GB2317051B - Engagement assembly for connecting a heat dissipation device to an integrated circuit - Google Patents

Engagement assembly for connecting a heat dissipation device to an integrated circuit

Info

Publication number
GB2317051B
GB2317051B GB9618770A GB9618770A GB2317051B GB 2317051 B GB2317051 B GB 2317051B GB 9618770 A GB9618770 A GB 9618770A GB 9618770 A GB9618770 A GB 9618770A GB 2317051 B GB2317051 B GB 2317051B
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
heat dissipation
dissipation device
engagement assembly
engagement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9618770A
Other versions
GB2317051A (en
GB9618770D0 (en
Inventor
Ching-Shen Horng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HORNG CHING SHEN
Original Assignee
HORNG CHING SHEN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HORNG CHING SHEN filed Critical HORNG CHING SHEN
Priority to GB9618770A priority Critical patent/GB2317051B/en
Priority to DE29616291U priority patent/DE29616291U1/en
Priority to FR9612117A priority patent/FR2754418B3/en
Publication of GB9618770D0 publication Critical patent/GB9618770D0/en
Publication of GB2317051A publication Critical patent/GB2317051A/en
Application granted granted Critical
Publication of GB2317051B publication Critical patent/GB2317051B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB9618770A 1996-09-09 1996-09-09 Engagement assembly for connecting a heat dissipation device to an integrated circuit Expired - Fee Related GB2317051B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB9618770A GB2317051B (en) 1996-09-09 1996-09-09 Engagement assembly for connecting a heat dissipation device to an integrated circuit
DE29616291U DE29616291U1 (en) 1996-09-09 1996-09-19 Connection kit for combining a heat dissipation device with an integrated circuit
FR9612117A FR2754418B3 (en) 1996-09-09 1996-10-04 SOCKET ASSEMBLY FOR FIXING A THERMAL DISSIPATION DEVICE ON AN INTEGRATED CIRCUIT

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9618770A GB2317051B (en) 1996-09-09 1996-09-09 Engagement assembly for connecting a heat dissipation device to an integrated circuit
DE29616291U DE29616291U1 (en) 1996-09-09 1996-09-19 Connection kit for combining a heat dissipation device with an integrated circuit

Publications (3)

Publication Number Publication Date
GB9618770D0 GB9618770D0 (en) 1996-10-23
GB2317051A GB2317051A (en) 1998-03-11
GB2317051B true GB2317051B (en) 2001-06-06

Family

ID=26059431

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9618770A Expired - Fee Related GB2317051B (en) 1996-09-09 1996-09-09 Engagement assembly for connecting a heat dissipation device to an integrated circuit

Country Status (3)

Country Link
DE (1) DE29616291U1 (en)
FR (1) FR2754418B3 (en)
GB (1) GB2317051B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10016061A1 (en) * 2000-03-31 2001-10-04 Adda Corp Fixture device for heat-sink e.g. for use with CPU, has handle engaging retainer strap and has its two limbs designed to fit one of two clamps

Also Published As

Publication number Publication date
GB2317051A (en) 1998-03-11
FR2754418A3 (en) 1998-04-10
GB9618770D0 (en) 1996-10-23
DE29616291U1 (en) 1996-11-21
FR2754418B3 (en) 1998-08-21

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20040909