CN111146169B - Conductive disc spring assembly for crimping module - Google Patents
Conductive disc spring assembly for crimping module Download PDFInfo
- Publication number
- CN111146169B CN111146169B CN201811315635.5A CN201811315635A CN111146169B CN 111146169 B CN111146169 B CN 111146169B CN 201811315635 A CN201811315635 A CN 201811315635A CN 111146169 B CN111146169 B CN 111146169B
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- conductive
- disc spring
- plate
- inclined plane
- spring assembly
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
- H01R4/4854—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a wire spring
- H01R4/4863—Coil spring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
- H01R4/489—Clamped connections, spring connections utilising a spring, clip, or other resilient member spring force increased by screw, cam, wedge, or other fastening means
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
The invention discloses a conductive disc spring component for a crimping module, which is characterized by comprising the following components: a first conductive portion; a second conductive portion disposed at an interval from the first conductive portion; a disc spring disposed between the first conductive portion and the second conductive portion; before the disc spring is deformed, when the first conductive part and the second conductive part are separated, the conductive disc spring assembly is in a disconnected state; and after the disc spring is pressed and deformed, when the first conductive part is contacted with the second conductive part, the conductive disc spring component is in a conductive state. The invention has simple structure, convenient assembly and good reliability.
Description
Technical Field
The present invention relates to a disc spring assembly, and more particularly to a conductive disc spring assembly for a compression module.
Background
The traditional disc spring assembly for the crimping module cannot give consideration to the current transmission function, and a bypass circuit needs to be additionally arranged. The bypass circuit needs to bear stress caused by pressure deformation, and the deformation needs space, so that the packaging space is larger. CN 201280051153.8 discloses a power semiconductor module, as shown in fig. 1, the device comprises a conductive bottom plate 1, a conductive top plate 2 arranged in parallel with the conductive bottom plate 1 and spaced apart from the conductive bottom plate 1, at least one power semiconductor device 3 arranged in a space formed on the conductive bottom plate 1 between the conductive bottom plate 1 and the conductive top plate 2, and at least one press pin (4, 5) arranged in the space formed between the conductive bottom plate 1 and the conductive top plate 2 to provide contact between the power semiconductor device 3 and the conductive top plate 2, wherein a metal protection plate 6 is provided on an inner face of the conductive top plate 2 facing the conductive bottom plate 1, wherein a material of the metal protection plate 6 has a melting temperature higher than that of the top plate. The press pins (4, 5) are embodied in such a way that a spring washer group 7 is arranged around the shaft 8 between the metal protection plate 6 and the foot 9 for applying an outwardly directed force to the metal protection plate 6 and the foot 9 and a current bypass 10, which current bypass 10 electrically connects the foot 9 with the metal protection plate 6. It can be seen that the change process of the internal disc spring assemblies (9, 11, 7, 10, 8, 12) of the module after being pressed is shown in fig. 2 and 3 (assuming the change is Δ X). The current bypass 10 and the voltage-loaded path (9, 11, 7, 8, 12) are independent. However, the assembly of the device is complicated, the assembly parts comprise various parts such as screws, end covers and gaskets, meanwhile, the existence of the current bypass 10 causes certain difficulty for the assembly of the disc spring assembly, and the contact surfaces of the current bypass 10 and the gaskets and the contact surfaces between the two gaskets can generate additional contact resistance, so that the whole pressure drop of the crimping module is increased.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a conductive disc spring assembly for a compression joint module, which has a simple structure, is convenient to assemble, and has high reliability.
In order to achieve the purpose, the invention adopts the following technical scheme: a conductive disc spring assembly for a crimp module, comprising: a first conductive portion; a second conductive portion disposed at an interval from the first conductive portion; a disc spring disposed between the first conductive portion and the second conductive portion; before the disc spring is deformed, when the first conductive part and the second conductive part are separated, the conductive disc spring assembly is in a disconnected state; and after the disc spring is pressed and deformed, when the first conductive part is contacted with the second conductive part, the conductive disc spring component is in a conductive state.
In a specific embodiment, the first conductive part includes a first conductive plate and a first conductive column vertically connected to the first conductive plate, the disc spring is sleeved outside the first conductive column, and the second conductive part is configured as a second conductive plate.
In a specific embodiment, first openings communicating with the first conductive plate, the first conductive pillar and the second conductive plate are respectively arranged on the first conductive plate, the first conductive pillar and the second conductive plate, and a first fastener passes through the first openings to fix the first conductive plate on the crimping base plate.
In a specific embodiment, a first inclined plane is arranged at the top free end of the first conductive upright, a first accommodating part for accommodating the top free end of the first conductive upright is arranged on one side, close to the disc spring, of the second conductive flat plate, and a second inclined plane matched with the first inclined plane is arranged in the first accommodating part.
