JPH0415096B2 - - Google Patents
Info
- Publication number
- JPH0415096B2 JPH0415096B2 JP10944782A JP10944782A JPH0415096B2 JP H0415096 B2 JPH0415096 B2 JP H0415096B2 JP 10944782 A JP10944782 A JP 10944782A JP 10944782 A JP10944782 A JP 10944782A JP H0415096 B2 JPH0415096 B2 JP H0415096B2
- Authority
- JP
- Japan
- Prior art keywords
- ink
- substrate
- inkjet recording
- recording head
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 229910052809 inorganic oxide Inorganic materials 0.000 claims description 15
- 150000004767 nitrides Chemical class 0.000 claims description 14
- 239000000976 ink Substances 0.000 description 53
- 239000010408 film Substances 0.000 description 24
- 229920002120 photoresistant polymer Polymers 0.000 description 18
- 238000000034 method Methods 0.000 description 15
- 239000000203 mixture Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- -1 Ta 2 O 5 Chemical class 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229940114081 cinnamate Drugs 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 150000003609 titanium compounds Chemical class 0.000 description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 1
- HCPAOTGVQASBMP-UHFFFAOYSA-N 2-(oxiran-2-ylmethyl)oxirane Chemical compound C1OC1CC1CO1 HCPAOTGVQASBMP-UHFFFAOYSA-N 0.000 description 1
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical compound [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- DQFBYFPFKXHELB-UHFFFAOYSA-N Chalcone Natural products C=1C=CC=CC=1C(=O)C=CC1=CC=CC=C1 DQFBYFPFKXHELB-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000792 Monel Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000005513 chalcones Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- FHIVAFMUCKRCQO-UHFFFAOYSA-N diazinon Chemical compound CCOP(=S)(OCC)OC1=CC(C)=NC(C(C)C)=N1 FHIVAFMUCKRCQO-UHFFFAOYSA-N 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical compound O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 description 1
- QDWLLVUFTWGZRZ-UHFFFAOYSA-N diphenylmethanone;prop-2-enamide Chemical compound NC(=O)C=C.C=1C=CC=CC=1C(=O)C1=CC=CC=C1 QDWLLVUFTWGZRZ-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- QRWZCJXEAOZAAW-UHFFFAOYSA-N n,n,2-trimethylprop-2-enamide Chemical compound CN(C)C(=O)C(C)=C QRWZCJXEAOZAAW-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- KQJBQMSCFSJABN-UHFFFAOYSA-N octadecan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-] KQJBQMSCFSJABN-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1604—Production of bubble jet print heads of the edge shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
Description
æ¬çºæã¯ãã€ã³ã¯ãžãšããèšé²ãããã詳ãã
ã¯ãæè¬ã€ã³ã¯ãžãšããèšé²æ¹åŒã«çšããèšé²çš
ã€ã³ã¯å°æ»Žãçºçããããã®ã€ã³ã¯ãžãšããèšé²
ãããã«é¢ããã
ã€ã³ã¯ãžãšããèšé²æ¹åŒã«é©çšãããã€ã³ã¯ãž
ãšããèšé²ãããã¯ãäžè¬ã«ã埮现ãªã€ã³ã¯ååº
å£ïŒãªãªãã€ã¹ïŒãã€ã³ã¯éè·¯åã³ãã®ã€ã³ã¯é
è·¯ã®äžéšã«èšããããã€ã³ã¯ååºå§çºçéšãåã
ãŠããã
åŸæ¥ããã®æ§ãªã€ã³ã¯ãžãšããèšé²ããããäœ
æããæ¹æ³ãšããŠãäŸãã°ãã¬ã©ã¹ãéå±ã®æ¿ã«
ååããšããã³ã°çã«ããã埮现ãªæºã圢æãã
åŸããã®æºã圢æããæ¿ãä»ã®é©åœãªæ¿ãšæ¥åã
ãŠã€ã³ã¯éè·¯ã®åœ¢æãè¡ãªãæ¹æ³ãç¥ãããŠã
ãã
ããããæ¯ããåŸæ¥æ³ã«ãã€ãŠäœæããããã
ãã§ã¯ãååå å·¥ãããã€ã³ã¯éè·¯å
å£é¢ã®èã
ã倧ãéãããããšããã³ã°çã®å·®ããã€ã³ã¯é
è·¯ã«æªãçãããããŠã粟床ã®è¯ãã€ã³ã¯éè·¯ã
åŸé£ãã補äœåŸã®ã€ã³ã¯ãžãšããèšé²ãããã®ã€
ã³ã¯ååºç¹æ§ã«ãã©ãããåºæãããŸããååå
å·¥ã®éã«ãæ¿ã®æ¬ ããå²ããçãæãã補é æ©ç
ããæªããšèšãåé¡ç¹ãããããããŠããšããã³
ã°å å·¥ãè¡ãªãå Žåã¯ã補é å·¥çšãå€ãã補é ã³
ã¹ãã®äžæãæããšããåé¡ç¹ããããæŽã«ãäž
èšããåŸæ¥æ³ã«å
±éããåé¡ç¹ãšããŠã¯ãã€ã³ã¯
