GB2150601B - Initiation of electroless nickel plating - Google Patents

Initiation of electroless nickel plating

Info

Publication number
GB2150601B
GB2150601B GB08430429A GB8430429A GB2150601B GB 2150601 B GB2150601 B GB 2150601B GB 08430429 A GB08430429 A GB 08430429A GB 8430429 A GB8430429 A GB 8430429A GB 2150601 B GB2150601 B GB 2150601B
Authority
GB
United Kingdom
Prior art keywords
initiation
nickel plating
electroless nickel
electroless
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08430429A
Other languages
English (en)
Other versions
GB8430429D0 (en
GB2150601A (en
Inventor
Donald A Arcilesi
Roy W Klein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of GB8430429D0 publication Critical patent/GB8430429D0/en
Publication of GB2150601A publication Critical patent/GB2150601A/en
Application granted granted Critical
Publication of GB2150601B publication Critical patent/GB2150601B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
GB08430429A 1983-12-02 1984-12-03 Initiation of electroless nickel plating Expired GB2150601B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US55641783A 1983-12-02 1983-12-02

Publications (3)

Publication Number Publication Date
GB8430429D0 GB8430429D0 (en) 1985-01-09
GB2150601A GB2150601A (en) 1985-07-03
GB2150601B true GB2150601B (en) 1987-06-03

Family

ID=24221260

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08430429A Expired GB2150601B (en) 1983-12-02 1984-12-03 Initiation of electroless nickel plating

Country Status (4)

Country Link
JP (1) JPS60138075A (de)
CA (1) CA1232104A (de)
DE (1) DE3443471A1 (de)
GB (1) GB2150601B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69507926T2 (de) * 1994-04-28 1999-09-16 Koninkl Philips Electronics Nv Verfahren zur erzeugung eines kupferbildes auf einer aus elektrisch nichtleitendem material bestehenden platte mittels eines photolithographischen verfahrens
CN100342058C (zh) * 2005-11-01 2007-10-10 桂林工学院 塑料表面化学镀镍无钯活化液配方及工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1145285A (en) * 1965-03-17 1969-03-12 Nat Res Dev Improvements relating to the deposition of metals
US3884704A (en) * 1973-03-21 1975-05-20 Macdermid Inc Catalyst system for activating surfaces prior to electroless deposition

Also Published As

Publication number Publication date
GB8430429D0 (en) 1985-01-09
CA1232104A (en) 1988-02-02
JPS60138075A (ja) 1985-07-22
DE3443471C2 (de) 1987-01-02
DE3443471A1 (de) 1985-06-13
JPH0148349B2 (de) 1989-10-18
GB2150601A (en) 1985-07-03

Similar Documents

Publication Publication Date Title
GB2093485B (en) Electroless alloy plating
EP0137981A3 (en) Through-hole plating
DE3473890D1 (en) Electroless copper plating solution
HK99890A (en) Improved electroless plating process
GB2095292B (en) Electroless gold plating
EP0113395A3 (en) Monitoring electroless plating
GB8422528D0 (en) Continuous electroplating of alloys
DE3467187D1 (en) Electroless copper plating solution
DE3066952D1 (en) Electroless copper plating solution
DE3374420D1 (en) Electroless nickel plating
GB2121444B (en) Electroless gold plating
GB8308579D0 (en) Nickel electroplating bath
GB2160897B (en) Electroless plating solution
DE3476683D1 (en) Process for electroless plating
GB2150601B (en) Initiation of electroless nickel plating
GB2155041B (en) Aqueous electroless nickel plating
GB2167447B (en) Cyanide free copper plating process
HK1006860A1 (en) Electroless nickel plating of aluminum
GB8332205D0 (en) Non-electrolytic copper plating
IL72636A0 (en) Electroless nickel plating of aluminum
GB8400288D0 (en) Bath for electroplating of palladium
GB2107741B (en) Electroless plating of nickel onto silicon
AU7351781A (en) Ammonia-free electroless nickel plating bath
GB8503104D0 (en) Electroless copper plating
IE831331L (en) Electroless gold plating

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee