GB2264003A - Field-assisted bonding - Google Patents

Field-assisted bonding

Info

Publication number
GB2264003A
GB2264003A GB9306356A GB9306356A GB2264003A GB 2264003 A GB2264003 A GB 2264003A GB 9306356 A GB9306356 A GB 9306356A GB 9306356 A GB9306356 A GB 9306356A GB 2264003 A GB2264003 A GB 2264003A
Authority
GB
United Kingdom
Prior art keywords
voltage
workpieces
interface
another
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9306356A
Other versions
GB9306356D0 (en
Inventor
Tony William James Rogers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BTG International Ltd
Original Assignee
British Technology Group Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB909020908A external-priority patent/GB9020908D0/en
Application filed by British Technology Group Ltd filed Critical British Technology Group Ltd
Priority to GB9306356A priority Critical patent/GB2264003A/en
Publication of GB9306356D0 publication Critical patent/GB9306356D0/en
Publication of GB2264003A publication Critical patent/GB2264003A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

The invention relates to a method of bonding together two workpieces, of which at least one is (or has a surface which is) of a material which is electrically substantially non-conductive, by the field-assisted bonding process known as electrostatic bonding which comprises the steps of positioning the workpieces in contact with one another at a common interface, maintaining at least their interface at an elevated temperature, applying a substantial first voltage between them so as to establish at the interface an electrostatic attraction which forces the workpiece surfaces into intimate contact with one another and causes them to bond to one another, and thereafter removing the applied voltage and allowing the workpieces to cool. According to the invention this process is improved by including the additional step, after application of the first voltage and while still maintaining the said interface at elevated temperature, of applying between the workpieces a second voltage of opposite polarity to the first voltage.
GB9306356A 1990-09-26 1993-03-26 Field-assisted bonding Withdrawn GB2264003A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9306356A GB2264003A (en) 1990-09-26 1993-03-26 Field-assisted bonding

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB909020908A GB9020908D0 (en) 1990-09-26 1990-09-26 Field-assisted bonding
PCT/GB1991/001659 WO1992005575A1 (en) 1990-09-26 1991-09-26 Field-assisted bonding
GB9306356A GB2264003A (en) 1990-09-26 1993-03-26 Field-assisted bonding

Publications (2)

Publication Number Publication Date
GB9306356D0 GB9306356D0 (en) 1993-06-09
GB2264003A true GB2264003A (en) 1993-08-11

Family

ID=26297702

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9306356A Withdrawn GB2264003A (en) 1990-09-26 1993-03-26 Field-assisted bonding

Country Status (1)

Country Link
GB (1) GB2264003A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285714A (en) * 1978-12-07 1981-08-25 Spire Corporation Electrostatic bonding using externally applied pressure

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285714A (en) * 1978-12-07 1981-08-25 Spire Corporation Electrostatic bonding using externally applied pressure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Pat. abs. of Japan, vol.12, No.414 (E-677)(3261) 2Nov 1988 &JP A 63 152 154 (FUJITSU) 24 Jun 1988 *

Also Published As

Publication number Publication date
GB9306356D0 (en) 1993-06-09

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)