éè·¯æºã圢æããæºä»æ¿ãšãã€ã³ã¯ã«äœçšãããš
ãã«ã®ãŒãçºçããå§é»çŽ åãçºç±çŽ åçã®é§å
çŽ åãèšããããèæ¿ãšã®è²Œåãã®éã«ã倫ã
ã®
äœçœ®åãã粟床è¯ãè¡ãããšãå°é£ã§ãã€ãŠéç£
æ§ã«æ¬ ããç¹ãæããããã
ããçã®åé¡ç¹ã解決ãããæ§æãæããã€ã³
ã¯ãžãšããèšé²ããããšããŠãã€ã³ã¯ååºå§çºç
çŽ åã®èšçœ®ããŠããåºæ¿ã«æå
æ§æš¹èã®ç¡¬åèã
ããªãã€ã³ã¯éè·¯å£ã圢æãããã®åŸåèšéè·¯ã«
èŠããèšããã€ã³ã¯ãžãšããèšé²ãããããäŸã
ã°ç¹éæ57â43876å·ã«ããç¥ãããŠããã
ãã®æå
æ§æš¹èãå©çšããŠè£œäœãããã€ã³ã¯ãž
ãšããèšé²ãããã¯ãåŸæ¥ã®ãããã®åé¡ç¹ã§ã
ã€ãã€ã³ã¯éè·¯ã®ä»äžã粟床ã補é å·¥çšã®è€é
ãã補é æ©çããæªããšããåé¡ç¹ã解決ããç¹
ã§ã¯åªãããã®ã§ãããããããªãããã€ã³ã¯å
åºå§çºççŽ åã®èšçœ®ããŠããåºæ¿ãšããã®äžã«åœ¢
æããæå
æ§æš¹èã®ç¡¬åèã®éè·¯å£ã®æ¥ååã®ç¹
ã§åé¡ãæ®ããŠããããããããã°ãåºæ¿ã«å¯Ÿã
ãæå
æ§æš¹è硬åèã®å¯çæ§ãå
åã§ãªããé·æ
éã«äºã€ãŠã€ã³ã¯æ»Žãååºããããšãã€ã³ã¯æ»Žã®
ååºã®éã®è¡æã«ãã€ãŠãæãã¯èªèº«ã®çµæå€å
ã«ãã€ãŠãã€ã³ã¯ååºå£éšåã®åºæ¿ãšéè·¯å£ãé
åžžã«å
ãã§ã¯ãããå¥é¢ããã€ã³ã¯æ»Žã®çŽé²æ§ã
ããªãã¡ã€ã³ã¯ç匟ç¹ç²ŸåºŠã«åœ±é¿ãäžããŠããã
ãã®ããšã¯ãè¿å¹Žã€ã³ã¯ãžãšããèšé²æ¹åŒãé«å¯
床ããºã«ã«ãã€ãŠé«è§£å床ã®ç»è³ªãžã®èŠæ±ãé«ãŸ
ã€ãŠããäžã§ã倧ããªé害ãšãªã€ãŠããã
æ¬çºæã¯ãäžèšã®åé¡ç¹ãéã¿æãããã®ã§ã
粟å¯ã§ãããä¿¡é Œæ§ãé«ãã䜿çšèä¹
æ§ã«åªã
ããé«å¯åºŠé«å質ãªç»è³ªãåŸãããã®ã€ã³ã¯ãžãš
ããèšé²ããããæäŸããããšãç®çãšããŠã
ãã
ãã®ãããªè«žç®çãéæããæ¬çºæã®ã€ã³ã¯ãž
ãšããèšé²ãããã¯ãæå
æ§æš¹èãçšããŠåœ¢æã
ããèãå©çšããŠãã€ã³ã¯ãååºãããååºå£ã«
é£éããã€ã³ã¯éè·¯ãåºæ¿äžã«èšããããŠããã€
ã³ã¯ãžãšããèšé²ãããã«ãããŠãååºå£è¿åã®
åºæ¿äžã«ãç¡æ©é
žåç©åã³ç¡æ©çªåç©ã®å°ãªããš
ãããããäžæ¹ãããªã垯ç¶ã®å±€ãšãæ¥çåäžå€
å±€ãšãåèšèãšããé ã«æããŠããããšãç¹åŸŽãš
ããã
以äžãå³é¢ã«åºã¥ããŠæ¬çºæã詳现ã«èª¬æã
ãã
å
ãã第ïŒå³âïœä¹è³ç¬¬ïŒå³âïœã«ç€ºããäœæ
å·¥çšã«åŸã€ãŠæ¬çºæã®å®æœäŸã説æããã
第ïŒå³âïœã®å·¥çšã§ã¯ãã¬ã©ã¹ãã»ã©ããã¯ã
ãã©ã¹ããã¯ãéå±çãããªãåºæ¿ïŒäžã«ãã€ã³
ã¯éè·¯ã«å¯Ÿå¿ããŠãã€ã³ã¯ã®ååºå£ããã€ã³ã¯ã
ååºããããã«å©çšããããšãã«ã®ãŒãçºçãã
ãšãã«ã®ãŒçºççŽ åïŒãšããŠç±ãšãã«ã®ãŒãçºç
ããçºç±çŽ åãããšãŸçŽ åçãææã®åæ°é
眮ã
ãã次ãã§é»æ°çµ¶çžæ§ãä»äžããç®çã§ãSiO2ã
Ta2O5ãAl2O3ãã¬ã©ã¹ãSi3N4ãBNçã®ç¡æ©é
ž
åç©ãç¡æ©çªåç©ã被èŠããæŽã«èã€ã³ã¯æ§ãäž
ããããAuãPdãPtçã®è²Žéå±ãTiãCrãNiã
TaãMoããNbçèé£éå±åã¯SUSãã¢ãã«
ã¡ã¿ã«çã®èé£åéãä¿è·å±€ãšããŠè¢«èŠããããª
ãããããä¿è·å±€ã¯å³ç€ºãããŠãããããŸããã€
ã³ã¯ååºå§çºççŽ åïŒã«ã¯ä¿¡å·å
¥åçšé»æ¥µãæ¥ç¶
ããŠããã第ïŒå³âïœã¯åèšåºæ¿ã®æé¢å³ã§ã
ãã
ç¶ã第ïŒå³âïœã®å·¥çšã§ã¯ãäžèšã€ã³ã¯ååºå§
çºççŽ åïŒãæããåºæ¿è¡šé¢ã«ç¡æ©é
žåç©åã³ïŒ
åã¯ç¡æ©çªåç©ïŒãšããŠãèžçãã¹ããã¿ãªã³ã°
çã«ãã€ãŠSiO2ãTa2O5ãAl2O3ãSi3N4ãBNã
ã¬ã©ã¹çã®èèã圢æããããã®å Žåã®ç¡æ©é
žå
ç©åã³ïŒåã¯ç¡æ©çªåç©ã®å±€ã®åããšããŠã¯ãåŸ
ã§æå
æ§æš¹èèã被èŠããéã«é害ãšãªããªãã
ãã«5ÎŒïœä»¥äžã奜ãŸããã
第ïŒå³âïœã®å·¥çšã§ã¯ãååºå§çºççŽ åã®é
眮
ãããåºæ¿ïŒã®ã€ã³ã¯ååºå£ã圢æããã端é¢ã«
èšãéšåã«ã ãåèšç¡æ©é
žåç©åã³ïŒåã¯ç¡æ©çª
åç©ïŒãæ®ãããã«ãå
¬ç¥ã®ããªããªãœã°ã©ãã€
æ³ã«ãã€ãŠããªãã¬ãžã¹ãåã§ã«ããŒãããã®åŸ
åšç¥ã®æ¹æ³ã§ç¡æ©é
žåç©åã³ïŒåã¯ç¡æ©çªåç©ïŒ
ã®äžèŠãªéšåããšããã³ã°ã«ãã€ãŠé€å»ããã
äœããäžèšã®æ¹æ³ã«ããããããªãã¡åºæ¿ïŒã®
è¡šé¢ã«æ°ãã«ç¡æ©é
žåç©åã³ïŒåã¯ç¡æ©çªåç©ïŒ
ã®èå±€ã被èŠããããšãªãããããããåºæ¿ïŒã®
èã€ã³ã¯æ§ãé«ããç®çã§è¢«èŠããŠããéå±èå±€
ãå¿
èŠãªé åã ãããªããªãœã°ã©ãã€ãŒæ³ã«ãã€
ãŠé€å»ããåèšéå±èå±€ã®äžå±€ã«ããç¡æ©é
žåç©
åã³ïŒåã¯ç¡æ©çªåç©ã®å±€ãé²åºãããæ¹æ³ãã
ãã以äžã®å·¥çšãçµãŠåŸããããã®ãå³ïŒå³â
ïœããã®æé¢å³ã第ïŒå³âïœã§ããã
ç¡æ©é
žåç©åã³ïŒåã¯ç¡æ©çªåç©ã®å±€ïŒã¯ã第
ïŒå³âïœã«ç€ºãããããã«ãç¹ã«å€§ããªæ¥çåã
èŠæ±ãããã€ã³ã¯ååºå£ã圢æãããåºæ¿ã®ç«¯é¢
ã«èšãéšåã«åž¯ç¶ã«èšããããšã奜ãŸããããã€
ã³ã¯éè·¯ã圢æãããéšåã«ã¯ãã®å±€ã¯å¿
èŠããª
ãã®ã§ããç¶ã«ç¡æ©é
žåç©åã³ïŒåã¯ç¡æ©çªåç©
ã®å±€ãèšããããšãã§ããã
ãã ããç¡æ©é
žåç©ãç¡æ©çªåç©ã垯ç¶ã«èšã
ãå Žåã«ã¯ãååºå£è¿åã®åºæ¿é¢äžãäžæ§ã«å¹³åŠ
ã«ããããšãã§ããæŽã«åºæ¿åŽãšæå
æ§æš¹èã«ã
ãèãšã®æ¥çåãåäžãããããšãã§ããã
次ã«ç¬¬ïŒå³ã®å·¥çšã§åŸãããåºæ¿ïŒã®è¡šé¢ãæµ
åãã80ã110âã§10åéåã¯ãã以äžä¹Ÿç¥ãã
ãåŸãæ¥çåäžå€ïŒÎ³âã¢ãããããã«ããªãšã
