GB2376806A - RF module - Google Patents

RF module Download PDF

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Publication number
GB2376806A
GB2376806A GB0220792A GB0220792A GB2376806A GB 2376806 A GB2376806 A GB 2376806A GB 0220792 A GB0220792 A GB 0220792A GB 0220792 A GB0220792 A GB 0220792A GB 2376806 A GB2376806 A GB 2376806A
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GB
United Kingdom
Prior art keywords
layered substrate
module
module according
substrate
electrode pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0220792A
Other versions
GB0220792D0 (en
GB2376806B (en
Inventor
Toshifumi Oida
Takahiro Watanabe
Eigoro Ina
Norio Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000184046A external-priority patent/JP3582460B2/en
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of GB0220792D0 publication Critical patent/GB0220792D0/en
Publication of GB2376806A publication Critical patent/GB2376806A/en
Application granted granted Critical
Publication of GB2376806B publication Critical patent/GB2376806B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
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    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
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    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transceivers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

An RF module (10) comprises a multi-layered substrate (12) having first and second side surfaces; a base-band IC (14) and a memory IC (16) mounted on the first side surface and an RF-IC (26) mounted on the second side surface. An RF passive component (36) is formed internally of the substrate (12), and a wiring pattern (32) is incorporated in the substrate (12), the wiring pattern interconnecting the base-band IC (14) and the memory IC (16). A shielding ground electrode pattern (38) is formed internally of the substrate (12), interposed between the first and second surfaces. An antenna may also be included in the substrate. The module provides a compact unit for use in communication devices such as a mobile phone.

Description

<Desc/Clms Page number 1>
RF MODULE BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an RF module and, more particularly, an RF module which has ICs such as an RF-IC','" base-band IC, and a memory IC mounted on a substrate, and which is used, for example, in a mobile communication terminal.
2. Description of the Related Art RF modules have been developed which are intended for use in mobile communication terminals. Such an RF module typically has components such as an RF-IC, base-band IC, memory IC and a quartz oscillator which are mounted on a single-layered print circuit board.
A conventional RF module of a type which is not equipped with an antenna typically has dimensions of 33 mm long, 17 mm wide and 3.65 mm thick. Another RF module, which is of a type having an antenna built-in on the substrate, typically has dimensions of 32 mm long, 15 mm wide and 2.9 mm thick is also available. These RF modules are too large to be mounted in, for example, a portable phone.
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SUMMARY OF THE INVENTION Accordingly, it is a primary object of the present invention to provide an RF module which can be implemented with reduce dimensions.
To this end, in accordance with the present invention, there is provided an RF module comprising; a multi-layered substrate, a base-band IC, a memory IC and an RF-IC mounted on said multi-layered substrate, an RF passive component incorporated in said multilayered substrate, and a wiring pattern incorporated in said multi-layered substrate, said wiring pattern interconnecting said baseband IC and said memory IC.
The RF module may further comprise an antenna incorporated in the multi-layered substrate.
At least one of the base-band IC, the memory IC and the RF-IC may be a bare chip.
When such a bare chip is used, the arrangement may be such that at least one cavity is formed in a part of the multi-layered substrate, and the bare chip is disposed in the cavity.
The RF module of the present invention may be configured such that the base-band IC and the memory IC are
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mounted on one side of the multi-layered substrate, while the RF-IC is mounted on the other side of the multi-layered substrate.
The RF module of the present invention may further comprise a shielding ground electrode pattern interposed between the side of said multi-layered substrate on which said band IC and the memory IC are mounted and the RF passive component incorporated in the multi-layered substrate.
The RF module may further comprise at least one trimming electrode pattern formed on a surface of the multilayered substrate, for enabling adjustment of frequency characteristics.
When a bare ship is used as the RF-IC, the RF module may further comprise: a ground pattern for preventing RF signal radiation provided within the multi-layered substrate at a location on the bottom side of the bare chip, so as to prevent unnecessary radiation of RF signals from the RF-IC; and a plurality of via holes arranged within the multi- layered substrate and around the bare chip, the via holes providing connection to the ground electrode pattern for preventing RF signal radiation.
The RF module may further comprise a metallic case formed on the multi-layered substrate and serving as a part of an antenna.
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In the RF module of the present invention having the described features, a multi-layered substrate is used as the substrate, and the RF passive component and the wiring pattern interconnecting the base-band IC and the memory IC are selectively incorporated in the multi-layered substrate. Therefore, the RF module of the present invention is reduced in size as compared with conventional RF modules and can suitably be mounted in, for example, a portable phone.
The above and other objects, features and advantages of the present invention will become clear from the following description of the embodiments taken in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational diagrammatic illustration of an RF module in accordance with the present invention; Fig. 2 is a circuit diagram of the RF module shown in Fig. 1; Fig. 3 is a front elevational diagrammatic illustration of another embodiment of the RF module in accordance with the present invention; Fig. 4 is a perspective view of still another embodiment of the RF module in accordance with the present invention: Fig. 5 is a front elevational diagrammatic illustration
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of the RF module shown in Fig. 4; Fig. 6 is an equivalent circuit diagram of an antenna of the RF module shown in Fig. 4; Fig. 7 is a perspective view of a yet another embodiment of the RF module in accordance with the present invention; Fig. 8 is a front elevational diagrammatic illustration of the RF module shown in Fig. 7; Fig. 9 is an equivalent circuit diagram of an antenna of the RF module shown in Fig. 7; Fig. 10 is a diagrammatic plan view of a further embodiment of the RF module in accordance with the present invention; Fig. 11 is a front elevational diagrammatic illustration of an RF module shown in Fig. 10.
Fig. 12 is a diagrammatic bottom plan view of the RF module shown in Fig. 10; and Fig. 13 is a block diagram showing circuit patterns including a trimming electrode pattern of a resonator incorporated in the RF module shown in Fig. 10.
DESCRIPTION OF THE PREFERRED EMBODIMENTS Fig. 1 is a front elevational diagrammatic illustration of an RF module of the present invention, while Fig. 2 is a circuit diagram of the RF module. The RF module 10 shown in
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Fig. 1 has a multi-layered substrate 12 made of, for example, low temperature co-fired ceramics.
A base-band IC 14, a memory IC 16, a quartz oscillator 18 and surface-mounted components 20 are mounted on the upper surface side of the multi-layered substrate 12.
