GB2310536A - Cooling fans for integrated circuits. - Google Patents

Cooling fans for integrated circuits. Download PDF

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Publication number
GB2310536A
GB2310536A GB9603633A GB9603633A GB2310536A GB 2310536 A GB2310536 A GB 2310536A GB 9603633 A GB9603633 A GB 9603633A GB 9603633 A GB9603633 A GB 9603633A GB 2310536 A GB2310536 A GB 2310536A
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GB
United Kingdom
Prior art keywords
fan
board member
hole
fan device
finned plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9603633A
Other versions
GB2310536B (en
GB9603633D0 (en
Inventor
Chen Fu-In Hong
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Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB9603633A priority Critical patent/GB2310536B/en
Publication of GB9603633D0 publication Critical patent/GB9603633D0/en
Publication of GB2310536A publication Critical patent/GB2310536A/en
Application granted granted Critical
Publication of GB2310536B publication Critical patent/GB2310536B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3677Wire-like or pin-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling arrangement for an integrated circuit includes a finned plate (1), a fan (2) having a rotor shaft (21), and a board member (3) mounted on the finned plate. The finned plate includes a plurality of rows and columns of fins (14) extending upwardly from an upper side thereof, adjacent fins having a gap (12) defined therebetween into which protrusions 34 of the board are fitted. The board member includes a hole (30), a support member (32) provided in the hole, and a plurality of ribs (31). A stud (33) rotatably receives the rotor shaft of the fan.

Description

Far Assernbl for an Integrated Circuit Background of the Invention The present invention relates to a fan device for an integrated circuit and, more particularly, to an improved =an device which avoids accumulation of dust and the lie.
Heat transfer is an important factor to performance of integrated circuits. Although a wide variety of cooling devices have heretofore been provided, the results are not satisfactory in every respect. For example, U.S. Patent No.
5,299,632 to Lee, issued on April 5, 1994 and U.S. Patent No.
5,309,983 to Bailey, issued on May 10, 1994 disclose heat diss~pating devices comprising a motorized fan assembly which occupies a relatively large volume and thus may not be used in portable computers. U.S. Patent No. 5,288,203 to Thomas, issued on Feb. 22, 1994, discloses a fan engaged in a fan frame member for reducing the volume of the fan, yet this adversely affects the heat transfer effect. Applicant's U.S.
Patent Application Serial No. 08/399,041 filed on March 6, 1995 discloses a compact fan device to solve the problems in the prior art patents. Nevertheless, it is found that dust tends to accumulate in coils of the fan or other elements as an axle cap thereof which interconnects blades and encloses a rotor shaft and the coils of the fan faces upwardly, resulting in malfunction of the fan and,'or the integrated circuits as well as generation of noise during rotation of the fan. Furthermore, the amount of cool air induced by the fan is not maximized. The present invention is intended to provide an improved design to mitigate and/or obviate the above problems.
Summary of the Invention In accordance with the present invention, a fan device for an integrated circuit includes a finned plate, a fan having a rotor shaft, and a board member mounted to the finned plate. The finned plate includes a plurality of rows and columns of fins extending upwardly from an upper side thereof and a space defined in a center of the upper side, each two adjacent fins having a gap defined therebetween.
The board member includes a hole defined in a mediate portion thereof, a support member provided in the hole, and a plurality of ribs extending downwardly from a periphery defining the hole to the support member, the support member including a stud formed on an upper side thereof and having a second hole defined therein for rotatably receiving the rotor shaft of the fan.
In accordance with one aspect of the invention, the board member further includes a plurality of protrusions extending outwardly from at least one side thereof, each protrusion being fittingly received in an associated gap and thus being securely held between two associated adjacent fins.
In accordance with a further aspect of the invention, the board member further includes a plurality of resilient legs extending downwardly and outwardly from an underside thereof, each leg being fittingly received in an associated gap and thus being securely held between two associated adjacent fins.
In accordance with another aspect of the invention, the board member includes a plurality of third holes defined therein and is secured to the finned plate by fasteners, such as screws.
In accordance with still another aspect of the invention, one of the ribs has a groove defined therein through which electric wires of the fan extend as so to electrically connect a power source.
Other objects, advantages, and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
Brief Description of the Drawings Fig. 1 is an exploded perspective view of a first embodiment of a fan device for an integrated circuit in accordance with the present invention; Fig. 2 is a top plan view of the assembled fan device in Fig. 1; Fig. 3 is a cross-sectional view taken along line 3-3 in Fig. 2; Fig. 4 is an exploded perspective view of a second embodiment of a fan device for an integrated circuit in accordance with the present invention; Fig. 5 is a top plan view of the assembled fan device in Fig. 4; Fig. 6 is a cross-sectional view taken along line 6-6 in Fig. 5; Fig. 7 is an exploded perspective view of a third embodiment of a fan device for an integrated circuit in accordance with the present invention; Fig. 8 is a top plan view of the assembled fan device in Fig. 7; and Fig. 9 is a cross-sectional view taken along line 9-9 in Fig. 8.
Description of the Preferred Embodiments Referring to the drawings and initially to Figs. 1 to 3, a fan device for an integrated circuit in accordance with the present invention generally includes a finned plate 1, a fan 2, and a board member 3. The finned plate 1 includes a plurality of rows and columns of fins 14 extending from an upper side thereof and a space 11 defined in a center of the upper side, each two fins 14 being separated by a gap 12 for air circulation purpose. The finned plate 1 is made of materials having excellent heat dissipation characteristics, such as aluminum. Preferably, the fins 14 are integral with the finned plate 1 and made of the same material. As shown in Fig. 1, each of two rows of fins 14 includes a snapping hooked end 13 in an upper end thereof for retaining the board member 3 in position.
The board member 3 includes a hole 30 defined in a mediate portion thereof and a support member 32 is provided in the hole 30 and connected to a periphery defining the hole 30 by a plurality of ribs 31. Each rib 31 extends downwardly from the periphery defining the hole 30 to the support member 32, and one of the ribs 31 has a groove 31a (see Fig. 1) through which electric wires (not labeled) of the fan 2 extend as so to electrically connect a power source (not shown). A stud 33 is formed on an upper side of the support member 32 and includes a hole (not labeled) defined therein for rotatably receiving a rotor shaft 21 of the fan 2. The board member 3 further includes a plurality of protrusions 34 extending outwardly from at least one side thereof, each protrusion 34 being fittingly received in an associated gap 12 and thus being securely held between two associated adjacent fins 14.
In assembly, as shown in Figs. 2 and 3, the board member 3, after the fan 2 is mounted thereon, is snapped through the snapping hooked ends 13 of the fins 1 and is thus mounted to the finned plate 1 with the protrusions 34 received in associated gaps 34. The support member 32 and the fan 2 mounted thereon are received in the space 11 of the finned plate 1, while the snapping hooked ends 13 of the finned plate 1 assist in retaining the board member 3 in position. By such an arrangement, the coils of the fan 2 are shielded by an axle cap 22 interconnecting blades 23 of the fan 2 and enclosing the coils and the rotor shaft 21 of the fan 2 such that accumulation of dust does not easily occur, and rotation of the blades does not generate noise. In addition, a large amount of cool air can be induced to the finned plate 1 and passed through the gaps 12 between the rows and columns of the fins 14, thereby providing a better cooling effect.
Figs. 4 through 6 illustrate a second embodiment of a fan device in accordance with the present invention in which like elements are designated by like reference numerals. The fan device of the second embodiment includes a fan 2, a finned plate 1, and a board member 4, the fan 2 and the finned plate 1 being identical to those disclosed in the first embodiment and therefore not redundantly described. The board member 4 includes a hole 40 defined in a mediate portion thereof and a support member 42 is provided in the hole 40 and connected to a periphery defining the hole 40 by a plurality of ribs 41. Each rib 41 extends downwardly from the periphery defining the hole 40 to the support member 42, and one of the ribs 41 has a groove 41a (see Fig. 4) through which electric wires (not labeled) of the fan 2 extend as so to electrically connect a power source (not shown). A stud 43 is formed on an upper side of the support member 42 and includes a hole (not labeled) defined therein for rotatably receiving a rotor shaft 21 of the fan 2. The board member 4 further includes a plurality of legs 44 extending downwardly and outwardly from an underside thereof, each leg 44 being fittingly received in an associated gap 12 and thus being securely held between two associated adjacent fins 14 (see Figs. 5 and 6). It is appreciated that the legs 44 are resilient and thus may absorb shocks and vibrations. It is further appreciated that the board member 4 may further include protrusions extending outwardly from at least one side thereof, similar to the protrusions 33 disclosed in the first embodiment, to provide a better positioning effect.
Figs. 7 through 9 illustrate a third embodiment of a fan device in accordance with the present invention in which like elements are designated by like reference numerals. The fan device of the second embodiment includes a fan 2, a finned plate 1, and a board member 5, the fan 2 and the finned plate 1 being identical to those disclosed in the first and second embodiments and therefore not redundantly described. The board member 5 includes a hole 50 defined in a mediate portion thereof and a support member 52 is provided in the hole 50 and connected to a periphery defining the hole 50 by a plurality of ribs 51. Each rib 51 extends downwardly from the periphery defining the hole 50 to the support member 52, and one of the ribs 51 has a groove 51a (see Fig. 7) through which electric wires (not labeled) of the fan 2 extend as so to electrically connect a power source (not shown). A stud 53 is formed on an upper side of the support member 52 and includes a hole (not labeled) defined therein for rotatably receiving a rotor shaft 21 of the fan 2. Unlike the first and second embodiments, the board member 5 is fixedly mounted to the finned plate 1 by means of fasteners, such as screws 55 and associated screw holes 54.
According to the above description, it is appreciated that, as the axle cap 22 faces downwardly, the coils of the fan 2 are shielded by the axle cap 22 of the fan 2 such that accumulation of dust does not easily occur, and rotation of the blades does not generate noise. In addition, a maximum amount of cool air can be induced to the finned plate 1 and passed through the gaps 12 between the rows and columns of the fins 14, thereby providing a better cooling effect.
Furthermore, the board member can be mounted to the finned plate 1 by screws, extending legs, or protrusions, or a combination thereof, thereby providing a reliable positioning effect.
Although the invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the scope of the invention as hereinafter claimed.

