GB2325092B - Controlled reflow of flexible copper laminated polyester circuit assemblies - Google Patents

Controlled reflow of flexible copper laminated polyester circuit assemblies

Info

Publication number
GB2325092B
GB2325092B GB9809715A GB9809715A GB2325092B GB 2325092 B GB2325092 B GB 2325092B GB 9809715 A GB9809715 A GB 9809715A GB 9809715 A GB9809715 A GB 9809715A GB 2325092 B GB2325092 B GB 2325092B
Authority
GB
United Kingdom
Prior art keywords
laminated polyester
flexible copper
circuit assemblies
copper laminated
controlled reflow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9809715A
Other versions
GB2325092A (en
GB9809715D0 (en
Inventor
Alan Fox
Doug Blake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB9809715A priority Critical patent/GB2325092B/en
Publication of GB9809715D0 publication Critical patent/GB9809715D0/en
Publication of GB2325092A publication Critical patent/GB2325092A/en
Application granted granted Critical
Publication of GB2325092B publication Critical patent/GB2325092B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB9809715A 1998-05-08 1998-05-08 Controlled reflow of flexible copper laminated polyester circuit assemblies Expired - Fee Related GB2325092B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9809715A GB2325092B (en) 1998-05-08 1998-05-08 Controlled reflow of flexible copper laminated polyester circuit assemblies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9809715A GB2325092B (en) 1998-05-08 1998-05-08 Controlled reflow of flexible copper laminated polyester circuit assemblies

Publications (3)

Publication Number Publication Date
GB9809715D0 GB9809715D0 (en) 1998-07-08
GB2325092A GB2325092A (en) 1998-11-11
GB2325092B true GB2325092B (en) 1999-04-07

Family

ID=10831572

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9809715A Expired - Fee Related GB2325092B (en) 1998-05-08 1998-05-08 Controlled reflow of flexible copper laminated polyester circuit assemblies

Country Status (1)

Country Link
GB (1) GB2325092B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19855715A1 (en) * 1998-12-03 2000-09-28 Leuze Electronic Gmbh & Co Arrangement for processing a circuit board
DE10223209A1 (en) * 2002-05-24 2003-12-04 Delphi Tech Inc Process for improving the electrical conductivity and the corrosion and wear resistance of a flexible circuit
DE102021112047A1 (en) * 2021-05-07 2022-11-10 Ersa Gmbh Traversing unit for moving two soldering assemblies for processing printed circuit boards and soldering system for selective wave soldering with one traversing unit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3916515A (en) * 1974-09-26 1975-11-04 Northern Electric Co Method of producing printed circuit board in multiple units
GB2191963A (en) * 1986-06-24 1987-12-31 Sony Corp Apparatus for positioning circuit components at predetermined locations on circuit boards
EP0325450A2 (en) * 1988-01-19 1989-07-26 Nihon Den-Netsu Keiki Co., Ltd. Device for correcting warp of printed circuit boards in a carrierless soldering apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3916515A (en) * 1974-09-26 1975-11-04 Northern Electric Co Method of producing printed circuit board in multiple units
GB2191963A (en) * 1986-06-24 1987-12-31 Sony Corp Apparatus for positioning circuit components at predetermined locations on circuit boards
EP0325450A2 (en) * 1988-01-19 1989-07-26 Nihon Den-Netsu Keiki Co., Ltd. Device for correcting warp of printed circuit boards in a carrierless soldering apparatus

Also Published As

Publication number Publication date
GB2325092A (en) 1998-11-11
GB9809715D0 (en) 1998-07-08

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20020508