GB2220304A - Soldered connection between a component and a printed circuit board - Google Patents
Soldered connection between a component and a printed circuit board Download PDFInfo
- Publication number
- GB2220304A GB2220304A GB8910658A GB8910658A GB2220304A GB 2220304 A GB2220304 A GB 2220304A GB 8910658 A GB8910658 A GB 8910658A GB 8910658 A GB8910658 A GB 8910658A GB 2220304 A GB2220304 A GB 2220304A
- Authority
- GB
- United Kingdom
- Prior art keywords
- soldering
- board
- circuit board
- bent
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0949—Pad close to a hole, not surrounding the hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
Description
1 A PRINTED CIRCUIT BOARD 2 2030 4 2- The invention relates to a printed
circuit board with a soldered-on electrical component having connection pins, which pins are fitted through holes in the printed circuit board and have bent-over portions soldered to soldering-on surfaces of conductor tracks, provided on the side of the printed circuit board remote from the component.
It is known to locate electrical components, such as for example small transformers, on a printed circuit so that the connection pins thereof are fitted through holes in the printed circuit board, and to bend over the pins so that the transformer is held temporarily on the printed circuit board. Each hole is surrounded, in known manner, by a co-axial ring-shaped soldering-on surface (of the conductor track) which provides an eye in which a solder bead is created when the printed circuit board, with the component temporarily attached, is dipped in a solder bath to solder the pins to the soldering-on surfaces.
It has become apparent, upon thermal-cycle testing 25 (producing alternating temperature stresses) and upon vibration tests, that the soldering eye, more especially in the case of fairly heavy small transformers, has a tendency to crack, particularly at the side of the hole 0 2 remote from the bent-over portion. This can be attributed to the f act that there the thickness of the solder is slight, since the molten solder has an inherent tendency to migrate towards and accumulate in the vicinity of the bent-over portion.
In order to reduce such crack f ormation, the hole diameter could be chosen so small that the connection pin fits closely in the hole. However, this is impractical, because mechanical insertion of the component into the printed circuit board would then be made exceedingly difficult.
A certain improvement in the fastening could also be achieved by soldering hollow rivets into the holes being used. However, this would, in production- technology respects, involve additional expenditure.
In the prior art therefore, the housings of heavy electrical components are further connected to the printed circuit board by additional mechanical fastening means, such as frames, screws or rivets. These mechanical fastening expedients are not only complex in productiontechnology respects, but also need space on the printed circuit board.
An object of the invention is to facilitate construction of a printed circuit board in which the 3 fastening of the component is improved.
In general, there is provided in accordance with the invention a printed circuit board with a soldered-on electrical component, wherein connection pins of the component extend through holes in the printed circuit board and have bent-over portions on the side remote of the board from the component, and wherein the bent-over portions are soldered to soldering-on surfaces, provided on the printed circuit board, of conductor tracks; and characterised in that at least one of the soldering-on surfaces is provided at a spacing next to the hole associated with it, and the bentover portion of the connection pin is directed towards and soldered to this soldering-on surface, SO that the solder material therebetween leaves the edge of the hole substantially free from said material.
In this way the fastening of the component to the printed circuit board is improved for various reasons as compared with the fastening through a soldering eye.
The soldering-on surface and the bent-over portion stand extensively in register, so that the solder connects the bent-over portion to the soldering-on surface over a comparatively large common area. The specific loading of the solder joint is thereby reduced.
4 4 Forces pulling on the component are transmitted, on account of the bent- over portion, as tensile and compressive forces to the solder. Because the soldered joint does not lie as a bead in a soldering eye concentrically with the connection pin, but is arranged offset, forces acting intermittently in the tension and compression directions are absorbed cushioned by he bent portion of the connection pin.
Since the solder does not extend across or right into the hole, a notch effect, which would promote a formation of cracks, is also prevented from being exerted on the solder by the sharp edge of the hole.
A further advantage consists in that the hole can be wide, so that an adequate tolerance range exists f or mechanical (automated) fitting. It is also f avourable that no additional mechanical fastening means are necessary for the improved fastening.
The soldering-on surface may be oval or rectangular, and is preferably elongate and arranged to extend substantially radially from adjacent to the hole.
The invention more particularly provides a printed circuit board with a soldered-on electrical component, wherein connection pins of the component extend through holes in the printed circuit board and have bent- over 4 portions on the side remote of the board from the component, and wherein the bent-over portions are soldered to soldering-on surfaces, provided on the printed circuit board, of conductor tracks; and characterised in that at least one of the solderingon surfaces extends to near to only part of the peripheral edge of the hole and is spaced apart from said part; and the bent-over portion of the connection pin is directed towards and soldered to this soldering-on surface, so that the solder material connecting said portion and surface is offset from said part.