The base-band IC 14 is responsible for the processing of the base band signals, as well as for the overall control of the RF module 10. More specifically, the base-band IC performs operations such as the switching between transmitting and receiving modes, control of a PLL circuit and of Power Amplifier (PA), and so forth, while serving as an interface for connection to host-side terminal such as
USB (Universal Serial Bus), UART (Universal Asynchronous Receiver Transmitter) and PCM (Pulse Code Modulation).
The memory IC (ROM) 16 is, for example, a flash memory which stores control software for controlling the operation of the RF module 10.
The quartz oscillator (QCO) 18 is connected to the base-band IC 14 and is used as a reference oscillator.
The surface-mounted components include electronic components such as a chip-type inductor, a chip-type capacitor, a chip resistor, a chip-type transistor, and a chip-type diode.
A metallic case 22 is secured to the upper surface side of the multi-layered substrate 12, so as to cover the base-
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band IC 14, memory IC 16, quartz oscillator 18 and the surface-mount components 20.
A cavity 24 is formed in the lower surface side of the multi-layered substrate 12 at almost central portion thereof.
A first RF-IC 26 and a second RF-IC 28, which are RF-ICs for processing RF signals, are disposed in the cavity 24. By way of example, the first RF-IC 26 and the second RF-IC 28 are bare chips. The first RF-IC 26 and the second RF-IC 28 are
covered with a resin 30 which fills the cavity 24.
"YL Wiring conductor patterns A and through-holes 34 I \ interconnecting the base-band IC 14 and the memory IC 16, RF passive components 36, and a shielding ground electrode pattern 38 are formed internally of the multi-layered substrate 12.
The RF passive components 36 include, for example, passive elements such as an inductor, a capacitor, a distributed-constant line, a resonator, a LC filter, and a balun, and provides a front end portion of a communication terminal in cooperation with the RF surface-mounted components 20. The shielding ground electrode pattern 38 is formed between the base-band IC 14 and the memory IC 16, and the RF passive components 36.
By way of example, the RF module 10 has a block diagram of a FULL DEVICE shown in Fig. 2.
This RF module 10 has a smaller size than conventional
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RF modules and, therefore, can be mounted in a device such as a portable phone, by virtue of the fact that the wiring patterns 32, through-holes 34, RF passive components 36 and the shielding ground electrode pattern 38 are integrated internally of the multi-layered substrate 12.
In conventional RF modules, wiring patterns for interconnecting components are formed on the surface of the printed circuit board. To the contrary, in accordance with the present invention, however, these wiring patterns are arranged inside the multi-layered substrate 12, thus offering improvement in the RF characteristics.
This RF module 10 exhibit further improved characteristics, e. g. , reliability, if ceramics dielectric materials which can be sintered at low temperature are used to form the multi-layered substrate 12 while highly conductive materials such as Cu or Ag are used as the material of the wiring patterns and electrode pattern inside the multi-layered substrate 12.
In this RF module 10, control components such as the base-band IC 14, memory IC 16 and so forth are mounted on the upper side surface of the multi-layered substrate 12, while RF components such as the first RF-IC 26 and the second RF-IC 28 are mounted on the lower side surface of the multi-layered substrate 12, thus allowing reduction in the surface area of the multi-layered substrate 12 through
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effective use of both sides of the same.
In this RF module 10, semiconductive devices such as the base-band IC 14 and the memory IC 16 and the RF components such as the first RF-IC 26 and the second RF-IC 28 are shared to both sides of the multi-layered substrate 12, so that the wiring patterns interconnecting the control terminals of the control system and the control terminal of the RF system are shortened, thus contributing to a reduction in the size of the RF module, as well as to reduction in signal losses.
In this RF module 10, the components of the control system are formed on an upper layer of the multi-layered substrate 12, while the components of the RF system are formed on a lower layer of the multi-layered substrate 12, with the shielding ground electrode pattern 38 intervening therebetween, so that the control system and the RF system are isolated from each other by the shielding ground electrode pattern 38. Consequently, interference of signals
between the control block including the base-band IC 14 and the memory IC 16 and the RF block including the first RF-IC 26 and the second RF-IC 28 is suppressed to achieve a higher stability of operations of the respective blocks.
In this RF module 10, the first RF-IC 26 and the second RF-IC 28 are disposed in the cavity 24 formed in the lower side surface of the multi-layered substrate 12, thus
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achieving flatness of the lower surface of the module, which in turn makes it possible to use ordinary land-type I/O electrodes. This RF module therefore enables surface mounting even when a double-sides substrate is used.
Furthermore, in this RF module 10, the first RF-IC 26 and the second RF-IC 28 are bare chips and, therefore, can easily-be mounted in the cavity 24, thus contributing to further reduction in the size of the RF module.
Fig. 3 is a front elevational diagrammatic illustration of another embodiment of the RF module in accordance with the present invention. In the RF module shown in Fig. 3, the resin 30 used in the RF module 10 of Fig. 1 to fill the cavity 24 is substituted by a metallic cap 31 which is fixed to the multi-layered substrate 12 so as to seal the cavity 24.
The RF module lOa shown in Fig. 3 offers an advantage over the RF module 10 of Fig. 1 in that the metallic cap 31 also serves as a shield for the first RF-IC 26 and the second RF-IC 28.
Fig. 4 is a perspective view of still another embodiment of the RF module in accordance with the present invention. Fig. 5 is a front elevational diagrammatic illustration of this RF module, while Fig. 6 is an equivalent circuit diagram of an antenna of the same. The RF module lOb shown in Fig. 4 has a multi-layered substrate
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12b which is slightly greater than that of the RF module lOa shown in Fig. 3, and a spiral antenna 40 having an electrode pattern and through-holes is incorporated in the RF module lOb.
Fig. 7 is a perspective view of a yet another example of the RF module in accordance with the present invention.
Fig. 8 is a front elevational diagrammatic illustration of this RF module, while Fig. 9 is an equivalent circuit diagram of an antenna of the same. The RF module 10c shown in Fig. 7 has a multi-layered substrate 12c which is slightly greater than that of the RF module lOa shown in Fig.
3, and an antenna 40 made of a loop-shaped metallic sheet is incorporated in the upper surface of the multi-layered substrate 12c. In addition, a matching capacitor 42 also is incorporated internally of the multi-layered substrate 12.
The antenna may be formed of a combination of the loopshaped metallic sheet and the metallic case 22, or of the metallic case 22 alone.
The RF module lOb shown in Fig. 4 has the antenna 40 incorporated in the multi-layered substrate 2b, and the RF module 10c shown in Fig. 7 has the antenna 41 and the matching capacitor 42 incorporated in the multi-layered substrate 12c. Therefore, these RF modules lOb and 10c can have reduced sizes as compared with the cases where the antenna is externally mounted.
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The RF module 10 shown in Fig. 1, when an antenna is externally mounted thereon, requires a work at the user's end for achieving matching between the antenna and the wireless device.
In contrast, the RF module lOb shown in Fig. 4 and the RF module 10c shown in Fig. 7 eliminate the needs for such a work for establishing matching to be done at the user's side, because these RF modules can be designed to inherently have the matching, by virtue of the incorporation of the antenna 40 or both the antenna 41 and the matching capacitor 42.
Fig. 10 is a diagrammatic plan view of a further embodiment of the RF module in accordance with the present invention, Fig. 11 is a front elevational diagrammatic illustration of the RF module, Fig. 12 is a diagrammatic bottom plan view of the RF module, and Fig. 13 is a block diagram showing patterns including a trimming electrode pattern of a resonator incorporated in the RF module.
Thus, the RF module 10d shown in Fig. 10 features an oscillator trimming electrode pattern 44 and other patterns formed on the upper side of the multi-layered substrate 12d.
The RF module 10d further has a ground electrode pattern for preventing RF signal radiation 46 formed on the bottom side of the RF-IC 26 in the multi-layered substrate 12d, as will be seen from Fig. 11.
Further, as shown in Fig. 12, the RF module 10d has a
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plurality of via holes 48 formed in the multi-layered substrate 12d so as to surround the RF-IC 26. The ground electrode pattern for preventing RF signal radiation 46 is connected through these via holes 48 to the metallic cap 31 which is held at the ground potential.
The RF module 10d shown in Fig. 10 is so configured as to enable adjustment of the frequency characteristics such as oscillation frequency and filter characteristics, through trimming of the trimming electrode pattern 44 by means of, for example, laser, while monitoring or measuring the total output waveform or total performance of the wireless section, as shown in Fig. 13. This allows the adjustment to be conducted based on the final characteristics obtained in the final structure incorporating circuits such as the built-in filter and an IC amplifier. It is therefore possible to stabilize the characteristics of the products and to improve the yield.
Further, in the RF module 10d shown in Fig. 10, the RFIC 26 is surrounded by the ground electrode pattern for preventing RF signal radiation 46, the via holes 48 and a metallic cap 31, thus preventing unnecessary radiation of the RF signals from the RF-IC 26. This serves to suppress coupling between different circuits, contributing to stabilization of the characteristics. In the RF module 10d shown in Fig. 10, the metallic cap 31 may be substituted by
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a resin filling the cavity 24 formed in the multi-layered substrate 12d. Such an alternative arrangement produces the same advantages as those described above, provided that a ground electrode pattern is formed on the substrate mounting the RF module lOd.
In each of the RF modules described hereinbefore, the RF-IC is a bare chip. The invention, however, does not exclude the use of bare chips constituting ICs other than the RF-IC.
Each of the RF modules described heretofore has only one cavity formed in the multi-layered substrate. The invention, however, does not exclude the use of two or more cavities formed in the multi-layered substrate.
It is also possible to employ two or more trimming electrode patterns.
The present invention provides an RF module which is so small as to be mountable in, for example, a mobile telephone.
Although the invention has been described through illustration of its preferred forms, it is to be understood that the described embodiments are not exclusive and various changes and modifications may be imparted thereto without departing from the scope of the present invention which is limited solely by the appended claims.

