GB2332569A - Resistance component formed on a thin ceramic plate - Google Patents
Resistance component formed on a thin ceramic plate Download PDFInfo
- Publication number
- GB2332569A GB2332569A GB9825964A GB9825964A GB2332569A GB 2332569 A GB2332569 A GB 2332569A GB 9825964 A GB9825964 A GB 9825964A GB 9825964 A GB9825964 A GB 9825964A GB 2332569 A GB2332569 A GB 2332569A
- Authority
- GB
- United Kingdom
- Prior art keywords
- resistive
- ceramic plate
- coatings
- bonding faces
- resistive coatings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/16—Resistor networks not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
A resistance component comprises a carrier part formed of a thin ceramic plate 10, one or more resistive coatings 20 disposed on the plate 10, and connection elements 30 for forming electrical contact with the resistive coatings, which are disposed on the plate in the form of bonding faces which partly overlap 40 with the resistive coatings. The bonding faces may consist of gold, aluminium or other metals, and different metals may be used for the bonding faces on either side of a resistive coating. The ceramic plate may be scored 50 at intervals adjacent to the resistive coatings, in order to form preset breaking points, so that resistance components with the desired number of resistive coatings 20 can be formed. Separation by laser beam is also possible. The component is suitable for fastening to a printed circuit board upside-down (the "flip-chip technique") so that the connection elements 30 face the contacts on the circuit board.
Description
2332569 1 Resistance component and process for the manufacture thereo
Prior a The invention relates, first of all, to a resistance component comprising a carrier part, at least one resistive coating disposed on the said carrier part and connecting elements connected to the said resistive coating in an electrically conductive manner.
Resistance components of this kind have been known for a fairly long time. They are used, in particular, as protective resistors. For example, there are printed resistors in thick-layer technology, vapour-deposited resistors 'in thin- film technology or SMD resistance components.
What is problematic about these resistance components is, for one thing, the relatively large space requirement which conflicts, in a disadvantageous manner, with miniaturisation. Moreover, the expensive manufacture of such resistance components proves problematical. Finally, the making of contact by the resistance elements, for example with connecting elements of integrated switching circuits or with other connecting elements on carrier boards, is likewise not without problems and, in some cases, entails major expense.
The underlying object of the invention is therefore to procure a resistance component which, while simple to manufacture, has a very small space requirement and with which, moreover, contact can be made in the most varied ways, for example by means of bonding wires, conductive pastes, solders or adhesives or the like.
Advantages of the invention 2 The object is achieved, in the case of a resistance component of the type initially described, through the fact that the carrier part is a thin ceramic plate and that the connecting elements are bonding faces applied to the ceramic plate which partly overlap with the resistive coating for the purpose of forming an electrical contact.
Through the use of the thin ceramic plate, on which there are disposed not only the resistive coatings but also the connecting elements in the form of bonding faces, which elements are connected to the resistive coating and partly overlap with the latter, there is achieved, in particular, an extremely compact construction of the resistance components which, in most cases, also comprise, in particular, a number of individual partial resistors.
As far as the bonding faces are concerned, the most varied forms of embodiment are possible for these. One advantageous form of embodiment makes provision for the bonding faces to consist of gold and/or other metals, preferably aluminium.
It is a particularly great advantage that contact with the resistance element can be made using the flip-chip technique. In the latter, the resistance element is fastened on a printed circuit board with its upper side turned downwards, in such a way that its bonding faces, and with them the resistive coatings also, face towards the printed circuit board and towards the contact faces disposed thereon. In this way, 25 it is possible, in particular, to dispose on the printed circuit board, and to make contact with, even resistor arrays of very small design, a fact which is of decisive advantage in respect of the miniaturising of electronic and electrical circuits.
3 Moreover, the object is also further achieved by a process for manufacturing resistance components with a carrier part, with a resistive coating applied to the said carrier part and with connecting elements which are connected to the said resistive coating in an electrically conductive manner, which process is charactensed in that there is first of all applied to a thin ceramic plate, M the panel, a multiplicity of resistive coatings of predeteimmed length, breadth and height which are adjacent to one another m each case, and that there is applied, on two opposite sides of the resistive coating in each case, bonding faces which overlap, at least partly, with the said resistive coating for the purpose of forming electrical contacts.