ãã·ã·ã©ã³ãååæ§é åŒNH2ïŒCH2ïŒ3SiïŒOC2H5ïŒ3
ã®ãšãã«ã¢ã«ã³ãŒã«ïŒïŒ
溶液ïŒã1000ã6000rpm
ã§ã¹ãã³ããŒã³ãŒããããã®åŸ80âã§10ã20åé
å ç±ããã
æ¬çºææ¹æ³ã«ãããŠã¯ãæ¥çåäžå€ãšããŠäžèš
ã®Î³âã¢ãããããã«ããªãšããã·ã·ã©ã³ä»¥å€
ã«ãäžè¬ç¥ãããŠããææ©ã·ã©ã³ååç©ãããã¯
ææ©ãã¿ã³ååç©ãææ©ã¢ã«ãããŠã ååç©ãæ
æ©äºéååç©ã䜿çšããããšãã§ããããããæ¥
çå€ã¯ã䜿çšããæå
æ§æš¹èã®çµæã«å¿ããæå
æ§æš¹èãšåå¿ããå®èœåºãæããæ¥çåäžå€ãéž
æããŠäœ¿çšããããšã奜ãŸããããããææ©ã·ã©
ã³ååç©åã³ææ©ãã¿ã³ååç©ã®ä»£è¡šçãªãã®ã
å®èœåºå¥ã«ãŸãšããã®ãè¡šïŒåã³è¡šïŒã§ããã
The present invention relates to an inkjet recording head, and more particularly to an inkjet recording head for generating recording ink droplets used in so-called inkjet recording systems. An inkjet recording head applied to an inkjet recording system generally includes a fine ink ejection opening (orifice), an ink passage, and an ink ejection pressure generating section provided in a part of the ink passage. Conventionally, such an inkjet recording head has been manufactured by forming fine grooves on a glass or metal plate by cutting or etching, and then bonding the plate with the grooves to another suitable plate. There is a known method for forming ink passages. However, in heads manufactured by such conventional methods, the roughness of the inner wall surface of the ink passages to be cut is too large, and distortion occurs in the ink passages due to differences in etching rate. It is difficult to obtain the desired characteristics, and variations tend to occur in the ink ejection characteristics of the inkjet recording head after manufacture. Further, there is also the problem that the plate is likely to chip or crack during cutting, resulting in poor manufacturing yield. When etching is performed, there are many manufacturing steps, which leads to an increase in manufacturing costs. Furthermore, a problem common to the above-mentioned conventional methods is that the grooved plate in which the ink passage grooves are formed and the lid plate provided with drive elements such as piezoelectric elements and heating elements that generate energy that acts on the ink. During lamination, it is difficult to align the respective positions with high precision, and mass production is lacking. An inkjet recording head having a configuration that solves these problems involves forming an ink passage wall made of a cured film of a photosensitive resin on a substrate on which an ink ejection pressure generating element is installed, and then covering the passage. An inkjet recording head is known, for example, from JP-A-57-43876. The inkjet recording head manufactured using this photosensitive resin is superior in that it solves the problems of conventional heads, such as the precision of the ink passage finish, the complexity of the manufacturing process, and poor manufacturing yield. It is something that However, there remains a problem in the bonding strength between the substrate on which the ink ejection pressure generating element is installed and the passage wall of the cured photosensitive resin film formed thereon. In other words, if the adhesiveness of the photosensitive resin cured film to the substrate is not sufficient and ink droplets are ejected for a long time, the ink droplets may be damaged due to the impact during ejection or due to changes over time. , the substrate at the ink ejection port and the passage wall peeled off, albeit very slightly, and the straightness of the ink droplets deteriorated.
In other words, it affects the accuracy of the ink landing point.
This has become a major hindrance in recent years as the demand for high-resolution image quality in inkjet recording systems has increased due to the use of high-density nozzles. The present invention was made in view of the above problems.
The object of the present invention is to provide an inkjet recording head that is precise, highly reliable, and has excellent durability in use, and is capable of producing high-density, high-quality images. The inkjet recording head of the present invention, which achieves these objects, has an ink passage formed on a substrate that communicates with an ejection port through which ink is ejected, using a film formed using a photosensitive resin. In the inkjet recording head, the substrate near the ejection port has, in this order, a band-shaped layer made of at least one of an inorganic oxide and an inorganic nitride, an adhesion improver layer, and the above film. It is characterized by Hereinafter, the present invention will be explained in detail based on the drawings. First, an embodiment of the present invention will be described according to the manufacturing steps shown in FIGS. 1-a to 7-c. In the process shown in Figure 1-a, glass, ceramic,
On a substrate 1 made of plastic, metal, etc., a heating element or piezoelectric element that generates thermal energy is installed as an energy generating element 2 that generates energy used to eject ink from an ink ejection port, corresponding to an ink passage. A desired number of elements etc. are arranged. Next, for the purpose of imparting electrical insulation, SiO 2 ,
Coated with inorganic oxides and inorganic nitrides such as Ta 2 O 5 , Al 2 O 3 , glass, Si 3 N 4 and BN, and noble metals such as Au, Pd and Pt, Ti and Cr to provide further ink resistance. ,Ni,
A corrosion-resistant metal such as Ta, Mo, W, or Nb or a corrosion-resistant alloy such as SUS or Monel metal is coated as a protective layer. Note that these protective layers are not shown, and a signal input electrode is connected to the ink ejection pressure generating element 2. FIG. 1-b is a sectional view of the substrate. In the subsequent step of FIG. 1-c, inorganic oxide and/or inorganic oxide and/or
Or, as the inorganic nitride 3, SiO 2 , Ta 2 O 5 , Al 2 O 3 , Si 3 N 4 , BN,
Forms a thin film of glass, etc. In this case, the thickness of the inorganic oxide and/or inorganic nitride layer is preferably 5 .mu.m or less so as not to become a hindrance during later coating with a photosensitive resin film. In the step of FIG. 1-d, the inorganic oxide and/or inorganic nitride 3 is left only on the portion facing the end face where the ink ejection port is formed of the substrate 1 on which the ejection pressure generating element is arranged. covered with a photoresist image by the photolithographic method of
Remove unnecessary parts by etching. However, if the method described above is not used, in other words, the inorganic oxide and/or inorganic nitride 3 is newly added to the surface of the substrate 1.
The thin metal layer that has been coated in advance to improve the ink resistance of the substrate 1 is removed by photolithography only in the necessary areas, without coating the thin metal layer below the thin metal layer. Another method is to expose a layer of inorganic oxide and/or inorganic nitride. Figure 2 shows what was obtained through the above steps.
a, and its cross-sectional view is shown in FIG. 2-b. As shown in FIG. 2-a, the inorganic oxide and/or inorganic nitride layer 3 is formed in a band-like manner on the part facing the end surface of the substrate where the ink ejection openings, which require particularly high adhesive strength, are formed. Although it is preferable to provide this layer, since this layer is not necessary in the portion where the ink passage is formed, a comb-shaped layer of inorganic oxide and/or inorganic nitride may also be provided. However, if an inorganic oxide or inorganic nitride is provided in a band shape, the surface of the substrate near the discharge port can be made uniformly flat, and the adhesive force between the substrate side and the film made of photosensitive resin can be improved. can be improved. Next, the surface of the substrate 1 obtained in the process shown in Fig. 2 is cleaned and dried at 80 to 110°C for 10 minutes or more. 2 (CH 2 ) 3 Si (OC 2 H 5 ) 3
(1% solution of ethyl alcohol) at 1000 to 6000 rpm
Coat with a spinner and then heat at 80°C for 10-20 minutes. In the method of the present invention, in addition to the above-mentioned γ-aminopropyltriethoxysilane, generally known organic silane compounds, organic titanium compounds, organic aluminum compounds, and organic zinc compounds can be used as adhesion improvers. For these adhesives, it is preferable to select and use an adhesion improver having a functional group that reacts with the photosensitive resin, depending on the composition of the photosensitive resin used. Tables 1 and 2 summarize typical organic silane compounds and organic titanium compounds by functional group.
ãè¡šããtableã
ãè¡šããtableã
ãè¡šããtableã
ãè¡šããtableã
ãè¡šã
第ïŒå³ã®å·¥çšã§ã¯ã第ïŒå³ã®å·¥çšãçµãŠåŸãã
ãåºæ¿ïŒã®è¡šé¢ãæµåãã也ç¥ãããåŸããã®è¡š
é¢ã«80âã105âçšåºŠã«å æž©ãããæå
æ§æš¹èã§
ãããã©ã€ãã€ã«ã ããªãã¬ãžã¹ãïŒïŒèåãçŽ
25ÎŒïœã100ÎŒïœïŒã0.5ã4fïŒåã®é床ãïŒãïŒ
KgïŒcm2ã®å å§æ¡ä»¶äžã§ã©ãããŒãããããã®ãš
ãããã©ã€ãã€ã«ã ããªãã¬ãžã¹ãïŒã¯èªå·±æ¥ç
æ§ã瀺ããŠåºæ¿ïŒã®è¡šé¢ã«èçããŠåºå®ããã以
åŸãçžåœã®å€å§ãå ãã€ãå Žåã«ãåºæ¿ïŒããå¥
é¢ããããšã¯ãªããç¹ã«ãæ¬å®æœäŸã§ã¯çºç±çŽ å
ãé»æ¥µçã圢æããã®ãšåæ§ãªåå°äœè£œé å·¥çšã
çšããŠç¡æ©é
žåç©ãç¡æ©çªåç©ãåºæ¿äžã«èšããŠ
ãããããã®ç¡æ©é
žåç©ãç¡æ©çªåç©ã®å±€ãšåºæ¿
åŽãšã¯å¯çåã倧ã§ãããšå
±ã«ããŸãæ¥çåäžå€
ãšã®ååçã¬ãã«ã§ã®çµåïŒååŠçãªçµååã«ã
ãçµåïŒãè¯ããããçµæãšããŠãã©ã€ãã€ã«ã
ããªãã¬ãžã¹ãïŒãšã®å¯çã匷åºã«è¡ãããã
