GB2150601B - Initiation of electroless nickel plating - Google Patents

Initiation of electroless nickel plating

Info

Publication number
GB2150601B
GB2150601B GB08430429A GB8430429A GB2150601B GB 2150601 B GB2150601 B GB 2150601B GB 08430429 A GB08430429 A GB 08430429A GB 8430429 A GB8430429 A GB 8430429A GB 2150601 B GB2150601 B GB 2150601B
Authority
GB
United Kingdom
Prior art keywords
initiation
nickel plating
electroless nickel
electroless
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08430429A
Other languages
English (en)
Other versions
GB2150601A (en
GB8430429D0 (en
Inventor
Donald A Arcilesi
Roy W Klein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of GB8430429D0 publication Critical patent/GB8430429D0/en
Publication of GB2150601A publication Critical patent/GB2150601A/en
Application granted granted Critical
Publication of GB2150601B publication Critical patent/GB2150601B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
GB08430429A 1983-12-02 1984-12-03 Initiation of electroless nickel plating Expired GB2150601B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US55641783A 1983-12-02 1983-12-02

Publications (3)

Publication Number Publication Date
GB8430429D0 GB8430429D0 (en) 1985-01-09
GB2150601A GB2150601A (en) 1985-07-03
GB2150601B true GB2150601B (en) 1987-06-03

Family

ID=24221260

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08430429A Expired GB2150601B (en) 1983-12-02 1984-12-03 Initiation of electroless nickel plating

Country Status (4)

Country Link
JP (1) JPS60138075A (ja)
CA (1) CA1232104A (ja)
DE (1) DE3443471C2 (ja)
GB (1) GB2150601B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995030178A1 (en) * 1994-04-28 1995-11-09 Philips Electronics N.V. Method of photolithographically producing a copper pattern on a plate of an electrically insulating material
CN100342058C (zh) * 2005-11-01 2007-10-10 桂林工学院 塑料表面化学镀镍无钯活化液配方及工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1145285A (en) * 1965-03-17 1969-03-12 Nat Res Dev Improvements relating to the deposition of metals
US3902908A (en) * 1973-03-21 1975-09-02 Macdermid Inc Catalyst system for activating surfaces prior to electroless deposition

Also Published As

Publication number Publication date
JPS60138075A (ja) 1985-07-22
DE3443471A1 (de) 1985-06-13
JPH0148349B2 (ja) 1989-10-18
DE3443471C2 (de) 1987-01-02
GB2150601A (en) 1985-07-03
GB8430429D0 (en) 1985-01-09
CA1232104A (en) 1988-02-02

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee