GB2157487B - Housing for an electrical component - Google Patents

Housing for an electrical component

Info

Publication number
GB2157487B
GB2157487B GB08409453A GB8409453A GB2157487B GB 2157487 B GB2157487 B GB 2157487B GB 08409453 A GB08409453 A GB 08409453A GB 8409453 A GB8409453 A GB 8409453A GB 2157487 B GB2157487 B GB 2157487B
Authority
GB
United Kingdom
Prior art keywords
housing
electrical component
electrical
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08409453A
Other versions
GB8409453D0 (en
GB2157487A (en
Inventor
Peter Arthur Turner
Anthony Noel Kirk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marconi Electronic Devices Ltd
Original Assignee
Marconi Electronic Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Electronic Devices Ltd filed Critical Marconi Electronic Devices Ltd
Priority to GB08409453A priority Critical patent/GB2157487B/en
Publication of GB8409453D0 publication Critical patent/GB8409453D0/en
Publication of GB2157487A publication Critical patent/GB2157487A/en
Application granted granted Critical
Publication of GB2157487B publication Critical patent/GB2157487B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/20—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device gaseous at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
GB08409453A 1984-04-12 1984-04-12 Housing for an electrical component Expired GB2157487B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08409453A GB2157487B (en) 1984-04-12 1984-04-12 Housing for an electrical component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08409453A GB2157487B (en) 1984-04-12 1984-04-12 Housing for an electrical component

Publications (3)

Publication Number Publication Date
GB8409453D0 GB8409453D0 (en) 1984-05-23
GB2157487A GB2157487A (en) 1985-10-23
GB2157487B true GB2157487B (en) 1987-11-18

Family

ID=10559550

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08409453A Expired GB2157487B (en) 1984-04-12 1984-04-12 Housing for an electrical component

Country Status (1)

Country Link
GB (1) GB2157487B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2665817B1 (en) * 1990-08-07 1996-08-02 Auxilec ELECTRODE AND HOUSING DIODE ASSEMBLED WITHOUT WELDING OR CRIMPING, AND RECTIFIER BRIDGE MADE WITH SUCH DIODES.
GB9109542D0 (en) * 1991-05-02 1991-06-26 Semitron Ind Ltd Semiconductor device assembly
CN111146169B (en) * 2018-11-06 2022-03-18 株洲中车时代半导体有限公司 Conductive disc spring assembly for crimping module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1140677A (en) * 1965-05-07 1969-01-22 Ass Elect Ind Improvements relating to semi-conductor devices
GB1157041A (en) * 1966-04-29 1969-07-02 Int Rectifier Corp Improvements in Semiconductor Device Assemblies
SE333197B (en) * 1966-12-27 1971-03-08 Asea Ab SEMICONDUCTOR FOR GREAT CURRENTS
DE2604722A1 (en) * 1975-02-27 1976-09-09 Bendix Corp SEMICONDUCTOR ELEMENT

Also Published As

Publication number Publication date
GB8409453D0 (en) 1984-05-23
GB2157487A (en) 1985-10-23

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee