GB2377320A - CPU cooling structure - Google Patents
CPU cooling structure Download PDFInfo
- Publication number
- GB2377320A GB2377320A GB0116461A GB0116461A GB2377320A GB 2377320 A GB2377320 A GB 2377320A GB 0116461 A GB0116461 A GB 0116461A GB 0116461 A GB0116461 A GB 0116461A GB 2377320 A GB2377320 A GB 2377320A
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat sink
- cooling fan
- cooling
- radiation fins
- cpu
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A CPU (4) cooling structure includes a heat sink, a cooling fan 2 supported on radiation fins 14 of the heat sink, the cooling fan 2 having an exhaust port 21 at one side thereof for output of cooling fan 2, and a wind guide shell 3 covering one side of the cooling fan 2 and one side of the heat sink to guide cooling air from the exhaust port 21 of the cooling fan 2 through gaps in between the radiation fins 14 of the heat sink for quick dissipation of heat from the heat sink.
Description
<Desc/Clms Page number 1>
CPU COOLING STRUCTURE
The present invention relates to a cooling structure and, more particularly, to a CPU cooling structure which has a wind guide shell to guide currents of cooling air transversely through the gaps in between radiation fins of the heat sink.
Regular CPU cooling arrangements commonly use a heat sink to absorb heat energy from the CPU, and a cooling fan to draw currents of air from the bottom side toward the top side. Because heat energy is gathered in the center area of the heat sink during the operation of the CPU, drawing currents of air upwardly through the cooling fan cannot efficiently carry heat energy away from the heat sink.
The invention has been accomplished to provide a CPU cooling structure, which eliminates the aforesaid drawback. According to the present invention, the cooling fan draws currents of air from the top side toward an exhaust port at one lateral side thereof, and a wind guide shell is covered on one lateral side of the cooling fan and one lateral side of the heat sink to guide currents of cooling air from the exhaust port of the cooling fan through gaps in between radiation fins of the heat sink, enabling heat energy to be quickly carried away from the heat sink.
<Desc/Clms Page number 2>
The invention will now be further described, by way of example, with reference to the drawings in which: FIG. 1 is an elevational view of a CPU cooling structure constructed according to the present invention; FIG. 2 is an exploded view of the CPU cooling structure according to the present invention; FIG. 3 illustrates the internal structure of the wind guide shell for the CPU cooling structure according to the present invention; FIG. 4 is an assembly view of the heat sink and the cooling fan before the installation of the wind guide shell according to the present invention; and FIG. 5 is a schematic drawing showing the direction of currents of air passed through the CPU cooling structure according to the present invention.
Referring to FIGS. from 1 through 5, a CPU cooling structure is shown comprised of a heat sink 1, a cooling fan 2, and a wind guide shell 3.
<Desc/Clms Page number 3>
The heat sink 1 comprises two bottom V-grooves 11, which are coupled to the motherboard (not shown), keeping the flat bottom sidewall in close contact with the CPU 4 (see FIG. 5), two transverse rails 12 bilaterally disposed at the top side thereof, radiation fins 14 arranged in parallel between the rails 12, a fan receiving space 13 defined between the rails
12 above the radiation fins 14, two mounting grooves 15 respectively disposed between the rails 12 and the radiation fins 14, a protruding coupling block 16 integral with one side thereof, and a retaining hole 17 in the bottom sidewall of the protruding coupling block 16.
The cooling fan 2 is press-fitted into the fan receiving space 13 between the rails 12 above the radiation fins 14 and fixedly fastened to the mounting grooves 15 of the heat sink 1 by screws, having an exhaust port 21 extended through one side thereof corresponding to the protruding coupling block 16 of the heat sink 1. The bottom side of the cooling fan 2 is an enclosed flat wall. When operated, the cooling fan draw cold air from the open top side thereof toward the exhaust port 21.
The wind guide shell 3 is coupled to the protruding coupling block 16 to guide cold air from the exhaust port 21 of the cooling fan 2 through the gaps in between the radiation fins 14, enabling heat energy to be quickly dissipated from the heat sink 1. As illustrated in FIGS. 3 and 5, the wind
<Desc/Clms Page number 4>
guide shell 3 comprises two partition ribs 32, an elongated recessed chamber 31 of smoothly arched cross section defined between the partition ribs 32 and facing the protruding coupling block 16 of the heat sink 1, two coupling holes 33 disposed at two sides and respectively coupled to two ends of the coupling block 16, a lug 34 fastened to one mounting groove 15 of the heat sink 1 by a screw, and a retaining tongue 35 forced into engagement with the retaining hole 17 of the heat sink 1.
After installation, as shown in FIG. 5, the elongated recessed chamber 31 of the wind guide shell 3 has an upper half facing the exhaust port 21 of the cooling fan 2 and a lower half facing the radiation fins 14. When operated, currents of air are drawn from the top side of the cooling fan 2 toward the exhaust port 21, and then guided by the wind guide shell 3 through the gaps in between the radiation fins 14 of the heat sink 1, enabling heat energy to be quickly carried away from the heat sink 1.
A prototype of CPU cooling structure has been constructed with the features of FIGS. 1-5. The CPU cooling structure functions smoothly to provide all of the features discussed earlier.
