GB2145976A - Ink jet head - Google Patents
Ink jet head Download PDFInfo
- Publication number
- GB2145976A GB2145976A GB08418928A GB8418928A GB2145976A GB 2145976 A GB2145976 A GB 2145976A GB 08418928 A GB08418928 A GB 08418928A GB 8418928 A GB8418928 A GB 8418928A GB 2145976 A GB2145976 A GB 2145976A
- Authority
- GB
- United Kingdom
- Prior art keywords
- ink
- ink jet
- substrate
- jet recording
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000011347 resin Substances 0.000 claims abstract description 24
- 230000037361 pathway Effects 0.000 claims abstract description 18
- 238000007599 discharging Methods 0.000 claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 13
- 125000003277 amino group Chemical group 0.000 claims abstract description 6
- 150000001875 compounds Chemical class 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 19
- 230000000052 comparative effect Effects 0.000 claims description 9
- -1 amino compound Chemical class 0.000 claims description 6
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims 1
- 238000010030 laminating Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 18
- 229920002120 photoresistant polymer Polymers 0.000 description 16
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052681 coesite Inorganic materials 0.000 description 4
- 229910052906 cristobalite Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 229910052682 stishovite Inorganic materials 0.000 description 4
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 4
- 229910052905 tridymite Inorganic materials 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229910000792 Monel Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001540 azides Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- AVDUEHWPPXIAEB-UHFFFAOYSA-N chloro-ethyl-dimethylsilane Chemical compound CC[Si](C)(C)Cl AVDUEHWPPXIAEB-UHFFFAOYSA-N 0.000 description 1
- 229940114081 cinnamate Drugs 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 238000006471 dimerization reaction Methods 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- QDWLLVUFTWGZRZ-UHFFFAOYSA-N diphenylmethanone;prop-2-enamide Chemical compound NC(=O)C=C.C=1C=CC=CC=1C(=O)C1=CC=CC=C1 QDWLLVUFTWGZRZ-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- UYMKPFRHYYNDTL-UHFFFAOYSA-N ethenamine Chemical compound NC=C UYMKPFRHYYNDTL-UHFFFAOYSA-N 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- QRWZCJXEAOZAAW-UHFFFAOYSA-N n,n,2-trimethylprop-2-enamide Chemical compound CN(C)C(=O)C(C)=C QRWZCJXEAOZAAW-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1604—Production of bubble jet print heads of the edge shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
A method for producing an ink jet head having ink pathways (9-2) of which at least a part is formed of a photosensitive resin (5P) on a substrate surface (1) on which there is provided an energy generating element (2) for generating energy to be utilized for discharging of ink, said substrate surface (1) is treated with a silane coupling agent in combination with a compound having an amino group, and thereafter laminating said photosensitive resin on the treated substrate. <IMAGE>
Description
SPECIFICATION
Method for producing ink jet recording head
Background of the invention
Field of the invention
This invention relates to a method for producing an ink jet recording head, particularly to a method for producing an ink jet recording head for generation of small droplets of ink to be used for an ink jet recording system.
Description of the prior art
Ink jet recording heads to be applied for ink jet recording systems are generally provided with minute ink discharging outlets (orifices), ink pathways and an ink discharging energy acting portion provided at a part of the ink pathways as the portion where the energy for discharging ink through the above discharging outlets acts on the ink existing in the ink pathways (energy acting portion).
In the prior art, as the method for preparing such ink jet recording heads, there is known, for example, the method of which minute grooves are formed on a plate of glass or metal by cutting or etching and then the plate having formed grooves is bonded with an appropriate plate to form ink pathways.
However, in the head prepared by such a method of the prior art, there may be formed too much coarsening of the internal walls of the ink pathways worked by cutting or distortions due to the difference in etching degree, whereby ink pathways with good precision can hardly be obtained and the ink jet recording heads after preparation are liable to give ink discharging characteristics which are scattered.
Also, chipping or cracking of the plate is liable to occur during cutting working to give a disadvantageously poor yield of production. And, when etching working is employed, production steps is increased to bring about a disadvantageous increase of cost. Further, as the drawback common in the preparation methods of the prior art as mentioned above, during lamination of an engraved plate having formed ink pathway grooves and a lid plate having formed driving elements such as piezo-electric elements and heat generating elements for generating energies acting on ink, it is difficult to effect registration therebetween with good precision, thus failing to afford mass production.
As the method for producing ink jet recording heads which can overcome these drawbacks, there is proposed the method for production of ink jet heads in which in pathway walls comprising a cured film of a photosensitive resin are formed, as disclosed in Japanese Laid-open Patent Application No.
43876/1982. According to this method ink-flow pathways can be minutely worked with precision and a good yield. In addition, since this method makes mass production easy to provide ink jet heads at lowcost, it can be said to be an excellent method.
However, although the ink jet head provided by such an improved method overcomes the drawbacks in the ink jet recording head of the prior art, the adhesive force between the substrate and the cured photosensitive resin film is gradually lowered during prolonged immersion in an ink, thereby causing minute peeling-off which has an influence on the straightforwardness of the ink, namely the precision of shot spots of the ink. This has been a great obstacle under the situation in recent years where the ink jet recording system is required to give an image quality of high resolution by means of a high density nozzle.
Summary of the invention
An object of the present invention is to provide a novel method for producing an ink recording head which is precise and also high in reliability.
Another object of the present invention is to provide a method for producing at a good yield by a simple procedure an ink jet head having a constitution with ink pathways minutely worked faithfully to the design with good precision.
Still another object of the present invention to provide an ink jet head which is excellent in use durability.
According to the aspect of the present invention, there is provided a method for producing an ink jet recording head having ink pathways of which at least a part is formed of a photosensitive resin on a substrate surface on which there is provided an energy generating element for generating energy to be utilized for discharging of ink, which comprises treating said substrate surface with a silane coupling agent in combination with a compound having an amine group, and thereafter laminating said photosensitive resin on the treated substrate.
Brief description of the drawings
Figures 1 through 6 show schematic drawings for illustration of the preparation steps of the ink jet head of the present invention.
Figure 7 shows a perspective view of the ink jet head obtained according to the method of the present invention.
Figures 8 and 9 are the sectional views taken along the line Z-Z' in Figure 7.
Description of the preferred embodiment
Referring now to the drawings, the present invention is to be described in detail.
Figures 1 through 6 show schematic drawings for illustration of the procedure for prepartion of the ink jet head of the present invention.
In the step shown in Figure 1, ink discharging energy generating elements 2 such as heat generating elements or piezo elements are arranged in a desired number on a substrate 1 such as of glass, ceramic, plastic or metal, and for the purpose of imparting electrical insulation, there is provided coating of a protective layer 3 comprising an inorganic oxide and/or an inorganic nitride such as SiO2, Ta2O5, Al203, glass, Si3N4, BN etc. Further, for the purpose of improvement of ink resistance, a thin film layer (not shown) comprising a metal may also be covered on the protective layer. As the metal for forming the thin film layer, there may be included anti-corrosive metals such as Ti, Cr, Ni, Ta, Mo, W, Nb, etc. and anti-corrosive alloys such as stainless steel, Monel metal, etc.Noble metals such as Au, Pd, Pt, etc., while they have good ink resistance, are insufficient in matching performance to the silane coupling agent as described hereinafter and therefore they cannot necessarily be preferable ones.
To the ink discharging energy generating elements 2 are connected electrodes for input of signals, although not shown in the drawings.
As the next step, the surface of the substrate 1 obtained in the step in Figure 1 is cleaned, dried at 80"C to 1500C for 10 minutes and thereafter applied with spinner coating with a mixed solution of n-propylamine having a molecular structure of CH3CH2CH2NH2, fly-mercaptopropyl trimethoxysilane having a molecular structure of HS(CH2)3Si(OCH3)3 in ethyl alcohol (each at a concentration of 0.05 mol/liter) followed by heating at 800C for 10 minutes to promote the reaction between the substrate 1 and the silane coupling agent, thereby forming a coupling agent layer 4 with a thickness of 0.3 A or less laminated on the substrate to provide the substrate as shown in Figure 2.