Claims (12)

1. A fan device for an integrated circuit comprising: a finned plate including a plurality of rows and columns of fins extending upwardly from an upper side thereof and a space defined in a center of the upper side, each two adjacent fins having a gap defined therebetween; a fan having a rotor shaft; and a board member securely mounted to the finned plate and including a hole defined in a mediate portion thereof, a support member provided in the hole, and a plurality of ribs extending downwardly from a periphery defining the hole to the support member, the support member including a stud formed on an upper side thereof and having a second hole defined therein for rotatably receiving the rotor shaft of the fan.
2. The fan device as claimed in claim 1, wherein the board member further includes a plurality of protrusions extending outwardly from at least one side thereof, each protrusion being fittingly received in an associated said gap and thus being securely held between two associated adjacent said fins.
3. The fan device as claimed in claim 1, wherein the board member further includes a plurality of resilient legs extending downwardly and outwardly from an underside thereof, each leg being fittingly received in an associated gap and thus being securely held between two associated adjacent said fins.
4. The fan device as claimed in claim 2, wherein the board member further includes a plurality of resilient legs extending downwardly and outwardly from an underside thereof, each leg being fittingly received in an associated gap and thus being securely held between two associated adjacent said fins.
5. The fan device as claimed in claim 1, wherein the board member includes a plurality of third holes defined therein and is secured to the finned plate by fasteners.
6. The fan device as claimed in claim 2, wherein the board member includes a plurality of third holes defined therein and is secured to the finned plate by fasteners.
7. The fan device as claimed in claim 3, wherein the board member includes a plurality of third holes defined therein and is secured to the finned plate by fasteners.
8. The fan device as claimed in claim 4, wherein the board member includes a plurality of third holes defined therein and is secured to the finned plate by fasteners.
9. The fan device as claimed in claim 1, in which one of the ribs has a groove defined therein through which electric wires of the fan extend as so to electrically connect a power source.
10. A fan assisted heat sink device comprising a heat sink member having finning extending from a base portion thereof; a support fitted to said heat sink member and having a through hole aligned with a space defined by said finning; a fan mounting member attached to said support and providing a fan mount in said space and between said through hole and said base portion; and a fan mounted to said fan mount.
11. A device as claimed in claim 10, wherein said support is fitted to said heat sink member by means of lugs or legs extending from said support into gaps in said finning, or by fasteners, or by any combination of said lugs, legs and fasteners.
12. A fan device substantially as hereinbefore described with reference to Figures 1 to 3, Figures 4 to 6 or Figures 7 to 9 of the accompanying drawings.
GB9603633A 1996-02-21 1996-02-21 Fan assembly for an integrated circuit Expired - Fee Related GB2310536B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9603633A GB2310536B (en) 1996-02-21 1996-02-21 Fan assembly for an integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9603633A GB2310536B (en) 1996-02-21 1996-02-21 Fan assembly for an integrated circuit

Publications (3)

Publication Number Publication Date
GB9603633D0 GB9603633D0 (en) 1996-04-17
GB2310536A true GB2310536A (en) 1997-08-27
GB2310536B GB2310536B (en) 2000-06-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
GB9603633A Expired - Fee Related GB2310536B (en) 1996-02-21 1996-02-21 Fan assembly for an integrated circuit

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5287249A (en) * 1993-07-07 1994-02-15 Global Win Technology Co., Ltd. Fin assembly for an integrated circuit
US5335722A (en) * 1993-09-30 1994-08-09 Global Win Technology Co., Ltd Cooling assembly for an integrated circuit
WO1995021518A1 (en) * 1994-02-07 1995-08-10 Nidec Corporation Detachable apparatus for cooling integrated circuits
GB2293487A (en) * 1994-09-21 1996-03-27 Hewlett Packard Co Attacking heat sinks to integrated circuits

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5377745A (en) * 1993-11-30 1995-01-03 Hsieh; Hsin M. Cooling device for central processing unit
US5421402A (en) * 1994-11-22 1995-06-06 Lin; Chuen-Sheng Heat sink apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5287249A (en) * 1993-07-07 1994-02-15 Global Win Technology Co., Ltd. Fin assembly for an integrated circuit
US5335722A (en) * 1993-09-30 1994-08-09 Global Win Technology Co., Ltd Cooling assembly for an integrated circuit
WO1995021518A1 (en) * 1994-02-07 1995-08-10 Nidec Corporation Detachable apparatus for cooling integrated circuits
GB2293487A (en) * 1994-09-21 1996-03-27 Hewlett Packard Co Attacking heat sinks to integrated circuits

Also Published As

Publication number Publication date
GB2310536B (en) 2000-06-07
GB9603633D0 (en) 1996-04-17

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Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20090221