-17
WO2003022949A1 (en) 2003-03-20

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