In the method according to the present invention, it is possible to employ all the silane coupling agents generally known in the art. Typical examples of such agents are classified according to the functional groups as set forth in table 1. Among the silane coupling agents, it is preferred to use a silane coupling agent having functional groups reactive with the photosensitive resin side, based on the composition of the photosensitive resin employed.
TABLE 1
Functional group
Chemical name Structural formula
Vinyltrichlorosilane CH2 = CHSiCe3 Vinylmethoxysilane CH2 = CHSi(OCH3)3
Vinylethoxysilane CH2 = CHSi(OC2H5)3 Vinylacetoxysilane
Vinyl
Vinyl-tris((3-methoxyethoxy) CH2 = CHSi(OCH2CH2OCH3)3 silane N-p-(N-vinylbenzylamino) ethyl-z-aminopropyltri- methoxysilane vmethacryloxypropyltrimethoxy-silane methacryloxyprnpyl-tns-(p- methoxyethoxy silane
Acryl
(ss-(3,4-epoxycyclohexyl)-ethyl-
trimethylsilane
Epoxy y-glycidoxypropyltrimethoxy- silane
rmercaptopropyltrimethoxy- HSCH2CH2CH2Si(OCH3)3
Mercapto silane y-mercaptopropylmethyldimethoxy- silane
methyltrichlorosilane CH3SiCt3 dimethyldichlorosilane (CH3)2SiCe2 Methyl trimethylchlorosilane (CH3)3SiCt methyltrimethoxysilane Cl3Si(OCH3)3
methyltriethoxysilane CH3Si(OC2H5)3
Hexamethyldisilazane (CH3)3SlNHSl(CH3)a -chlornprnpyltrimethoxysilane ClCH3CH3CH3Si(OCH3)3
Chloro y-chloropropylmethyldimethoxy- silane
phenyltrimethoxysilane
Phenyl phenyltriethoxysilane
As the compound having an amino group, there may be included aliphatic amines as preferable ones.
Among them, particularly preferred are n-propylamine, diethylamine, ethylenediamine, and triethylamine.
Further, it is also possible to use a silane coupling agent having an amino group selected from those as enumerated below.
TABLE 2
Functional Chemical name Structural formula group
y-aminopropyltrimethoxysilane NH2CH2CH2CH2Si(OCH3)3 y-aminopropyltriethoxysilane NH2CH2CH2CH2Si(OC2H,)3 N-P(aminoethyl-yaminopropyl- NH2(CH2)2NH(CH2)3Si(OCH3)3 trimethoxysilane N-(3(aminoethyl)-aminoprnpyl- methyldimethoxysilane
Amine N-(dimethoxymethylsilylisobutyl)- NH2(CH2)2N HCH2CH(CH3)CH2Si(OCH3)2CH3 ethyleneamine [bis(p-hydroxyethyl)iaminoprnpyl- (HOCH2CH2)2N(CH2)3Si(OC2H5)3
triethoxysilane rureidopropyltriethoxysilane NH2CONH(CH2)3Si(OC2H5)3 y-anilinopropyltrimethoxysilane
N-[N'-(p"-methoxycarbonylethyl)- p'-aminoethyl]-yaminopropyl- trimethoxysilane
Subsequently, on the layer 4 is laminated with a dry film photoresist 5 (film thickness: about 25 > to 100 p) heated to 80"C to 105or at a speed of 0.5 to 4 f/min. under a pressure of 1 to 3 kg/cm2. During this operation, the dry film photoresist 5 exhibits self-adhesiveness to be fixed through fusion onto the surface of the substrate 1, and it will not be peeled off even an external force may be thereafter applied thereon.
Then, as shown in Figure 3, after a photomask 6 having a predetermined pattern is superposed on the dry film photoresist provided on the substrate surface, exposure is effected from above the photomask 6.
During this operation, it is necessary to have the position at which the ink discharging pressure generating element 2 is to be arranged adapted in correspondence to the position of the above pattern in a conventional manner.
Figure 4 is a drawing for illustration of the step in which the unexpected portion of the above exposed dry film photoresist 5 is removed by dissolution with a developer comprising a certain organic solvent such as trichloroethane, whereby the ink pathways 9 are formed.
Then, for improvement of ink resistance of the exposed portion 5P of the dry film photoresist remaining on the substrate 1 and completion of the reaction between the dry film photoresist and the silane coupling agent, heat-curing treatment (for example, by heating at 150 to 250"C for 30 minutes to 6 hours) or UV-ray irradiation (for example at a UV-ray intensity of 50 to 200 mw/cm2 or higher) is applied thereon. It is also effective to apply both of the above heat curing and curing by UV-ray.
If the silane coupling agent layer 4 employed remains in the grooves 9, it may be dissolved out into the ink to denature the ink or damage the function of the ink discharging energy generating element 2, and therefore it is preferred to remove the silane coupling agent layer 4 exposed within the grooves 9 by ashing with oxygen plasma (Figure 5).
Figure 6 shows a drawing, in which a flat plate 8 for covering is fixed by adhering with an adhesive layer 7 on the substrate 1 having grooves 9 for ink pathways formed by the above dry film photoresist 5P which had been completely polymerized to be hardened. Without using an adhesive, it may also be fixed under pressurization.
As the specific methods for providing the covering in the step shown in Figure 6, there are:
1) the method in which a flat plate 8 such as of glass, ceramic, metal, plastic, etc. is subjected to spinner coating with an epoxy type resin to a thickness of 3 to 4 p, followed by the so called B-staging of the adhesive 7 by preliminary heating, and then the coated flat plate is laminated on the cured photoresist film 5P, followed by main curing of the aforesaid adhesive; or
2) the method in which a flat plate 8 of a thermoplastic resin such as acrylic resin, ABS resin, polyeth ylene, etc. is thermally fused to adhere directly onto the cured photoresist film 5P.
Here, there is shown in Figure 7 a schematic perspective view of the head appearance after completion of the step shown in Figure 6. In Figure 7, 9--1 is an ink supplying chamber, 9--2 narrow ink-flow pathways and 10 thru-holes for connection of the ink supplying tubes not shown in the drawing to the ink supplying chamber 91.
After completion of the bonding between the substrate having formed grooves and the flat plate as described above, the bonded segment is cut along the line C-C' shown in Figure 7. This is done for optimization of the interval between the ink discharging pressure generating element 2 and the ink discharging outlet 93 in the narrow ink-flow pathways 92. The region to be cut may be determined suitably as desired. For this cutting, there may be employed the dicing method conventionally used in the semiconductor industries.
Figure 8 is a sectional view taken along the line Z-Z' in Figure 7. And, the cut face is polished to be smoothened and the ink supplying tubes 11 are mounted onto the thru-holes 10 to complete the ink jet recording head (Figure 9).
In the embodiments as shown in the drawings as described above, as the photosensitive composition (photoresist) for preparation of the grooves, there has been employed the dry film type, namely a solid, to which, however, the present invention is not limited, but a liquid photosensitive composition may also be available.
As the method for forming the coated film of this photosensitive composition, there may be employed in case of a liquid the method according to squeegee used in preparation of a relief image, namely the method in which a wall with a height corresponding to the thickness of a desired film thickness of the photosensitive composition is placed around the substrate and the superfluous composition is removed by means of a squeegee. In this case, the photosensitive composition may have a viscosity preferably of 100 cp to 300 cp. The height of the wall to be placed around the substrate is required to be determined by taking the amount to be reduced through vaporazation of the solvent component of the photosensitive composition into consideration.
On the other hand, in case of a solid, the photosensitive composition sheet is laminated onto the substrate by pressure contact under heating. In the present invention, it is advantageous to utilize a solid film type from the standpoint of handling as well as easy and precise control of the thickness.
As such solid material sheets, there are photosensitive resin sheets commercially available under the trade names of Permanent Photopolymer Coating RISTON, Solder Mask 730S, 740S, 730FR, 740FR and
SM1, produced by Du Pont Co.
In addition, as the photosensitive composition to be used in the present invention, there may also be employed a number of photosensitive compositions employed in the field of photolithography in general such as photosensitive resins, photoresists, etc. These photosensitive compositions may include, for example, diazo resins, p-diazoquinones and further photopolymerizable type photopolymers such as those employing vinyl monomers and polymerization initiators, dimerization type photopolymers employing polyvinyl cinnamate, etc. and sensitizers, mixtures of o-naththoquinone azide and novolac type phenol resins, mixtures of polyvinyl alcohol and diazo resins, polyether type photopolymers having copolymerized 4-glycidylethleneoxide with benzophenone or glycidylcalcone, polymers of N,N-dimethylmethacrylamide with, for example, acrylamide benzophenone, unsaturated polyester type photosensitive resins (e.g. APR (Asahi Kasei), Tevista (Teijin), Sonne (Kansai Paint), etc.) unsaturated urethane oligomer type photosensitive resins, photosensitive compositions comprising mixtures of bi-functional acryl monomer with photopolymerization initiators and polymers, bichromic acid type photoresist, non-chromium type water soluble photoresist, polycynnamic acid vinyl type photoresist, cyclized rubber-azide type photoresist, etc.
As described in detail above, the present invention has the effects as enumerated below.
1. Due to increased adhesion between the substrate and the photosensitive resin, no peel-off of the photosensitive resin from the substrate occurred even under impact especially by cutting for formation of ink discharging outlets.
2. Through improvement of the solvent resistance at the adhered portion, no peel-off occurred between the pathway walls of a cured photosensitive resin film and the substrate even when employing an ink containing a solvent such as ethylene glycol.
3. Due to high stability in shape of the ink discharging outlets, the precision of the shot spots of ink is maintained high independently of lapse of time.
These effects of the present invention are illustrated in detail in the following Examples.
Except for varying the materials of the substrate surfaces for respective examples and practicing or not practicing the treatment with r-mercaptopropyltrimethoxysilane alone in Comparative examples, and practicing the treatment with a mixed solution of y-mercaptopropyltrimethoxysilane and n-propylam- ine or y-aminopropyltrimethoxysilane in ethanol (each at a concentration of 0.05 mol/liter) in Examples, following the same steps in the foregoing embodiment (Figures 1 through 6), there were prepared a number of ink jet recording heads having 24 ink discharging outlets. Here, in Comparative example 3a,
Examples 3b and 3c, a thin layer Ta was provided for imparting ink resistance to the substrate surface.
Among these sample heads, normal ones free from peeling-off of the photosensitive resin from the substrate were tested by immersing in a solution containing 20% of water and 80% of ethylene glycol at 80"C for 2500 hours. Then, heat shock test was conducted for the head immersed in the above solution, in which 100 cycles of cooling to -30 C and heating to 600C were repeated. After these tests, observation was made as to peeling-off of the photosensitive resin from the substrate. These results are shown in
Table 2.
The ink jet heads obtained in comparative example 3a and Example 3c were subjected to the durability letter printing test using 108 pulse signals to the energy-generating elements. As the result, the precision of the shot spot was + 11 all/2 mmflight distance for the head of Example 3c, while it was + 50 > /2 mmflight distance for Comparative example 3a.
The photosensitive resin emloyed was all RISTON 730 S dry film photoresist (trade name; produced by
Du Pont Co.).
TABLE 3
Example No. Material of Silane Amine Number of peeled heads
substrate coupling *3 Immersion Heat shock
surface agent test test
Comparative example la SiO2 not used not used *1 *1 Comparative example 1b SiO2 used not used 1/20 3/20
Example 1C SiO2 used n-propylamine 0/20 0/20
Comparative example 2a Ta2O5 used not used 3/20 8/20
Example 2b Ta2O5 used n-propylamine 0/20 0/20
Example 2c Ta2O5 used y--aminopropyl- 0/20 0/20
trimethoxysilane
Comparative example 3a Ta used not used 3/20 5/20
Example 3b Ta used n-propylamine 0/20 0/20
Example 3c Ta used raminopropyl- 0/20 0/20
trimethoxysilane *1 Ratio of peeled heads on completion of heads before the immersion and heat shock tests: 18/20
The invention is inclusive of processes in which the photosensitive resin loses its photosensitivity during manufacture of the head, and those in which it retains its photosensitivity even after completion of the head. It also includes processes in which separately made parts are subsequently bonded to the substrate as well as the preferred process in which the parts are formed over the substrate.