In a specific embodiment, the first inclined plane is provided as an upper inclined plane, and the second inclined plane is provided as a lower inclined plane that is matched with the upper inclined plane.
In a specific embodiment, the second conductive portion includes a third conductive plate and a second conductive column vertically connected to the third conductive plate, the disc spring is sleeved outside the second conductive column, and the first conductive portion is disposed as a fourth conductive plate.
In a specific embodiment, the third conductive plate, the second conductive pillar, and the fourth conductive plate are respectively provided with a second opening communicating with the third conductive plate, the second conductive pillar, and the fourth conductive plate, and a second fastener passes through the second opening to fix the fourth conductive plate on the crimping base plate.
In a specific embodiment, a third inclined plane is disposed at the bottom free end of the second conductive pillar, a second accommodating portion for accommodating the bottom free end of the second conductive pillar is disposed on a side of the fourth conductive plate close to the disc spring, and a fourth inclined plane matched with the third inclined plane is disposed in the second accommodating portion.
In a specific embodiment, the third inclined plane is provided as a lower inclined plane, and the fourth inclined plane is provided as an upper inclined plane that is matched with the lower inclined plane.
In a specific embodiment, a fifth conductive flat plate is arranged at the bottom free end of the second conductive upright, and the aperture of the second opening of the fifth conductive flat plate is smaller than the outer diameter of the starting end of the second fastener.
Due to the adoption of the technical scheme, the invention has the following advantages: 1. according to the invention, the first conductive part is contacted with the second conductive part, the circuit is conducted, and the conductive disc spring component is in a conductive state; the first conductive part is separated from the second conductive part, the circuit is not conducted, and the conductive disc spring assembly is in a disconnected state. 2. The conductive disc spring assembly has good reliability after all parts are assembled, so that subsequent assembly operation is facilitated. 3. The contact resistance can be optimized by utilizing the area adjustment of the inclined plane, and is simple, convenient and efficient. 4. The invention can conduct the circuit while compressing the disc spring after pressurization, and is convenient to use. 5. The invention has simple structure, high production efficiency and good safety, and can simplify the packaging complexity.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the technical solution in the embodiments of the present invention, the following briefly introduces the drawings required in the description of the embodiments:
FIG. 1 is a schematic structural diagram of a package structure of a prior art crimp module;
FIG. 2 is a schematic diagram of the independent structure of the current bypass and the compression path before the disc spring is deformed in FIG. 1;
FIG. 3 is a schematic diagram of the independent structure of the current bypass and the compression path after the disc spring of FIG. 1 is deformed;
FIG. 4 is a schematic structural diagram of a disc spring before deformation in accordance with a preferred embodiment of the present invention;
FIG. 5 is a schematic diagram of the deformed disc spring according to a preferred embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a disc spring before deformation in accordance with another preferred embodiment of the present invention;
fig. 7 is a schematic structural view of a disc spring after deformation in another preferred embodiment of the present invention.
Detailed Description
The following detailed description of the embodiments of the present invention will be provided with reference to the drawings and examples, so that how to apply the technical means to solve the technical problems and achieve the technical effects can be fully understood and implemented. It should be noted that, as long as there is no conflict, the embodiments and the features of the embodiments of the present invention may be combined with each other, and the technical solutions formed are within the scope of the present invention.
The directional terms used in the present invention, such as "upper", "lower", "inner", "outer", etc., are used solely in conjunction with the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention.
As shown in fig. 4 to 7, the conductive disc spring assembly for a crimping module according to the present invention includes a first conductive portion 13, which is fixedly disposed on a crimping base plate. And a second conductive part 14 disposed at an interval from the first conductive part 13. And a disc spring 15 provided between the first conductive part 13 and the second conductive part 14. Before the disc spring 15 is deformed, when the first conductive part 13 and the second conductive part 14 are separated, the conductive disc spring assembly is in a disconnected state. After the disc spring 15 is deformed by pressure, when the first conductive part 13 and the second conductive part 14 are contacted, the conductive disc spring assembly is in a conductive state.
In a preferred embodiment, as shown in fig. 4 and 5, the first conductive part 13 includes a first conductive plate 131 and a first conductive pillar 132 vertically connected to the first conductive plate 131. The disc spring 15 is disposed outside the first conductive pillar 132, and the second conductive portion 14 is a second conductive plate.
In one embodiment, as shown in fig. 4 and 5, the first conductive plate 131, the first conductive pillar 132 and the second conductive plate 14 are respectively provided with a first opening 16 communicating with the first conductive plate 131, the first conductive pillar 132 and the second conductive plate 14. The first fastener 17 can fix the first conductive plate 131 to the crimp base plate through the first opening 16. Wherein the first conductive pillar 132 can accommodate a sufficient number of disc springs 15, and the top of the first conductive pillar 132 can also be used as a positioning shaft for the second conductive plate 14. The first conductive pillar 132 can directly connect the disc spring 15 and the second conductive plate 14 in series and play a role in positioning.
In one embodiment, as shown in fig. 4, the top free end of the first conductive pillar 132 is provided with a first inclined plane 1321, a first accommodating portion 141 for accommodating the top free end of the first conductive pillar 132 is provided on the second conductive plate 14 on a side close to the disc spring 15, and a second inclined plane 1411 matched with the first inclined plane 1321 is provided in the first accommodating portion 141, so that the contact resistance can be optimized by adjusting the contact area size of the first inclined plane 1321 and the second inclined plane 1411.
In one embodiment, as shown in fig. 4 and 5, the first inclined plane 1321 is configured as an upper inclined plane and the second inclined plane 1411 is configured as a lower inclined plane that cooperates with the upper inclined plane 1321.
In a preferred embodiment, as shown in fig. 6 and 7, the second conductive part 14 includes a third conductive plate 142 and a second conductive pillar 143 vertically connected to the third conductive plate 142, the disc spring 15 is disposed outside the second conductive pillar 143, and the first conductive part 13 is configured as a fourth conductive plate.
In a specific embodiment, as shown in fig. 6 and 7, the third conductive plate 142, the second conductive pillar 143 and the fourth conductive plate 13 are respectively provided with a second opening 18 communicating with the third conductive plate 142, the second conductive pillar 143 and the fourth conductive plate 13, and the second fastener 19 can pass through the second opening 18 to fix the fourth conductive plate 13 on the crimping base plate. Wherein, the second conductive pillar 143 can accommodate a sufficient number of disc springs 15, and the bottom of the second conductive pillar 143 can also be used as a positioning shaft for the fourth conductive plate 13. The second conductive pillar 143 can directly connect the disc spring 15 and the fourth conductive plate 13 in series and perform a positioning function.
In one embodiment, as shown in fig. 6, a third inclined plane 1431 is provided at the bottom free end of the second conductive pillar 143, a second receiving portion 133 for receiving the bottom free end of the second conductive pillar 143 is provided at a side of the fourth conductive plate 13 close to the disc spring 15, and a fourth inclined plane 1331 matching with the third inclined plane 1431 is provided in the second receiving portion 133.
In one particular embodiment, as shown in fig. 6 and 7, the third inclined plane 1431 is configured as a lower inclined plane and the fourth inclined plane 1331 is configured as an upper inclined plane that mates with the lower inclined plane 1431.
In one embodiment, as shown in fig. 6 and 7, a fifth conductive plate 144 is disposed at the bottom free end of the second conductive pillar 143, and the aperture of the second opening 18 of the fifth conductive plate 144 is smaller than the outer diameter of the beginning of the second fastening member 19. Therefore, even if the disc spring assembly is turned for 360 degrees, all assemblies in the conductive disc spring assembly cannot fall off.
As shown in fig. 4 to 7, when the conductive disc spring assembly is in an off state before the disc spring 15 is deformed and the first conductive part 13 and the second conductive part 14 are separated, the conductive disc spring assembly is in an off state. After the disc spring 15 is deformed by pressure, when the first conductive part 13 and the second conductive part 14 are contacted, the conductive disc spring assembly is in a conductive state.
Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. The utility model provides a crimping module is with electrically conductive dish spring subassembly which characterized in that includes:
a first conductive part fixedly provided on the crimp base plate;
a second conductive portion disposed at an interval from the first conductive portion;
a disc spring disposed between the first conductive portion and the second conductive portion;
before the disc spring is deformed, when the first conductive part and the second conductive part are separated, the conductive disc spring assembly is in a disconnected state; after the disc spring is deformed under pressure, when the first conductive part is contacted with the second conductive part, the conductive disc spring assembly is in a conductive state;
the first conductive part comprises a first conductive flat plate and a first conductive upright column vertically connected with the first conductive flat plate, the disc spring sleeve is arranged outside the first conductive upright column, and the second conductive part is arranged into a second conductive flat plate.
2. The conductive disc spring assembly of claim 1, wherein the first conductive plate, the first conductive post and the second conductive plate are respectively provided with a first opening communicating with the first conductive plate, the first conductive post and the second conductive plate, and a first fastener passes through the first opening to fix the first conductive plate on the crimping base plate.
3. The conductive disc spring assembly of claim 2, wherein the top free end of the first conductive post is provided with a first inclined plane, a first receiving portion for receiving the top free end of the first conductive post is provided on the second conductive plate on a side thereof adjacent to the disc spring, and a second inclined plane is provided in the first receiving portion to match the first inclined plane.
4. The conductive disc spring assembly for a crimp module of claim 3, wherein the first inclined plane is configured as an upper inclined plane and the second inclined plane is configured as a lower inclined plane that is matched with the upper inclined plane.
5. The utility model provides a crimping module is with electrically conductive dish spring subassembly which characterized in that includes:
a first conductive part fixedly provided on the crimp base plate;
a second conductive portion disposed at an interval from the first conductive portion;
a disc spring disposed between the first conductive portion and the second conductive portion;
before the disc spring is deformed, when the first conductive part and the second conductive part are separated, the conductive disc spring assembly is in a disconnected state; after the disc spring is deformed under pressure, when the first conductive part is contacted with the second conductive part, the conductive disc spring assembly is in a conductive state;
the second conductive part comprises a third conductive flat plate and a second conductive upright column vertically connected with the third conductive flat plate, the disc spring sleeve is arranged outside the second conductive upright column, and the first conductive part is arranged into a fourth conductive flat plate.
6. The conductive disc spring assembly of claim 5, wherein the third conductive plate, the second conductive post and the fourth conductive plate are respectively provided with a second opening communicating with the third conductive plate, the second conductive post and the fourth conductive plate, and a second fastener passes through the second opening to fix the fourth conductive plate on the crimping base plate.
7. The conductive disc spring assembly of claim 6, wherein a third inclined plane is disposed at a bottom free end of the second conductive post, a second receiving portion for receiving the bottom free end of the second conductive post is disposed on a side of the fourth conductive plate adjacent to the disc spring, and a fourth inclined plane is disposed in the second receiving portion and matches with the third inclined plane.
8. The conductive disc spring assembly for a crimp module of claim 7, wherein the third inclined plane is configured as a lower inclined plane, and the fourth inclined plane is configured as an upper inclined plane matched with the lower inclined plane.
9. The conductive disc spring assembly for a crimp module of claim 7, wherein a fifth conductive plate is disposed at a bottom free end of the second conductive pillar, and an aperture of the second opening of the fifth conductive plate is smaller than an outer diameter of the beginning end of the second fastening member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811315635.5A CN111146169B (en) | 2018-11-06 | 2018-11-06 | Conductive disc spring assembly for crimping module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811315635.5A CN111146169B (en) | 2018-11-06 | 2018-11-06 | Conductive disc spring assembly for crimping module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111146169A CN111146169A (en) | 2020-05-12 |
| CN111146169B true CN111146169B (en) | 2022-03-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811315635.5A Active CN111146169B (en) | 2018-11-06 | 2018-11-06 | Conductive disc spring assembly for crimping module |
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| CN (1) | CN111146169B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490724B (en) * | 2020-11-27 | 2023-02-03 | 株洲中车时代半导体有限公司 | Disc spring assembly and power semiconductor module |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2157487B (en) * | 1984-04-12 | 1987-11-18 | Marconi Electronic Devices | Housing for an electrical component |
| JPH11314861A (en) * | 1998-04-27 | 1999-11-16 | Otis Elevator Co | Push-button of elevator |
| JP2002026399A (en) * | 2000-07-07 | 2002-01-25 | Aisin Seiki Co Ltd | Thermocouple connector |
| DE60131876T2 (en) * | 2000-10-26 | 2008-12-04 | Shin-Etsu Polymer Co., Ltd. | PRESS CONNECTORS AND CORRESPONDING CONNECTION STRUCTURE |
| EP1475832A1 (en) * | 2003-05-05 | 2004-11-10 | ABB Technology AG | Pressure-contactable power semiconductor module |
| CN2807564Y (en) * | 2005-06-21 | 2006-08-16 | 长盛科技股份有限公司 | Electric connector |
| JP2008016601A (en) * | 2006-07-05 | 2008-01-24 | Toshiba Corp | Semiconductor element stack |
| US8366481B2 (en) * | 2011-03-30 | 2013-02-05 | John Mezzalingua Associates, Inc. | Continuity maintaining biasing member |
| CN204118057U (en) * | 2014-10-17 | 2015-01-21 | 国家电网公司 | A kind of compression joint type IGBT encapsulating structure using heat pipe |
| CN110473735B (en) * | 2017-07-24 | 2021-04-02 | 许继集团有限公司 | Isolating switch and moving contact thereof |
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2018
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| CN111146169A (en) | 2020-05-12 |
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Effective date of registration: 20200924 Address after: 412001 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Applicant after: Zhuzhou CRRC times Semiconductor Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Applicant before: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. |
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