GB2212977B - Semiconductor arrangement - Google Patents

Semiconductor arrangement

Info

Publication number
GB2212977B
GB2212977B GB8727612A GB8727612A GB2212977B GB 2212977 B GB2212977 B GB 2212977B GB 8727612 A GB8727612 A GB 8727612A GB 8727612 A GB8727612 A GB 8727612A GB 2212977 B GB2212977 B GB 2212977B
Authority
GB
United Kingdom
Prior art keywords
semiconductor arrangement
semiconductor
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8727612A
Other versions
GB2212977A (en
GB8727612D0 (en
Inventor
John Anthony Kerr
Ian Francis Deviny
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marconi Electronic Devices Ltd
Original Assignee
Marconi Electronic Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Electronic Devices Ltd filed Critical Marconi Electronic Devices Ltd
Priority to GB8727612A priority Critical patent/GB2212977B/en
Publication of GB8727612D0 publication Critical patent/GB8727612D0/en
Priority to JP29590888A priority patent/JPH01162350A/en
Publication of GB2212977A publication Critical patent/GB2212977A/en
Application granted granted Critical
Publication of GB2212977B publication Critical patent/GB2212977B/en
Priority to US07/665,290 priority patent/US5136355A/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53257—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a refractory metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
GB8727612A 1987-11-25 1987-11-25 Semiconductor arrangement Expired - Fee Related GB2212977B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB8727612A GB2212977B (en) 1987-11-25 1987-11-25 Semiconductor arrangement
JP29590888A JPH01162350A (en) 1987-11-25 1988-11-22 Semiconductor structure
US07/665,290 US5136355A (en) 1987-11-25 1991-03-06 Interconnecting layer on a semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8727612A GB2212977B (en) 1987-11-25 1987-11-25 Semiconductor arrangement

Publications (3)

Publication Number Publication Date
GB8727612D0 GB8727612D0 (en) 1987-12-31
GB2212977A GB2212977A (en) 1989-08-02
GB2212977B true GB2212977B (en) 1991-01-23

Family

ID=10627534

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8727612A Expired - Fee Related GB2212977B (en) 1987-11-25 1987-11-25 Semiconductor arrangement

Country Status (2)

Country Link
JP (1) JPH01162350A (en)
GB (1) GB2212977B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1236160A (en) * 1968-12-27 1971-06-23 Nippon Electric Co Improvements in semiconductor integrated circuit devices
GB1533218A (en) * 1976-06-30 1978-11-22 Ibm Fabricating wiring above and below a ground plane on one side of a supporting surface
EP0100571A2 (en) * 1982-07-30 1984-02-15 Motorola, Inc. Low resistance buried power bus for integrated circuits

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61137360A (en) * 1984-12-10 1986-06-25 Nec Corp Complementary mos integrated circuit device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1236160A (en) * 1968-12-27 1971-06-23 Nippon Electric Co Improvements in semiconductor integrated circuit devices
GB1533218A (en) * 1976-06-30 1978-11-22 Ibm Fabricating wiring above and below a ground plane on one side of a supporting surface
EP0100571A2 (en) * 1982-07-30 1984-02-15 Motorola, Inc. Low resistance buried power bus for integrated circuits

Also Published As

Publication number Publication date
JPH01162350A (en) 1989-06-26
GB2212977A (en) 1989-08-02
GB8727612D0 (en) 1987-12-31

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20031125