GB2377320A - CPU cooling structure - Google Patents

CPU cooling structure Download PDF

Info

Publication number
GB2377320A
GB2377320A GB0116461A GB0116461A GB2377320A GB 2377320 A GB2377320 A GB 2377320A GB 0116461 A GB0116461 A GB 0116461A GB 0116461 A GB0116461 A GB 0116461A GB 2377320 A GB2377320 A GB 2377320A
Authority
GB
United Kingdom
Prior art keywords
heat sink
cooling fan
cooling
radiation fins
cpu
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0116461A
Other versions
GB0116461D0 (en
Inventor
Hsiao Liang Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Enlight Corp
Original Assignee
Enlight Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enlight Corp filed Critical Enlight Corp
Priority to GB0116461A priority Critical patent/GB2377320A/en
Priority to DE20111658U priority patent/DE20111658U1/en
Publication of GB0116461D0 publication Critical patent/GB0116461D0/en
Publication of GB2377320A publication Critical patent/GB2377320A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A CPU (4) cooling structure includes a heat sink, a cooling fan 2 supported on radiation fins 14 of the heat sink, the cooling fan 2 having an exhaust port 21 at one side thereof for output of cooling fan 2, and a wind guide shell 3 covering one side of the cooling fan 2 and one side of the heat sink to guide cooling air from the exhaust port 21 of the cooling fan 2 through gaps in between the radiation fins 14 of the heat sink for quick dissipation of heat from the heat sink.

Description

<Desc/Clms Page number 1>
CPU COOLING STRUCTURE The present invention relates to a cooling structure and, more particularly, to a CPU cooling structure which has a wind guide shell to guide currents of cooling air transversely through the gaps in between radiation fins of the heat sink.
Regular CPU cooling arrangements commonly use a heat sink to absorb heat energy from the CPU, and a cooling fan to draw currents of air from the bottom side toward the top side. Because heat energy is gathered in the center area of the heat sink during the operation of the CPU, drawing currents of air upwardly through the cooling fan cannot efficiently carry heat energy away from the heat sink.
The invention has been accomplished to provide a CPU cooling structure, which eliminates the aforesaid drawback. According to the present invention, the cooling fan draws currents of air from the top side toward an exhaust port at one lateral side thereof, and a wind guide shell is covered on one lateral side of the cooling fan and one lateral side of the heat sink to guide currents of cooling air from the exhaust port of the cooling fan through gaps in between radiation fins of the heat sink, enabling heat energy to be quickly carried away from the heat sink.
<Desc/Clms Page number 2>
The invention will now be further described, by way of example, with reference to the drawings in which: FIG. 1 is an elevational view of a CPU cooling structure constructed according to the present invention; FIG. 2 is an exploded view of the CPU cooling structure according to the present invention; FIG. 3 illustrates the internal structure of the wind guide shell for the CPU cooling structure according to the present invention; FIG. 4 is an assembly view of the heat sink and the cooling fan before the installation of the wind guide shell according to the present invention; and FIG. 5 is a schematic drawing showing the direction of currents of air passed through the CPU cooling structure according to the present invention.
Referring to FIGS. from 1 through 5, a CPU cooling structure is shown comprised of a heat sink 1, a cooling fan 2, and a wind guide shell 3.
<Desc/Clms Page number 3>
The heat sink 1 comprises two bottom V-grooves 11, which are coupled to the motherboard (not shown), keeping the flat bottom sidewall in close contact with the CPU 4 (see FIG. 5), two transverse rails 12 bilaterally disposed at the top side thereof, radiation fins 14 arranged in parallel between the rails 12, a fan receiving space 13 defined between the rails 12 above the radiation fins 14, two mounting grooves 15 respectively disposed between the rails 12 and the radiation fins 14, a protruding coupling block 16 integral with one side thereof, and a retaining hole 17 in the bottom sidewall of the protruding coupling block 16.
The cooling fan 2 is press-fitted into the fan receiving space 13 between the rails 12 above the radiation fins 14 and fixedly fastened to the mounting grooves 15 of the heat sink 1 by screws, having an exhaust port 21 extended through one side thereof corresponding to the protruding coupling block 16 of the heat sink 1. The bottom side of the cooling fan 2 is an enclosed flat wall. When operated, the cooling fan draw cold air from the open top side thereof toward the exhaust port 21.
The wind guide shell 3 is coupled to the protruding coupling block 16 to guide cold air from the exhaust port 21 of the cooling fan 2 through the gaps in between the radiation fins 14, enabling heat energy to be quickly dissipated from the heat sink 1. As illustrated in FIGS. 3 and 5, the wind
<Desc/Clms Page number 4>
guide shell 3 comprises two partition ribs 32, an elongated recessed chamber 31 of smoothly arched cross section defined between the partition ribs 32 and facing the protruding coupling block 16 of the heat sink 1, two coupling holes 33 disposed at two sides and respectively coupled to two ends of the coupling block 16, a lug 34 fastened to one mounting groove 15 of the heat sink 1 by a screw, and a retaining tongue 35 forced into engagement with the retaining hole 17 of the heat sink 1.
After installation, as shown in FIG. 5, the elongated recessed chamber 31 of the wind guide shell 3 has an upper half facing the exhaust port 21 of the cooling fan 2 and a lower half facing the radiation fins 14. When operated, currents of air are drawn from the top side of the cooling fan 2 toward the exhaust port 21, and then guided by the wind guide shell 3 through the gaps in between the radiation fins 14 of the heat sink 1, enabling heat energy to be quickly carried away from the heat sink 1.
A prototype of CPU cooling structure has been constructed with the features of FIGS. 1-5. The CPU cooling structure functions smoothly to provide all of the features discussed earlier.
Although a particular embodiment of the invention has been described in detail for purposes of illustration, various modifications and
<Desc/Clms Page number 5>
enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims.

Claims (2)

  1. CLAIMS 1. A CPU cooling structure comprising a heat sink, said heat sink. comprising two bottom V-grooves for coupling to a motherboard for enabling said heat sink to dissipate heat from a CPU on the motherboard, two mounting grooves arranged in parallel on a top side thereof, and a plurality of radiation fins arranged in parallel on the top side between said mounting grooves, and a cooling fan supported on the radiating fins of said heat sink and fixedly fastened to the mounting grooves of said heat sink by screws, said cooling fan having an exhaust port at one side thereof for output of cooling air, wherein said heat sink further comprises two transverse rails bilaterally disposed at the top side, a fan receiving space defined between said rails above said radiation fins, a protruding coupling block integral with one side thereof, and a retaining hole in a bottom sidewall of said protruding coupling block; said cooling fan is press-fitted into said fan receiving space between said rails above said radiation fins; a wind guide shell is covered on said cooling fan and said heat sink at one end to guide cooling air from the exhaust port of said cooling fan through
    <Desc/Clms Page number 7>
    gaps in between the radiation fins of said heat sink, said wind guide shell comprising an elongated recessed chamber of smoothly arched cross section facing the exhausting port of said cooling fan and the protruding coupling block and radiating fins of said heat sink, two coupling holes respectively coupled to two ends of the coupling block of said heat sink, a lug fastened to one mounting groove of said heat sink by a screw, and a retaining tongue forced into engagement with the retaining hole of said heat sink.
  2. 2. The CPU cooling structure substantially as hereinbefore described with reference to and as illustrated in Figures. 1 to 5 of the drawings.
GB0116461A 2001-07-05 2001-07-05 CPU cooling structure Withdrawn GB2377320A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB0116461A GB2377320A (en) 2001-07-05 2001-07-05 CPU cooling structure
DE20111658U DE20111658U1 (en) 2001-07-05 2001-07-13 Transversely flowing CPU cooler

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0116461A GB2377320A (en) 2001-07-05 2001-07-05 CPU cooling structure
DE20111658U DE20111658U1 (en) 2001-07-05 2001-07-13 Transversely flowing CPU cooler

Publications (2)