The invention further provides a method of making a circuit board having a component fastened thereto, wherein soldering-on surfaces are provided on conductor tracks secured to one side of the board so that at least one such surface extends towards but ends spaced apart from a peripheral edge of a hole in the board, and wherein a connection pin of a component is inserted through said hole and is bent to extend over said surface prior to a soldered joint being produced, between the bent-over portion and said surface, offset from said hole.
The invention will be described further, by way of example with reference to the accompanying diagrammatic drawings, wherein:- 0 6 FIGURE 1 shows a partial sectional view of a printed circuit board with a component, FIGURE 2 shows a plan view along the line II-II 5 accordance with FIGURE 1, and FIGURE 3 is a view similar to FIGURE 1 of a' second embodiment.
A printed circuit board 1 is provided with conductor tracks 3 on one side 2, and has holes 4 f or connection pins 5 of an electrical component 6, for example of a transformer. The FIGURES show in each case only one of the connection pins 5 and the hole 4 associated with this. The component 6 is arranged on that side of the printed circuit board 1 which lies opposite to the side 2.
The conductor track 3 ends in a rectangular 20 soldering-on surface 7 which extends towards, but is spaced apart from, part of the peripheral edge of the hole. The width B thereof is greater than the diameter of the connection pin 5 and is about the same as or only slightly greater than the diameter of the hole. Thus, the end of the surface 7 proximal to the hole is encompassed by a limited arc, centred on the axis of the hole, of less than 1200, and in the arrangement shown in FIGURE 2, of slightly less than 900.
0 7 The connection pin 5 has a bentover portion 8. The length L of the solderingon surface 7 is approximately equal to the length of the bentovwer portion 8 (see FIGURE 2). The bent-over portion 8 and the solderingon surface 7 are substantially in register (see FIGURE 2).
The soldering-on surface 7 does not extend aA, far as the edge 9 of the hole 4, but ends at a spacing or offset A in front of (to one side of) this hole. The spacing A of the surface 7 from the hole is substantial relative to the diameter of the pin 5, and in the FIGURE 1 embodiment is more than half of said diameter and is greater than said diameter in the FIGURE 3 embbdiment. The bent-over portion 8 is fastened by solder 10 to the soldering-on surface 7.
The bent-over portion 8 is, moreover, bent aside by an angle of between 45' to 90' relative to the remainder of the connection pin. In the case of the exemplified embodiment shown in FIGURE 1 this angle amounts to about 75'. In the case of the exemplified embodiment shown in FIGURE 3 the angle amounts to 900, so that the bent-over portion 8 has an end part which extends parallel to and is joined to the soldering-on surface 7. In the embodiment shown in FIGURE 3, the bent-over portion 8 also comprises a curved part 11, which leaves the edge 9 free. The curved part 11 promotes the shock-absorbing or cushioning effect of the connection pin 5 upon vibrations 0 8 of the component 6 in the direction of the arrow P.
The described fastening is produced, for instance, in the following manner:
still concerned. mechanically surfaces 7, respectively component 6 that it can applied in soldering-on therearound.
First of all the component 6 is inserted with its unbent connection pins 5 into the oles 4 Then the connection pins 5 are bent over in the direction of the soldering-on to produce the bent-over portion 8 or the curved portion 11. In this way the is so held on the printed circuit board 1 no longer fall out. Then the solder 10 is soldering bath. This flows between the surface 7 and the bent-over portion 8 and It has become apparent, under temperature cyclic loading and in vibration tests, that the described connection, even in the case of fairly heavy components, is durably secure in comparison with known soldering eye bead connection.
0 9
Claims (14)
- A printed circuit board with a soldered-on electrical component, wherein connection pins of the component extend through holes in the printed circuit board and have bent- over portions on the side remote of the board from the component, and wherein the bnt-over portions are soldered to soldering-on surfaces, provided on the printed circuit board, of conductor tracks; and characterised in that at least one of the soldering-on surfaces is provided at a spacing next to the hole associated with it, and the bent- over portion of the connection pin is directed towards and soldered to this soldering-on surface, so that the solder material therebetween leaves the edge of the hole substantially free from said material.
- 2. A board as claimed in Claim 1, characterised in that the soldering-on surface is rectangular or oval.
