GB2310536B - Fan assembly for an integrated circuit - Google Patents

Fan assembly for an integrated circuit

Info

Publication number
GB2310536B
GB2310536B GB9603633A GB9603633A GB2310536B GB 2310536 B GB2310536 B GB 2310536B GB 9603633 A GB9603633 A GB 9603633A GB 9603633 A GB9603633 A GB 9603633A GB 2310536 B GB2310536 B GB 2310536B
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
fan assembly
fan
assembly
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9603633A
Other versions
GB9603633D0 (en
GB2310536A (en
Inventor
Chen Fu-In Hong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB9603633A priority Critical patent/GB2310536B/en
Publication of GB9603633D0 publication Critical patent/GB9603633D0/en
Publication of GB2310536A publication Critical patent/GB2310536A/en
Application granted granted Critical
Publication of GB2310536B publication Critical patent/GB2310536B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB9603633A 1996-02-21 1996-02-21 Fan assembly for an integrated circuit Expired - Fee Related GB2310536B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9603633A GB2310536B (en) 1996-02-21 1996-02-21 Fan assembly for an integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9603633A GB2310536B (en) 1996-02-21 1996-02-21 Fan assembly for an integrated circuit

Publications (3)

Publication Number Publication Date
GB9603633D0 GB9603633D0 (en) 1996-04-17
GB2310536A GB2310536A (en) 1997-08-27
GB2310536B true GB2310536B (en) 2000-06-07

Family

ID=10789132

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9603633A Expired - Fee Related GB2310536B (en) 1996-02-21 1996-02-21 Fan assembly for an integrated circuit

Country Status (1)

Country Link
GB (1) GB2310536B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5287249A (en) * 1993-07-07 1994-02-15 Global Win Technology Co., Ltd. Fin assembly for an integrated circuit
US5335722A (en) * 1993-09-30 1994-08-09 Global Win Technology Co., Ltd Cooling assembly for an integrated circuit
US5377745A (en) * 1993-11-30 1995-01-03 Hsieh; Hsin M. Cooling device for central processing unit
US5421402A (en) * 1994-11-22 1995-06-06 Lin; Chuen-Sheng Heat sink apparatus
WO1995021518A1 (en) * 1994-02-07 1995-08-10 Nidec Corporation Detachable apparatus for cooling integrated circuits
GB2293487A (en) * 1994-09-21 1996-03-27 Hewlett Packard Co Attacking heat sinks to integrated circuits

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5287249A (en) * 1993-07-07 1994-02-15 Global Win Technology Co., Ltd. Fin assembly for an integrated circuit
US5335722A (en) * 1993-09-30 1994-08-09 Global Win Technology Co., Ltd Cooling assembly for an integrated circuit
US5377745A (en) * 1993-11-30 1995-01-03 Hsieh; Hsin M. Cooling device for central processing unit
WO1995021518A1 (en) * 1994-02-07 1995-08-10 Nidec Corporation Detachable apparatus for cooling integrated circuits
GB2293487A (en) * 1994-09-21 1996-03-27 Hewlett Packard Co Attacking heat sinks to integrated circuits
US5421402A (en) * 1994-11-22 1995-06-06 Lin; Chuen-Sheng Heat sink apparatus

Also Published As

Publication number Publication date
GB9603633D0 (en) 1996-04-17
GB2310536A (en) 1997-08-27

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20090221