ç¶ããŠã第ïŒå³ã«ç€ºãæ§ã«ãåºæ¿é¢ã«èšããã
ã©ã€ãã€ã«ã ããªãã¬ãžã¹ãïŒäžã«æå®ã®ãã¿ãŒ
ã³ãæããããªããã¹ã¯ïŒãéãåããåŸããã®
ããªããã¹ã¯ïŒã®äžéšããé²å
ãè¡ãããã®ãš
ããã€ã³ã¯ååºå§çºççŽ åïŒã®èšçœ®äœçœ®ãšäžèšã
ã¿ãŒã³ã®äœçœ®åããå
¬ç¥ã®ææ³ã§è¡ã€ãŠããå¿
èŠ
ãããã
第ïŒå³ã¯ãäžèšé²å
æžã¿ã®ãã©ã€ãã€ã«ã ããª
ãã¬ãžã¹ãïŒã®æªé²å
éšåãæå®ã®ææ©æº¶å€ãã
æãçŸå液ã«ãŠæº¶è§£é€å»ããå·¥çšã瀺ã説æå³ã§
ããã次ã«ãåºæ¿ïŒã«æ®ããããã©ã€ãã€ã«ã ã
ãªãã¬ãžã¹ãã®é²å
ãããéšåïŒïœã®èã€ã³ã¯æ§
åäžã®ãããç±ç¡¬ååŠçïŒäŸãã°150âã250âã§
30åãïŒæéãå ç±ïŒåã¯ã玫å€ç·ç
§å°ïŒäŸãã°
50ã200ïœïŒ·ïŒcm2åã¯ãã以äžã®çŽ«å€ç·åŒ·åºŠã§ïŒ
ãè¡ããå
åã«éå硬ååå¿ãé²ãããäžèšç±ç¡¬
åãšçŽ«å€ç·ã«ãã硬åã®äž¡æ¹ãå
Œçšããã®ãå¹æ
çã§ããã
第ïŒå³ã¯ãäžèšã®å
åãªéåãçµãã硬åãã
ãã©ã€ãã€ã«ã ã¬ãžã¹ãïŒïœã§ã€ã³ã¯éè·¯ãšãªã
æºïŒã®åœ¢æãããåºæ¿ïŒã«èŠããšãªãå¹³æ¿ïŒãæ¥
çãããåã«å§çããŠåºå®ãããšããã瀺ãå³ã§
ããã第ïŒå³ã«ç€ºãå·¥çšã«æŒãŠãèŠããä»èšãã
å
·äœçæ¹æ³ãšããŠã¯ã
(1) ã¬ã©ã¹ãã»ã©ããã¯ã¹ãéå±ããã©ã¹ããã¯
çã®å¹³æ¿ïŒã«ãšããã·ç³»æ¥çå€ãåãïŒã4ÎŒ
ïœã«ã¹ãã³ããŒã³ãŒãããåŸãäºåå ç±ããŠæ¥
çå€ãæè¬ãã¹ããŒãžåãããããã硬åã
ãããªãã¬ãžã¹ãèïŒïœäžã«è²ŒãåããŠåèšæ¥
çå€ãæ¬ç¡¬åããããæã¯ã
(2) ã¢ã¯ãªã«ç³»æš¹èãABSæš¹èãããªãšãã¬ã³
çã®ç±å¯å¡æ§æš¹èã®å¹³æ¿ïŒã硬åããããªãã¬
ãžã¹ãèïŒïœäžã«ãçŽæ¥ãç±èçãããæ¹æ³ã
ããã
ããã§ã第ïŒå³ç€ºã®å·¥çšçµäºåŸã®ãããå€èŠ³ã
第ïŒå³âïœã«ãæš¡åŒçæèŠå³ã§ç€ºãã第ïŒå³âïœ
äžãïŒâïŒã¯ã€ã³ã¯äŸçµŠå®€ãïŒã¯ã€ã³ã¯çŽ°æµè·¯ã
ïŒïŒã¯ã€ã³ã¯äŸçµŠå®€ïŒâïŒã«äžå³ç€ºã®ã€ã³ã¯äŸçµŠ
管ãé£çµãããçºã®è²«éåã瀺ããŠããã
ãã®ããã«ããŠæºã圢æããåºæ¿ãšå¹³æ¿ãšã®æ¥
åãå®äºããåŸã第ïŒå³ã®ïŒ£âCâ²ç·ã«æ²¿ã€ãŠåæ
ãããããã¯ãã€ã³ã¯çŽ°æµè·¯ïŒã«æŒãŠãã€ã³ã¯å
åºå§çºççŽ åïŒãšã€ã³ã¯ååºå£ïŒãšã®ééãæé©
åããçºã«è¡ããã®ã§ãããããã§åæããé å
ã¯é©å®ã決å®ãããããã®åæã«éããŠã¯ãåå°
äœå·¥æ¥ã§éåžžãæ¡çšãããŠãããã€ã·ã³ã°æ³ãæ¡
çšãããã
第ïŒå³âïœã¯ç¬¬ïŒå³âïœã®ïŒ¡âAâ²ç·åæé¢å³
ã§ããããããŠãåæé¢ãç 磚ããŠå¹³æ»åãã貫
éåïŒïŒã«ã€ã³ã¯äŸçµŠç®¡ïŒïŒãåãä»ããŠã€ã³ã¯
ãžãšããèšé²ããããå®æãããïŒç¬¬ïŒå³âïœïŒ
以äžãå³é¢ã«åºã¥ããŠèª¬æããå®æœäŸã«æŒãŠ
ã¯ãæºäœæçšã®æå
æ§çµæç©ïŒããªãã¬ãžã¹ãïŒ
ãšããŠãã©ã€ãã€ã«ã ã¿ã€ããã€ãŸãåºäœã®ãã®
ãå©çšããããæ¬çºæã§ã¯ãããã®ã¿ã«éããã®
ã§ã¯ãªãã液ç¶ã®æå
æ§çµæç©ãå¿è«ãå©çšãã
ããšãã§ãããåºæ¿äžãžã®ãã®æå
æ§çµæç©å¡è
ã®åœ¢ææ¹æ³ãšããŠã液äœã®å Žåã«ã¯ã¬ãªãŒãç»å
ã®è£œäœæã«çšããããã¹ããŒãžã«ããæ¹æ³ãããª
ãã¡ææã®æå
æ§çµæç©èåã«å¿ããé«ãã®å£ã
åºæ¿ã®åšå²ã«ãããã¹ããŒãžã«ãã€ãŠäœåã®çµæ
ç©ãé€å»ããæ¹æ³ã§ããããã®å Žåæå
æ§çµæç©
ã®ç²åºŠã¯100cpã300cpãé©åœã§ããããŸããåº
æ¿ã®åšå²ã«ããå£ã®é«ãã¯æå
æ§çµæç©ã®æº¶å€å
ã®èžçºã®æžéãèŠèŸŒãã§æ±ºå®ããå¿
èŠãããã
ä»æ¹ãåºäœã®å Žåã¯ãæå
æ§çµæç©ã·ãŒããåº
æ¿äžã«å ç±å§çããŠè²Œçãããå°ãæ¬çºæã«æŒãŠ
ã¯ããã®åæ±ãäžãåã³åãã®å¶åŸ¡ã容æäžã€ç²Ÿ
確ã«ã§ããç¹ã§ãåºäœã®ãã€ã«ã ã¿ã€ãã®ãã®ã
