GB2213999A - Repairing printed circuits - Google Patents

Repairing printed circuits Download PDF

Info

Publication number
GB2213999A
GB2213999A GB8729494A GB8729494A GB2213999A GB 2213999 A GB2213999 A GB 2213999A GB 8729494 A GB8729494 A GB 8729494A GB 8729494 A GB8729494 A GB 8729494A GB 2213999 A GB2213999 A GB 2213999A
Authority
GB
United Kingdom
Prior art keywords
laminate
track
prototype
repair
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8729494A
Other versions
GB8729494D0 (en
Inventor
Simon Charles Phillips
Robert Paul Noades
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB8729494A priority Critical patent/GB2213999A/en
Publication of GB8729494D0 publication Critical patent/GB8729494D0/en
Priority to AU29028/89A priority patent/AU2902889A/en
Priority to GB8828967A priority patent/GB2211668B/en
Priority to PCT/GB1988/001095 priority patent/WO1989006087A1/en
Publication of GB2213999A publication Critical patent/GB2213999A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A laminate for repairing damaged sections of the conductive tracks of a printed circuit comprises a copper sheet (2) coated on one side with a solder layer (1) and on the other side with an adhesive layer (3) covered by a removable protective material (4). A suitably shaped piece of laminate is adhered to the printed circuit to cover a damaged section and then soldered to the ends of the undamaged parts of the track. The laminate may be used to construct prototype circuits. <IMAGE>

Description

ELECTRICAL CIRCUIT PROTOTYPE AND REPAIR KIT This invention relates to Electrical Circuit Repairs and manufacture of Prototypes.
Electrical Circuits often suffer from accidental or operational related damage. At the present time repairs to circuit conductive tracks are time consuming, awkward and usually unsig-htly.
Currently, Prototype Circuits consisting of custom made conductive tracks, necessitate the etching and tinning of copper : clad fibre board, this causes delay and inflexibility of the finish Prototype.
According to the present invention, there is provided a selection of preformed conductive track circuit components.
Each component consists of adhesive based tinned copper.
These components can be applied to a suitably prepared surface to replace damaged circuits. Once pressed into position solder is floued over the joint to complete the repair. A suitable lacquer may be added to give insulation and extra security.
Manufacture of Prototype Electrical Circuits using this method allows maximum flexibility and ease of construction.
A specific embodiment of the invention uill now be described by way of example with reference-to the accompanying drawing in which : Fig. 1. Shows in perspective a section of the laminated material used in manufacture of the invention.
Fig. 2. Illustrates variations of form required for repair and prototype of Electrical Circuit conductive tracks.
Fig. 3. Shows an example of a damaged electrical circuit conductive trace.
Fig. 4. Shows an electrical circuit after completion of repair, using the invention.
Fig. 5. Shous an example of a Prototype Electrical Circuit Board of Electrical Circuit Modification.
Referring to the drawing the laminate comprises of a copper sheet (2) With an adhesive base (3) Covered by a protective material (4). The surface of the laminate is solder coated. (1) The laminate in Fig. 1. is produced in a variety of forms Fig. 2. The pad (5) The straight track (6). The pad and track combined (7) A curve (8) An edge connector (9) Or any required configuration.
A damaged electrical circuit track Fig. 3. has circuit sections (13) and (11) Broken, revealing the base board (12). To repair this damage an appropriate section of laminate, in this case a pad and track (7) and a straight track (6) are used. The damage area is cleaned and the appropriate laminate Fig. 2. selected. The protective material (4) Is removed and the selected laminate applied to the damaged area (11) and (13) With an overlap (16) onto the original track (15). Solder is then flowed over the joint area (17) to form an electrical contact. A coating of lacquer can then be applied to insulate the repair and aid repair security.
A Prototype Electrical Circuit can be contructed Fig. 5. By using variations of the laminate (5)- (9) in the manner previously described.

Claims (1)

  1. CLAIMS (1) A laminate consisting of copper sheet backed by an adhesive which is covered by a protective sheet, the copper is coated on top with a solder layer.
    (2) A laminate is claimed in claim (1) manufacturered in shapes suitable for use in repair of electrical circuits.
    (3) A laminate as claimed in claim (1) and (2) manufactured in shapes suitable for use in Prototype and Modification of Electrical Circuits.
    (4) A laminate substantially as described herein with reference to Figs. 1. to 5. of the accompanying drawings.
GB8729494A 1987-12-18 1987-12-18 Repairing printed circuits Withdrawn GB2213999A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB8729494A GB2213999A (en) 1987-12-18 1987-12-18 Repairing printed circuits
AU29028/89A AU2902889A (en) 1987-12-18 1988-12-12 Improvements in or relating to the repair of electrical circuits
GB8828967A GB2211668B (en) 1987-12-18 1988-12-12 Improvements in or relating to the repair of electrical circuits
PCT/GB1988/001095 WO1989006087A1 (en) 1987-12-18 1988-12-12 Improvements in or relating to the repair of electrical circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8729494A GB2213999A (en) 1987-12-18 1987-12-18 Repairing printed circuits

Publications (2)

Publication Number Publication Date
GB8729494D0 GB8729494D0 (en) 1988-02-03
GB2213999A true GB2213999A (en) 1989-08-23

Family

ID=10628662

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8729494A Withdrawn GB2213999A (en) 1987-12-18 1987-12-18 Repairing printed circuits

Country Status (1)

Country Link
GB (1) GB2213999A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5289632A (en) * 1992-11-25 1994-03-01 International Business Machines Corporation Applying conductive lines to integrated circuits
GB2379557A (en) * 2001-08-30 2003-03-12 Agilent Technologies Inc Flexible repair circuit
EP2858468A1 (en) * 2013-10-04 2015-04-08 Cartamundi Turnhout N.V. Method and system for manufacturing a laminated sheet with a conductive pattern

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Practical El *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5289632A (en) * 1992-11-25 1994-03-01 International Business Machines Corporation Applying conductive lines to integrated circuits
US5321886A (en) * 1992-11-25 1994-06-21 International Business Machines Corporation Applying conductive lines to integrated circuits
GB2379557A (en) * 2001-08-30 2003-03-12 Agilent Technologies Inc Flexible repair circuit
GB2379557B (en) * 2001-08-30 2005-05-25 Agilent Technologies Inc Flexible repair circuit
EP2858468A1 (en) * 2013-10-04 2015-04-08 Cartamundi Turnhout N.V. Method and system for manufacturing a laminated sheet with a conductive pattern

Also Published As

Publication number Publication date
GB8729494D0 (en) 1988-02-03

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)