Claims (10)
1. A method for producing an ink jet recording head having ink pathways defined over a substrate surface on which there are provided energy generating elements for generating energy to be utilised for discharging of ink, and wherein at least a part of the head is formed utilising a photosensitive resin, characterised in that the substrate surface is treated with a composition comprising a silane coupling agent and a compound having an amino group prior to uniting said photosensitive resin with said substrate.
2. A method according to claim 1, wherein said energy generating element is a heat generating element.
3. A method according to claim 1, wherein said energy generating element is a piezoelectric element.
4. A method according to any preceding claim, wherein the composition forms a layer having a thickness of 0.3 11 or less.
5. A method according to any preceding claim wherein said amino compound is an aliphatic amine.
6. A method according to claim 1, wherein said composition comprises a silane coupling agent having an amino group.
7. A method for producing an ink jet recording head substantialiy as described herein with reference to the accompanying drawings.
8. A method for producing an ink jet recording head substantially as described herein with reference to any one of the Examples (excluding comparative examples).
9. An ink jet recording produced by a method according to any preceding claim.
10. An ink jet printer utilising a recording head according to claim 9.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13855583A JPS6030355A (en) | 1983-07-28 | 1983-07-28 | Manufacture of inkjet recording head |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8418928D0 GB8418928D0 (en) | 1984-08-30 |
| GB2145976A true GB2145976A (en) | 1985-04-11 |
| GB2145976B GB2145976B (en) | 1987-07-08 |
Family
ID=15224877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08418928A Expired GB2145976B (en) | 1983-07-28 | 1984-07-25 | Ink jet head |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS6030355A (en) |
| FR (1) | FR2549777B1 (en) |
| GB (1) | GB2145976B (en) |
| HK (1) | HK73091A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4766671A (en) * | 1985-10-29 | 1988-08-30 | Nec Corporation | Method of manufacturing ceramic electronic device |
| JP2810050B2 (en) * | 1988-06-20 | 1998-10-15 | キヤノン株式会社 | Method for manufacturing liquid jet recording head |
| JP2728911B2 (en) * | 1988-12-26 | 1998-03-18 | 株式会社リコー | Liquid jet recording device |
| JP2849109B2 (en) * | 1989-03-01 | 1999-01-20 | キヤノン株式会社 | Method of manufacturing liquid jet recording head and liquid jet recording head manufactured by the method |
| KR100697583B1 (en) | 2001-07-12 | 2007-03-22 | 호도가야 가가쿠 고교 가부시키가이샤 | Peel-treating agent and method for producing the peel-treating agent |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2104451A (en) * | 1981-06-18 | 1983-03-09 | Canon Kk | Ink jet head |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55128469A (en) * | 1979-03-29 | 1980-10-04 | Canon Inc | Preparing method for recording head |
| DE3322647A1 (en) * | 1982-06-25 | 1983-12-29 | Canon K.K., Tokyo | Method of producing an ink-jet recording head |
-
1983
- 1983-07-28 JP JP13855583A patent/JPS6030355A/en active Pending
-
1984
- 1984-07-25 GB GB08418928A patent/GB2145976B/en not_active Expired
- 1984-07-27 FR FR8411971A patent/FR2549777B1/en not_active Expired
-
1991
- 1991-09-05 HK HK73091A patent/HK73091A/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2104451A (en) * | 1981-06-18 | 1983-03-09 | Canon Kk | Ink jet head |
Also Published As
| Publication number | Publication date |
|---|---|
| HK73091A (en) | 1991-09-13 |
| GB8418928D0 (en) | 1984-08-30 |
| FR2549777A1 (en) | 1985-02-01 |
| GB2145976B (en) | 1987-07-08 |
| FR2549777B1 (en) | 1988-07-22 |
| JPS6030355A (en) | 1985-02-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PE20 | Patent expired after termination of 20 years |
Effective date: 20040724 |