å©çšããæ¹ãæå©ã§ã¯ããã
ãã®ãããªåºäœã®ãã®ãšããŠã¯ãäŸãã°ãããŠ
ãã³ç€ŸããŒããã³ãããªãããªããŒã³ãŒãã€ã³ã°
RISTONïŒãœã«ããŒãã¹ã¯ïŒ730Sãå740Sãå
730FRãå740FRãåSM1çã®åååã§åžè²©ãã
ãŠããæå
æ§æš¹èãããããã®ä»ãæ¬çºæã«ãã
ãŠäœ¿çšãããæå
æ§çµæç©ãšããŠã¯ãæå
æ§æš¹
èãããªãã¬ãžã¹ãçã®éåžžã®ããªããªãœã°ã©ã
ã€ãŒã®åéã«ãããŠäœ¿çšãããŠããæå
æ§çµæç©
ã®å€ãã®ãã®ãæãããããããçã®æå
æ§çµæ
ç©ãšããŠã¯ãäŸãã°ããžã¢ãŸã¬ãžã³ãâãžã¢ãŸ
ããã³ãæŽã«ã¯äŸãã°ããã«ã¢ãããŒãšéåéçº
å€ã䜿çšããå
éååããªãããªããŒãããªãã
ã«ã·ã³ãã¡ãŒãçãšå¢æå€ã䜿çšããäºéååã
ãªãããªããŒããªã«ãœãããããã³ãžã¢ãžããšã
ãã©ãã¯ã¿ã€ãã®ããšããŒã«æš¹èãšã®æ··åç©ãã
ãªããã«ã¢ã«ã³ãŒã«ãšãžã¢ãŸæš¹èã®æ··åç©ãïŒâ
ã°ãªã·ãžã«ãšãã¬ã³ãªãã·ããšãã³ãŸããšãã³ã
ã°ãªã·ãžã«ã«ã«ã³ã³ãšãå
±éåãããããªãšãŒã
ã«åããªãããªããŒãïŒïŒ®âãžã¡ãã«ã¡ã¿ã¯ãª
ã«ã¢ãããšäŸãã°ã¢ã¯ãªã«ã¢ãããã³ãŸããšãã³
ãšã®å
±éåäœãäžé£œåããªãšã¹ãšã«ç³»æå
æ§æš¹è
ãäŸãã°APRïŒæåæïŒãããã¹ã¿ïŒåžäººïŒããŸã³
ãïŒé¢è¥¿ãã€ã³ãïŒçããäžé£œé£œãŠã¬ã¿ã³ãªãªãŽ
ããŒç³»æå
æ§æš¹èãäºå®èœã¢ã¯ãªã«ã¢ãããŒã«å
éåéå§å€ãšããªããŒãšãæ··åããæå
æ§çµæ
ç©ãéã¯ãã é
žç³»ããªãã¬ãžã¹ããéã¯ãã 系氎
溶æ§ããªãã¬ãžã¹ããããªã±ã€ç®é
žããã«ç³»ããª
ãã¬ãžã¹ããç°åãŽã âã¢ãžãç³»ããªãã¬ãžã¹
ããçãæããããã
以äžè©³ãã説æããæ¬çºæã®å¹æãšããŠã¯ã次
ã®ãããªããšããããããã
ïŒ åºæ¿ãšæå
æ§æš¹èã®æ¥çãå¢ããããšã«ã
ããç¹ã«è¡æã®ãããã€ã³ã¯ååºå£åœ¢æã®åæ
ã«ãã€ãŠãåºæ¿ããã®æå
æ§æš¹èã®å¥ãããªã
ãªã€ãã
ïŒ æ¥çéšã®è溶å€æ§ãåäžãããšãã¬ã³ã°ãªã³
ãŒã«çã®æº¶å€ãå«ãã€ã³ã¯ã®äœ¿çšã«ãã€ãŠãåº
æ¿ãšæå
æ§æš¹è硬åèã®éè·¯å£ãå¥é¢ããããš
ããªããªã€ãã
ïŒ ã€ã³ã¯ååºå£ã®åœ¢ç¶å®å®æ§ãé«ããããçµæ
çãªã€ã³ã¯ç匟ç¹ç²ŸåºŠãé«ãã
ãããæ¬çºæã®å¹æã¯ã以äžã«ç€ºãå®æœäŸã«ã
ããããå
·äœçã«èª¬æãããã
å®æœäŸïŒãïŒåã³æ¯èŒäŸïŒãïŒ
åäŸéã§ã€ã³ã¯ååºå£ã圢æããã端é¢ã«èšã
éšåã®ä¿è·å±€ã®äžã«ç¡æ©é
žåç©åã¯ç¡æ©çªåç©ã®
å±€ãèšãåã¯èšããªãã€ãããšäžŠã³ã«ãã®å±€ã(a)
γâã¢ãããããã«ãšããã·ã·ã©ã³åã¯(b)ããã©
ã¹ãã¢ãªã«ãã¿ããŒãã§åŠçãå®æœãåã¯å®æœã
ãªãã€ãããšãé€ããŠã¯ãå
ã«ç€ºããå®æœäŸã®å·¥
çšïŒç¬¬ïŒå³ä¹è³ç¬¬ïŒå³ïŒã«åŸã€ãŠã€ã³ã¯ååºå£ã
10åæããã€ã³ã¯ãžãšããèšé²ããããå€æ°è©Šäœ
ããããããè©Šäœãããã®ãã¡ãåºæ¿ãšæå
æ§æš¹
èã®å¥é¢ã®ãªãæ£åžžãªãã®ã«ã€ããŠãæ°Ž20ïŒ
åã³
ãšãã¬ã³ã°ãªã³ãŒã«80ïŒ
ã®çµæã®80âã®æº¶æ¶²ã«
1000æéã®æµžæŒ¬è©Šéšãè¡ã€ãããããã®çµæãè¡š
ïŒã«ç€ºãã
ãŸããå®æœäŸïŒåã³æ¯èŒäŸïŒã§åŸãã€ã³ã¯ãžãš
ããèšé²ãããã«å¯ŸããŠã108ãã«ã¹ã®èä¹
å°å
è©Šéšãè¡ã€ããšãããå®æœäŸã®ãããã§ã¯ç匟ç¹
粟床ã±12ÎŒïœïŒïŒmmé£ç¿è·é¢ã§ãã€ãã®ã«å¯Ÿã
æ¯èŒäŸã®ãããã§ã¯Â±60ÎŒïœïŒïŒmmé£ç¿è·é¢ã§ã
ã€ãã
ãªããæå
æ§æš¹èã¯å
šãŠRISTON730Sãã©ã€
ãã€ã«ã ããªãã¬ãžã¹ãïŒããŠãã³ç€Ÿè£œãåå
åïŒã䜿çšããã[Table] In the step shown in FIG. 3, the surface of the substrate 1 obtained through the step shown in FIG. Dry film photoresist 5 (film thickness, approx.