Publication Number Publication Date
GB0116461D0 GB0116461D0 (en) 2001-08-29
GB2377320A true GB2377320A (en) 2003-01-08

Family

ID=26057098

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0116461A Withdrawn GB2377320A (en) 2001-07-05 2001-07-05 CPU cooling structure

Country Status (2)

Country Link
DE (1) DE20111658U1 (en)
GB (1) GB2377320A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008523345A (en) * 2005-04-08 2008-07-03 リッタル ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト Cooling unit

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5353863A (en) * 1994-03-07 1994-10-11 Yu Chi T Pentium CPU cooling device
JPH07249885A (en) * 1994-03-10 1995-09-26 Nemitsuku Ramuda Kk Cooling structure
US5535094A (en) * 1995-04-26 1996-07-09 Intel Corporation Integrated circuit package with an integral heat sink and fan
US5630469A (en) * 1995-07-11 1997-05-20 International Business Machines Corporation Cooling apparatus for electronic chips
JPH104164A (en) * 1996-06-14 1998-01-06 Toyo Radiator Co Ltd Air cooling heat sink
JPH10163389A (en) * 1996-11-28 1998-06-19 Fujikura Ltd Heat sink
JPH11307969A (en) * 1998-04-17 1999-11-05 Kenwood Corp Structure for cooling heating component
JP2001102508A (en) * 1999-10-01 2001-04-13 Mitsubishi Electric Corp Heat sink device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5353863A (en) * 1994-03-07 1994-10-11 Yu Chi T Pentium CPU cooling device
JPH07249885A (en) * 1994-03-10 1995-09-26 Nemitsuku Ramuda Kk Cooling structure
US5535094A (en) * 1995-04-26 1996-07-09 Intel Corporation Integrated circuit package with an integral heat sink and fan
US5630469A (en) * 1995-07-11 1997-05-20 International Business Machines Corporation Cooling apparatus for electronic chips
JPH104164A (en) * 1996-06-14 1998-01-06 Toyo Radiator Co Ltd Air cooling heat sink
JPH10163389A (en) * 1996-11-28 1998-06-19 Fujikura Ltd Heat sink
JPH11307969A (en) * 1998-04-17 1999-11-05 Kenwood Corp Structure for cooling heating component
JP2001102508A (en) * 1999-10-01 2001-04-13 Mitsubishi Electric Corp Heat sink device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008523345A (en) * 2005-04-08 2008-07-03 リッタル ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト Cooling unit

Also Published As

Publication number Publication date
DE20111658U1 (en) 2001-10-18
GB0116461D0 (en) 2001-08-29

Similar Documents

Publication Publication Date Title
US6542364B2 (en) Heat dissipating assembly with heat pipes
US6570760B1 (en) CPU cooling arrangement for portable computer
US6333852B1 (en) CPU heat dissipation device with special fins
US5959837A (en) Heat-radiating structure for CPU
US5353863A (en) Pentium CPU cooling device
US6796373B1 (en) Heat sink module
US6711016B2 (en) Side exhaust heat dissipation module
US20030019610A1 (en) Rapidly self - heat-conductive heat - dissipating module
US6446708B1 (en) Heat dissipating device
US20220302757A1 (en) Wireless charging device
US6964295B1 (en) Heat dissipation device
US20050103476A1 (en) Heat dissipating assembly with heat pipes
GB2336039A (en) T-shaped heat dissipating fins on motor casing
US20050225942A1 (en) Plug-in cooling device
US8490680B2 (en) Plate cooling fin with slotted projections
US6390188B1 (en) CPU heat exchanger
CN219679036U (en) Heat abstractor and appearance moults
GB2377320A (en) CPU cooling structure
US20230262923A1 (en) Electronic device
CN113038781A (en) Servo driver with independent air duct structure
CN210402260U (en) Radiating fin with good radiating efficiency
US6873527B2 (en) Heat transfer apparatus
CN220043995U (en) Heat abstractor and electronic equipment with same
CN110739283A (en) kinds of radiator
CN213186695U (en) Circuit board heat radiation structure and router

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)