This manufacturing process has the particularly great advantage that it is possible to manufacture, mi a suinple manner, resistance components which build extremely compactly and which, M addition, can be adjusted to any resistance value and any tolerance range. The disposition of the bonding faces, which at least partly overlap with the resistive coatings for the purpose of forming electrical contacts, has the advantage that the most varied connecting methods are possible, for example connections by means of bonding wires or by applying conductive pastes, coatings of solder and the like are possible.
In order, for example, to wire the resistance components to an integrated circuit on one side and to printed circuit boards on the other, provision is made, m one advantageous form of embodiment, for bonding faces of different materials to be applied on sides of the resistive coatings which are opposed in each case. For example, gold bonding faces may be applied on one side and aluminium bonding faces on the other.
In order to both use the resistance component as a resistor array in which a number 4 of resistive coatings are disposed so as to lie side by side on a ceramic plate and which is particularly suitable for connection to integrated circuits in particular, and in order, on the other hand, to be able to use even very small resistance components with only one resistive coating, provision is advantageously made for the ceiamic plate to be scored at predetermined intervals adjacent, m each case, to the resistive coatings, for the purpose of forming preset breaking points. As a result of this, resistance components with any de sired number of resistive coatings can be simply broken off.
Drawings Further features and advantages of the invention form the subject of the following description and also of the graphic representation of a number of exemplified embodrnents.
In the drawing, a resistance component which makes use of the invention is represented diagrammatically.
Description of the exe=lified embodiments
A resistance component, which is represented in the figure, comprises a carrier part in the form of a very thin ceramic plate 10 onto which resistive coatings, which are disposed adjacent to one another in each case, are printed in the panel, for example by screen printing technology. The number and disposition of the resistive coatings is determined by the resistance value to be printed on, and by the dimensions of the cerainic plate 10. Bonding faces, for example made of gold 30, are applied, for example by screen printing technology or vapour- deposition, on opposite sides of the resistive coatings 20 in each case, and partly overlap with the said resistive coatings 20 in edge regions 40 for the purpose of forming electrical contacts. It is understood that m addition to gold bonding faces, it is also possible to apply bonding faces made of aluminium or other metals. It is also possible to apply bonding faces of different metals on opposite sides, for example gold on one side and aluminium on the other.
Between the resistive coatings, the ceramic plate 10 may, for example, be scored in order to forTn preset breaking points 50. As a result, the ceramic plate 10 which has, as it were, the shape of a ceramic bar, can be split up into resistance components with different numbers of resistance components. It is understood that, in addition to scratching and breaking, separation by laser beams or by sawing or the like is also possible.
The fact that resistance coatings 20 With a different resistance value and different tolerance can be applied on the ceramic plate 10 is of particular advantage. In _particular, the resistors thus constructed can be easily adjusted. As a result of the disposition of the bonding faces on the ceramic plate 10, moreover, the most vaned possibilities as regards wiring to printed circuit boards and/or IC's and the like are possible. For example, electrical contact can be made by means of bonding wires. However, it is also possible to fasten resistors of this kind on printed circuit boards by means of soldering pastes, conductive pastes and the like. In this case, the resistance components are fastened on the printed circuit board in such a way that their bonding faces 30, and with them their resistive coatings 20 also, face towards the printed circuit board and the contact faces disposed thereon. As a result of this so- called "flip-chip technique", it is possible, in particular, to dispose on the printed circuit board even resistance elements of very small build 6 which, in particular, even comprise a number of resistance elements. This is not only particularly space-saving and therefore of decisive advantage, particularly in respect of the miniaturising of electronic and electrical circuits. Such an arrangement also proves advantageous as regards electromagnetic compatibility. The fact that different bonding materials can be used is also of advantage, for example gold wires can be used from an integrated circuit to the bonding faces 30 of the resistance component whereas aluminium wires are used from the bonding faces 30 of the said resistance component, a fact which makes reductive goldplating superfluous.
7
Claims (1)
1.
4.
Resistance component comprising a carrier part, at least one resistive coating (20) disposed on the said carrier part and connecting elements connected to the said resistive coating (20) M an electrically conductive manner, characterised in that the carrier part is a thin ceramic plate (10) and that the connecting elements are bonding faces (30) applied to the ceramic plate (10) which partly overlap with the resistive coating (20) for the purpose of forming electrical contacts.
Resistance component according to claim 1, characterised m that the bonding faces consist of gold and/or other metals, preferably aluminium.
Resistance component according to claim 1 or 2, characterised in that contact can be made with the said component with its upper side downwards (flip-chip technique).
Process for manufacturing resistance components with a carrier part, with a resistive coating (20) applied to the said carrier part and with connecting elements which are connected to the said resistive coating (20) in an electrically conductive manner, characterised by the following steps:
-there is applied to a thin ceramic plate (10), M the panel, a multiplicity of resistive coatings (20) of predetermined length, breadth and height which are disposed so as to be adjacent to one another, and 5.
6.
7.
8.
9.
8 -there is applied, on two opposite sides of the resistive coatings (20) in each case, bonding faces (30) which partly overlap with the said resistive coatings (20) for the purpose of forming electrical contacts.
Process according to claim 4, characterised in that bonding faces of different materials are applied on sides of the resistive coatings (20) which are opposed in each case.
Process according to claim 4 or 5, characterised in that the ceramic plate is scored at predetermined intervals adjacent, in each case, to the resistive coatings, for the purpose of forming preset breaking points.
Process according to claim 4 or 5, characterised in that the ceramic, plate (10) is divided up by laser beams into resistor arrays of different siZe in order to form resistance components with a different number of resistive coatings (20).
Resistance component substantially as hereinbefore described with reference to the accompanying drawing.
Process for manufacturing resistance components substantially as hereinbefore described with reference to the accompanying drawing.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1997155753 DE19755753A1 (en) | 1997-12-16 | 1997-12-16 | Resistor device and method for its production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB9825964D0 GB9825964D0 (en) | 1999-01-20 |
| GB2332569A true GB2332569A (en) | 1999-06-23 |
Family
ID=7852006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9825964A Withdrawn GB2332569A (en) | 1997-12-16 | 1998-11-26 | Resistance component formed on a thin ceramic plate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH11251102A (en) |
| DE (1) | DE19755753A1 (en) |
| GB (1) | GB2332569A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11302462B2 (en) | 2018-06-25 | 2022-04-12 | Vishay Electronic Gmbh | Method for producing a plurality of resistance modular units over a ceramic substrate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3493225A1 (en) * | 2017-11-30 | 2019-06-05 | Siemens Aktiengesellschaft | Brake resistance device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1033858A (en) * | 1963-10-29 | 1966-06-22 | Corning Glass Works | Electrical resistor and method of manufacture |
| GB1302272A (en) * | 1970-02-27 | 1973-01-04 | ||
| EP0032087A2 (en) * | 1980-01-04 | 1981-07-15 | Thomson-Csf | Plate with a row of resistors with very small spacing |
| EP0398364A2 (en) * | 1989-05-18 | 1990-11-22 | Kabushiki Kaisha Toshiba | Thick-film element having flattened resistor layer |
| GB2255236A (en) * | 1991-04-12 | 1992-10-28 | Beltone Electronics Corp | Manufacture of resistive elements by thick film deposition |
| GB2302452A (en) * | 1994-06-09 | 1997-01-15 | Chipscale Inc | Resistor fabrication |
-
1997
- 1997-12-16 DE DE1997155753 patent/DE19755753A1/en not_active Withdrawn
-
1998
- 1998-11-26 GB GB9825964A patent/GB2332569A/en not_active Withdrawn
- 1998-12-16 JP JP10358174A patent/JPH11251102A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1033858A (en) * | 1963-10-29 | 1966-06-22 | Corning Glass Works | Electrical resistor and method of manufacture |
| GB1302272A (en) * | 1970-02-27 | 1973-01-04 | ||
| EP0032087A2 (en) * | 1980-01-04 | 1981-07-15 | Thomson-Csf | Plate with a row of resistors with very small spacing |
| EP0398364A2 (en) * | 1989-05-18 | 1990-11-22 | Kabushiki Kaisha Toshiba | Thick-film element having flattened resistor layer |
| GB2255236A (en) * | 1991-04-12 | 1992-10-28 | Beltone Electronics Corp | Manufacture of resistive elements by thick film deposition |
| GB2302452A (en) * | 1994-06-09 | 1997-01-15 | Chipscale Inc | Resistor fabrication |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11302462B2 (en) | 2018-06-25 | 2022-04-12 | Vishay Electronic Gmbh | Method for producing a plurality of resistance modular units over a ceramic substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19755753A1 (en) | 1999-06-17 |
| GB9825964D0 (en) | 1999-01-20 |
| JPH11251102A (en) | 1999-09-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |