GB2222310A - Excimer laser trimming of resistor - Google Patents
Excimer laser trimming of resistor Download PDFInfo
- Publication number
- GB2222310A GB2222310A GB8818744A GB8818744A GB2222310A GB 2222310 A GB2222310 A GB 2222310A GB 8818744 A GB8818744 A GB 8818744A GB 8818744 A GB8818744 A GB 8818744A GB 2222310 A GB2222310 A GB 2222310A
- Authority
- GB
- United Kingdom
- Prior art keywords
- thick film
- polymer thick
- resistance element
- excimer laser
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
- H01C7/005—Polymer thick films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The electrical resistance value of a polymer thick film resistance element on an electrically insulating substrate is adjusted to a desired value, measured between conductive terminations, by removing polymer thick material of the resistance element using an excimer laser. Alternatively, one or more polymer thick film electrical conductors is or are provided on the substrate and arranged to shunt portions of the resistance element. The excimer laser is then used to selectively cut through the one or more polymer thick film conductors to provide step-wise adjustment of the resistance value, measured between the terminations. The process is advantageous in that, unlike other lasers, the excimer laser does not cause charring of the organic polymer material.
Description
SPECIFICATION
TITLE : ELECTRICAL RESISTOR ADJUSTMENT PROCESS
This invention relates to polymer thick film electrical resistance elements deposited on electrically insulating substrates and provided with electrically conductive terminations. More particularly, the invention provides a method of adjusting, to a predetermined value, the electrical resistance of a polymer thick film resistance element measured between the conductive terminations.
The invention is applicable to fixed and variable resistors incorporating polymer thick film resistance elements.
Polymer thick film electrical resistance elements are well known and comprise an organic polymer material having dispersed therein particles of electrically conductive material, usually carbon. Polymer thick film electrical conductors are also known and which may be used as terminations for the resistance elements. Such conductors also comprise organic polymer materials having dispersed therein particles of electrically conductive material, but in this case the conductive material has a higher electrical conductivity and suitably comprises silver or copper. The resistance elements and conductors are usually provided on insulating substrates by means of screen printing techniques.
As with other forms of film resistance elements, it is not usually possible to deposit polymer thick film resistance elements in such a way that precisely a required resistance value is achieved, measured between conductive terminations. With other forms of film resistance elements it has become common practice to use solid state lasers (eg YAG lasers) or carbon dioxide or xenon gas lasers for adjusting the electrical resistance to a desired value, such lasers operating to vapourise material of the resistance element in the form of one or more narrow cuts. However, such lasers have been found to be unsuitable for use with polymer thick film resistance elements since they result in undesirable charring of the organic polymer materials which are employed in such elements.
We have now found that it is possible to overcome this problem by a process in which an excimer laser is used to adjust, to a desired value, the resistance of a polymer thick film resistor. By means of an excimer laser, polymer thick film resistive or conductive material can be removed in controlled manner without any residual charring of organic polymer material, removal of material being by a process known as ablation.
The e excimer laser can be used in two methods of adjustment. In a first method an excimer laser is used to remove polymer thick film resistance material from a polymer thick film resistance element provided on an electrically insulating substrate, until a desired resistance value is obtained measured between conductive terminations provided in electrical contact with the element on the substrate.
In a second method, a polymer thick film resistance element is provided on an electrically insulating substrate and one or more polymer thick film electrical conductors is or are provided on the substrate and adapted and arranged to shunt (ie short-circuit) portions of the resistance element. An excimer laser is used to selectively cut through the one or more polymer thick film conductors whereby the resistance value, measured between conductive terminations provided on the substrate in electrical contact with the resistance element, is adjusted in step-wise manner until a desired value is obtained.
Claims (5)
1A process for adjusting, to a desired value, electrical
resistance of a polymer thick film resistance element provided on
an electrically insulating substrate, said process comprising:
removing, by means of an excimer laser, polymer thick film
resistance material of said resistance element or polymer thick
film conductor material associated with said element.
2 A process according to Claim 1 in which electrically conductive
terminations are provided in contact with the resistance element
and material of the resistance element is removed by means of the
excimer laser until a desired electrical resistance value is
achieved, measured between the conductive terminations.
3 A process according to Claim 1 in which one or more polymer thick
film electrical conductors is or are provided on the substrate
and arranged to shunt one or more portions of the resistance
element, the excimer laser being used to selectively cut through
the one or more polymer thick film conductors whereby the
resistance value, measured between electrically conductive
terminations provided in contact with the resistance element, is
adjusted in step-wise manner until a desired value is achieved.
4 A process for adjusting electrical resistance of a polymer thick
film resistance element substantially as hereinbefore described.
5 A polymer thick film resistance element whenever adjusted by the
process of any preceding Claim.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8818744A GB2222310B (en) | 1988-08-06 | 1988-08-06 | Electrical resistor adjustment process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8818744A GB2222310B (en) | 1988-08-06 | 1988-08-06 | Electrical resistor adjustment process |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8818744D0 GB8818744D0 (en) | 1988-09-07 |
GB2222310A true GB2222310A (en) | 1990-02-28 |
GB2222310B GB2222310B (en) | 1990-12-05 |
Family
ID=10641741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8818744A Expired - Lifetime GB2222310B (en) | 1988-08-06 | 1988-08-06 | Electrical resistor adjustment process |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2222310B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998013836A1 (en) * | 1996-09-28 | 1998-04-02 | Dynamit Nobel Gmbh Explosivstoff- Und Systemtechnik | Method for balancing layer resistors using an excimer laser radiation |
-
1988
- 1988-08-06 GB GB8818744A patent/GB2222310B/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998013836A1 (en) * | 1996-09-28 | 1998-04-02 | Dynamit Nobel Gmbh Explosivstoff- Und Systemtechnik | Method for balancing layer resistors using an excimer laser radiation |
DE19640127A1 (en) * | 1996-09-28 | 1998-04-02 | Dynamit Nobel Ag | Method for matching sheet resistances with excimer laser radiation |
Also Published As
Publication number | Publication date |
---|---|
GB8818744D0 (en) | 1988-09-07 |
GB2222310B (en) | 1990-12-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19930806 |