Although a particular embodiment of the invention has been described in detail for purposes of illustration, various modifications and
<Desc/Clms Page number 5>
enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims.
Claims (2)
- CLAIMS 1. A CPU cooling structure comprising a heat sink, said heat sink. comprising two bottom V-grooves for coupling to a motherboard for enabling said heat sink to dissipate heat from a CPU on the motherboard, two mounting grooves arranged in parallel on a top side thereof, and a plurality of radiation fins arranged in parallel on the top side between said mounting grooves, and a cooling fan supported on the radiating fins of said heat sink and fixedly fastened to the mounting grooves of said heat sink by screws, said cooling fan having an exhaust port at one side thereof for output of cooling air, wherein said heat sink further comprises two transverse rails bilaterally disposed at the top side, a fan receiving space defined between said rails above said radiation fins, a protruding coupling block integral with one side thereof, and a retaining hole in a bottom sidewall of said protruding coupling block; said cooling fan is press-fitted into said fan receiving space between said rails above said radiation fins; a wind guide shell is covered on said cooling fan and said heat sink at one end to guide cooling air from the exhaust port of said cooling fan through<Desc/Clms Page number 7>gaps in between the radiation fins of said heat sink, said wind guide shell comprising an elongated recessed chamber of smoothly arched cross section facing the exhausting port of said cooling fan and the protruding coupling block and radiating fins of said heat sink, two coupling holes respectively coupled to two ends of the coupling block of said heat sink, a lug fastened to one mounting groove of said heat sink by a screw, and a retaining tongue forced into engagement with the retaining hole of said heat sink.
- 2. The CPU cooling structure substantially as hereinbefore described with reference to and as illustrated in Figures. 1 to 5 of the drawings.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0116461A GB2377320A (en) | 2001-07-05 | 2001-07-05 | CPU cooling structure |
DE20111658U DE20111658U1 (en) | 2001-07-05 | 2001-07-13 | Transversely flowing CPU cooler |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0116461A GB2377320A (en) | 2001-07-05 | 2001-07-05 | CPU cooling structure |
DE20111658U DE20111658U1 (en) | 2001-07-05 | 2001-07-13 | Transversely flowing CPU cooler |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0116461D0 GB0116461D0 (en) | 2001-08-29 |
GB2377320A true GB2377320A (en) | 2003-01-08 |
Family
ID=26057098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0116461A Withdrawn GB2377320A (en) | 2001-07-05 | 2001-07-05 | CPU cooling structure |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE20111658U1 (en) |
GB (1) | GB2377320A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008523345A (en) * | 2005-04-08 | 2008-07-03 | リッタル ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト | Cooling unit |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5353863A (en) * | 1994-03-07 | 1994-10-11 | Yu Chi T | Pentium CPU cooling device |
JPH07249885A (en) * | 1994-03-10 | 1995-09-26 | Nemitsuku Ramuda Kk | Cooling structure |
US5535094A (en) * | 1995-04-26 | 1996-07-09 | Intel Corporation | Integrated circuit package with an integral heat sink and fan |
US5630469A (en) * | 1995-07-11 | 1997-05-20 | International Business Machines Corporation | Cooling apparatus for electronic chips |
JPH104164A (en) * | 1996-06-14 | 1998-01-06 | Toyo Radiator Co Ltd | Air cooling heat sink |
JPH10163389A (en) * | 1996-11-28 | 1998-06-19 | Fujikura Ltd | Heat sink |
JPH11307969A (en) * | 1998-04-17 | 1999-11-05 | Kenwood Corp | Structure for cooling heating component |
JP2001102508A (en) * | 1999-10-01 | 2001-04-13 | Mitsubishi Electric Corp | Heat sink device |
-
2001
- 2001-07-05 GB GB0116461A patent/GB2377320A/en not_active Withdrawn
- 2001-07-13 DE DE20111658U patent/DE20111658U1/en not_active Expired - Lifetime
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5353863A (en) * | 1994-03-07 | 1994-10-11 | Yu Chi T | Pentium CPU cooling device |
JPH07249885A (en) * | 1994-03-10 | 1995-09-26 | Nemitsuku Ramuda Kk | Cooling structure |
US5535094A (en) * | 1995-04-26 | 1996-07-09 | Intel Corporation | Integrated circuit package with an integral heat sink and fan |
US5630469A (en) * | 1995-07-11 | 1997-05-20 | International Business Machines Corporation | Cooling apparatus for electronic chips |
JPH104164A (en) * | 1996-06-14 | 1998-01-06 | Toyo Radiator Co Ltd | Air cooling heat sink |
JPH10163389A (en) * | 1996-11-28 | 1998-06-19 | Fujikura Ltd | Heat sink |
JPH11307969A (en) * | 1998-04-17 | 1999-11-05 | Kenwood Corp | Structure for cooling heating component |
JP2001102508A (en) * | 1999-10-01 | 2001-04-13 | Mitsubishi Electric Corp | Heat sink device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008523345A (en) * | 2005-04-08 | 2008-07-03 | リッタル ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト | Cooling unit |
Also Published As
Publication number | Publication date |
---|---|
DE20111658U1 (en) | 2001-10-18 |
GB0116461D0 (en) | 2001-08-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |