GB2257437B - Method for forming triniobium tin semiconductor - Google Patents
Method for forming triniobium tin semiconductorInfo
- Publication number
- GB2257437B GB2257437B GB9213163A GB9213163A GB2257437B GB 2257437 B GB2257437 B GB 2257437B GB 9213163 A GB9213163 A GB 9213163A GB 9213163 A GB9213163 A GB 9213163A GB 2257437 B GB2257437 B GB 2257437B
- Authority
- GB
- United Kingdom
- Prior art keywords
- triniobium tin
- forming
- tin semiconductor
- semiconductor
- forming triniobium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- KNYAMFPIBOJKIO-UHFFFAOYSA-N [Nb].[Nb].[Nb].[Sn] Chemical compound [Nb].[Nb].[Nb].[Sn] KNYAMFPIBOJKIO-UHFFFAOYSA-N 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
- C23C2/261—After-treatment in a gas atmosphere, e.g. inert or reducing atmosphere
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
- C23C2/28—Thermal after-treatment, e.g. treatment in oil bath
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0184—Manufacture or treatment of devices comprising intermetallic compounds of type A-15, e.g. Nb3Sn
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Thermal Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72301791A | 1991-06-28 | 1991-06-28 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9213163D0 GB9213163D0 (en) | 1992-08-05 |
GB2257437A GB2257437A (en) | 1993-01-13 |
GB2257437B true GB2257437B (en) | 1994-05-18 |
Family
ID=24904459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9213163A Expired - Lifetime GB2257437B (en) | 1991-06-28 | 1992-06-22 | Method for forming triniobium tin semiconductor |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH0799652B2 (en) |
GB (1) | GB2257437B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110560817A (en) * | 2019-08-26 | 2019-12-13 | 苏州新材料研究所有限公司 | continuous soldering device for superconducting materials |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0690143A1 (en) * | 1994-06-27 | 1996-01-03 | General Electric Company | Method of coating niobium foil |
US5505790A (en) * | 1994-09-09 | 1996-04-09 | General Electric Company | Method for enhancing critical current of triniobium tin |
US6358331B1 (en) * | 1995-04-03 | 2002-03-19 | General Electric Company | Method for improving quality of triniobium tin superconductor in manufacturing environment by controlling iron content in molten tin bath |
US5540787A (en) * | 1995-06-14 | 1996-07-30 | General Electric Company | Method of forming triniobium tin superconductor |
GB2308490A (en) * | 1995-12-18 | 1997-06-25 | Oxford Instr Ltd | Superconductor and energy storage device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1342726A (en) * | 1970-02-04 | 1974-01-03 | Plessey Co Ltd | Electrical conductors |
US4323402A (en) * | 1979-02-09 | 1982-04-06 | National Research Institute For Metals | Method for producing superconducting Nb3 Sn wires |
-
1992
- 1992-06-22 GB GB9213163A patent/GB2257437B/en not_active Expired - Lifetime
- 1992-06-25 JP JP4166513A patent/JPH0799652B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1342726A (en) * | 1970-02-04 | 1974-01-03 | Plessey Co Ltd | Electrical conductors |
US4323402A (en) * | 1979-02-09 | 1982-04-06 | National Research Institute For Metals | Method for producing superconducting Nb3 Sn wires |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110560817A (en) * | 2019-08-26 | 2019-12-13 | 苏州新材料研究所有限公司 | continuous soldering device for superconducting materials |
Also Published As
Publication number | Publication date |
---|---|
GB9213163D0 (en) | 1992-08-05 |
JPH05198227A (en) | 1993-08-06 |
GB2257437A (en) | 1993-01-13 |
JPH0799652B2 (en) | 1995-10-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE20 | Patent expired after termination of 20 years |
Expiry date: 20120621 |