- 3. A board as claimed in Claim 1 or 2, characterised in that the width of the soldering-on surface is greater than the diameter of the connection pin.
- 4. A board as claimed in any preceding claim, characterised in that the length of the soldering-on surface extends at least as far as the end of the bentover portion.9
- 5. A board as claimed in any preceding claim, characterised in that the bent-over portion is bent over at an angle of between 45' to 90' relative to the remainder of connection pin.
- 6. A board as claimed in any preceding claim, characterised in that the bent-over portion comp:ises a curved part connecting a soldered-on part to the remainder of the pin, which curved part extends clear of the edge of the hole.
- 7. A printed circuit board with a soldered-on electrical component, wherein connection pins of the component extend through holes in the printed circuit board and have bent-over portions on the side remote of the board from the component, and wherein the bent-over portions are soldered to soldering-on surfaces, provided on the printed circuit board, of conductor tracks; and characterised in that at least one of the soldering- on surfaces extends to near to only part of the peripheral edge of the hole and is spaced apart from said part, and the bent-over portion of the connection pin is directed towards and soldered to this soldering-on surface, so that the solder material connecting said portion and surface is offset from said part.
- 8. A board as claimed in any preceding claim wherein the end of the soldering-on surface adjacent the hole is 6 11 encompassed by a limited arc centred on the axis of the hole.
- 9. A board as claimed in Claim 8 wherein said arc is less than 120', and preferably less than 90'.
- 10. A board as claimed in any preceding claim' wherein the spacing of the soldering-on surface from the edge of the hole is more than half the diameter of the connection 10 pin.
- 11. A printed circuit board substantially as hereinbefore described with reference to FIGURE 1, 2 or 3 of the accompanying drawings.is
- 12. A method making a circuit board having a component fastened thereto, wherein soldering-on surfaces are provided on conductor tracks secured to one side of the board so that at least one such surface extends towards but ends spaced apart from a peripheral edge of a hole in the board, and wherein a connection pin of a component is inserted through said hole and is bent to extend over said surface prior to a soldered joint being produced, between the bent-over portion and said surface, offset 25 from said hole.
- 13. A method of making a circuit board substantially as hereinbefore described with reference to the accompanying 6 12 drawings.
- 14. A circuit board made by the method claimed in Claim 12 or 13.is - 25 Published 1989 atThe Patent Office. State House.66'71 HighHolborn. London WC1R 4TP- Further copies maybe obtamed from The Patent Office, Sales Branch, St Mary Cray, Orpington, Kent BR5 3RD- Printed by Multiplex techTuques ltd, St Maxy Cray. Kent. Con. V87
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19883817267 DE3817267A1 (en) | 1988-05-20 | 1988-05-20 | PCB |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8910658D0 GB8910658D0 (en) | 1989-06-21 |
GB2220304A true GB2220304A (en) | 1990-01-04 |
GB2220304B GB2220304B (en) | 1992-05-20 |
Family
ID=6354816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8910658A Expired - Fee Related GB2220304B (en) | 1988-05-20 | 1989-05-09 | A printed circuit board |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE3817267A1 (en) |
FR (1) | FR2631770B3 (en) |
GB (1) | GB2220304B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0968629B1 (en) * | 1997-03-13 | 2002-01-30 | Siemens Aktiengesellschaft | Flat assembly and method for post-assembling additional components on a printed circuit board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4422128A (en) * | 1981-08-06 | 1983-12-20 | General Motors Corporation | Push-on terminal clip and assembly |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4219172A (en) * | 1978-06-26 | 1980-08-26 | Nifco, Inc. | Holder for electronic and electrical parts |
DE2906980A1 (en) * | 1979-02-22 | 1980-09-04 | Siemens Ag | Electronic component panel connection system - has hole through panel for insertion and soldering, with optional fitting of protection disc |
-
1988
- 1988-05-20 DE DE19883817267 patent/DE3817267A1/en not_active Ceased
-
1989
- 1989-05-09 GB GB8910658A patent/GB2220304B/en not_active Expired - Fee Related
- 1989-05-18 FR FR8906477A patent/FR2631770B3/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4422128A (en) * | 1981-08-06 | 1983-12-20 | General Motors Corporation | Push-on terminal clip and assembly |
Also Published As
Publication number | Publication date |
---|---|
GB2220304B (en) | 1992-05-20 |
GB8910658D0 (en) | 1989-06-21 |
DE3817267A1 (en) | 1989-11-30 |
FR2631770A3 (en) | 1989-11-24 |
FR2631770B3 (en) | 1990-04-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19930509 |