Claims (14)

  1. CLAIMS 1. An RF module comprising: a multi-layered substrate, the multi-layered substrate having first and second side surfaces; a base-band IC and a memory IC mounted on the first s :-de surface of the multi-layered substrate; an RF-IC mounted on the second side surface of the multi-layered substrate; an RF passive component formed internally of the multilayered substrate, the RF passive component comprising at least one of an inductor, a capacitor, a distributedconstant line, a resonator, a LC filter and a balun; a wiring pattern incorporated in the multi-layered substrate, the wiring pattern interconnecting the base-band IC and the memory IC ; and a shielding ground electrode pattern formed internally of the multi-layered substrate, the shielding ground electrode pattern being interposed between the first and second surfaces of the multi-layered substrate.
  2. 2. The RF module according to claim 1, wherein the multilayered substrate has first and second portions internally thereof, the first portion being defined as a portion between the shielding ground electrode pattern and the first s due surface of the multi-layered substrate, the second
    <Desc/Clms Page number 16>
    portion being defined as a portion between the shielding ground electrode pattern and the second side surface of the multi-layered substrate; and the RF passive component is formed in the second portion of the multi-layered substrate.
  3. 3. The RF module according to claim 2, wherein at least one of the RF passive component and the RF-IC is
    electrically connected to at least one of the base-band IC and the memory IC by via holes formed in the multi-layered substrate.
  4. 4 The RF module according to claim 1, further comprising a quartz oscillator being connected to the base-band IC and being mounted on the first side surface of the multi-layered substrate.
  5. 5. The RF module according to claim 1, wherein the at least one cavity is formed on the second side surface of the multi-layered substrate, and the RF-IC is disposed in said cavity.
  6. 6. The RF module according to claim 5, wherein the RF-IC is a bare chip.
  7. 7, The RF module according to claim 1, wherein at least one of the base-band IC and the memory IC is a bare chip.
    <Desc/Clms Page number 17>
  8. 8. The RF module according to claim 1, wherein the second s de surface of the multi-layered substrate is used as mounting surface.
  9. 9. The RF module according to claim 1, further comprising an antenna incorporated in the multi-layered substrate.
  10. 10. The RF module according to claim 1, further comprising at least one trimming electrode pattern disposed on a surface of said multi-layered substrate, for enabling adjustment of frequency characteristics of the RF module.
  11. 1 : ~. The RF module according to claim 10, wherein the trimming electrode pattern is disposed on the first side surface of the multi-layered substrate.
  12. 12. The RF module according to claim 1, further comprising: a ground electrode pattern for preventing RF signal radiation provided within the multi-layered substrate at a location on the second side surface of the RF-IC, so as to prevent unnecessary radiation of RF signals from the RF-IC;
    and a plurality of via holes arranged within the multilayered substrate and around the RF-IC, the via holes providing connection to the ground electrode pattern for
    <Desc/Clms Page number 18>
    preventing RF signal radiation.
  13. 13. The RF module according to claim 1, further comprising a metallic case formed on the first side surface of the multi-layered substrate.
  14. 14. The RF module according to claim 13, wherein the metallic case serves as part of the antenna. li-). An RF module as hereinbefore described with reference to the accompanying drawings.
GB0220792A 2000-06-20 2001-06-06 RF module Expired - Lifetime GB2376806B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000184046A JP3582460B2 (en) 2000-06-20 2000-06-20 High frequency module
GB0113761A GB2365629B (en) 2000-06-20 2001-06-06 Rf module

Publications (3)

Publication Number Publication Date
GB0220792D0 GB0220792D0 (en) 2002-10-16
GB2376806A true GB2376806A (en) 2002-12-24
GB2376806B GB2376806B (en) 2003-05-28

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0818823A2 (en) * 1996-06-13 1998-01-14 Matsushita Electric Industrial Co., Ltd. Radio frequency module and method for fabricating the radio frequency module
US5717249A (en) * 1995-04-05 1998-02-10 Matsushita Electronics Corporation RF power amplifying circuit device
WO1999021245A1 (en) * 1997-10-20 1999-04-29 Ericsson, Inc. Compact antenna structures including baluns
EP0996155A2 (en) * 1998-10-23 2000-04-26 Sony Corporation Radio frequency integrated circuit apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5717249A (en) * 1995-04-05 1998-02-10 Matsushita Electronics Corporation RF power amplifying circuit device
EP0818823A2 (en) * 1996-06-13 1998-01-14 Matsushita Electric Industrial Co., Ltd. Radio frequency module and method for fabricating the radio frequency module
WO1999021245A1 (en) * 1997-10-20 1999-04-29 Ericsson, Inc. Compact antenna structures including baluns
EP0996155A2 (en) * 1998-10-23 2000-04-26 Sony Corporation Radio frequency integrated circuit apparatus

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GB2376806B (en) 2003-05-28

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Expiry date: 20210605