25ÎŒm~100ÎŒm) at a speed of 0.5~4f/min, 1~3
Laminate under pressure conditions of Kg/ cm2 . At this time, the dry film photoresist 5 exhibits self-adhesive properties and is fused and fixed to the surface of the substrate 1, and will not peel off from the substrate 1 even if considerable external pressure is applied thereafter. In particular, in this example, an inorganic oxide or inorganic nitride is provided on the substrate using the same semiconductor manufacturing process as that used to form heating elements, electrodes, etc. It has strong adhesion to the substrate side, and also has good bonding with the adhesion improver at the molecular level (bonding due to chemical bonding force), resulting in strong adhesion to the dry film photoresist 5. It will be held on. Subsequently, as shown in FIG. 4, a photomask 6 having a predetermined pattern is superimposed on the dry film photoresist 5 provided on the substrate surface, and then the photomask 6 is exposed to light from above. At this time, it is necessary to align the installation position of the ink ejection pressure generating element 2 and the pattern using a known method. FIG. 5 is an explanatory diagram showing a process in which the unexposed portions of the exposed dry film photoresist 5 are dissolved and removed using a developer made of a predetermined organic solvent. Next, in order to improve the ink resistance of the exposed portion 5p of the dry film photoresist left on the substrate 1, heat curing treatment (for example, at 150°C to 250°C) is performed.
heating for 30 minutes to 6 hours) or ultraviolet irradiation (e.g.
(with UV intensity of 50-200mW/ cm2 or higher)
to sufficiently advance the polymerization and curing reaction. It is also effective to use both the above-mentioned heat curing and ultraviolet curing. FIG. 6 shows the cured dry film resist 5p that has been sufficiently polymerized as described above, and a flat plate 8 serving as a cover is fixed to the substrate 1 in which grooves 9 serving as ink passages are formed, either by gluing or simply crimping the resist 5p. FIG. In the process shown in Figure 6, the specific method for attaching the cover is as follows: (1) Apply epoxy adhesive to a thickness of 3 to 4 ÎŒm on a flat plate 8 made of glass, ceramics, metal, plastic, etc.
After applying spinner coating to the photoresist film 5p, the adhesive is preheated to bring it to the so-called B stage, and this is bonded onto the cured photoresist film 5p to fully cure the adhesive. Alternatively, (2) there is a method of directly heat-sealing a flat plate 8 of thermoplastic resin such as acrylic resin, ABS resin, polyethylene, etc. onto the hardened photoresist film 5p. Here, the appearance of the head after the process shown in FIG. 6 is completed is shown in a schematic perspective view in FIG. 7-a. Figure 7-a
Inside, 9-1 is an ink supply chamber, 9 is an ink narrow flow path,
Reference numeral 10 indicates a through hole for connecting an ink supply pipe (not shown) to the ink supply chamber 9-1. After the substrate in which the grooves have been formed and the flat plate are bonded together in this way, the substrate is cut along line CC' in FIG. This is done to optimize the distance between the ink ejection pressure generating element 2 and the ink ejection opening 7 in the ink narrow flow path 9, and the area to be cut here is determined as appropriate. For this cutting, a dicing method commonly used in the semiconductor industry is used. FIG. 7-b is a cross-sectional view taken along line A-A' in FIG. 7-a. Then, the cut surface is polished to make it smooth, and the ink supply tube 11 is attached to the through hole 10 to complete the inkjet recording head. (Fig. 7-c) In the embodiments described above based on the drawings, the photosensitive composition (photoresist) for creating grooves is
Although a dry film type, that is, a solid composition was used as the composition, the present invention is not limited to this, and of course, a liquid photosensitive composition can also be used. In the case of a liquid, the photosensitive composition coating film is formed on the substrate by using a squeegee, which is used when producing a relief image. In this method, excess composition is removed using a squeegee. In this case, the appropriate viscosity of the photosensitive composition is 100 cp to 300 cp. Further, the height of the wall around the substrate must be determined in consideration of the reduction in evaporation of the solvent component of the photosensitive composition. On the other hand, in the case of a solid, the photosensitive composition sheet is attached to the substrate by heat-pressing. In the present invention, it is advantageous to use a solid film type material in terms of its handling and the fact that the thickness can be easily and precisely controlled. Such solid materials include, for example, DuPont's permanent photopolymer coatings.
RISTON (solder mask) 730S, 740S, RISTON
There are photosensitive resins commercially available under trade names such as 730FR, 740FR, and SM1. In addition, the photosensitive composition used in the present invention includes many photosensitive compositions used in the field of ordinary photolithography, such as photosensitive resins and photoresists. These photosensitive compositions include, for example, diazoresin, P-diazoquinone, photopolymerizable photopolymers using a vinyl monomer and a polymerization developer, and dimerized photopolymers using polyvinyl cinnamate and a sensitizer. Photopolymer, mixture of orthonaphthoquinone diazide and novolac type phenolic resin, mixture of polyvinyl alcohol and diazo resin, 4-
Polyether-type photopolymers made by copolymerizing glycidyl ethylene oxide with benzophenone or glycidyl chalcone, copolymers of N,N-dimethylmethacrylamide with, for example, acrylamide benzophenone, unsaturated polyester-based photosensitive resins [for example, APR (Asahi Kasei Co., Ltd.)] ), Tevista (Teijin), Sonne (Kansai Paint), etc.], unsaturated urethane oligomer-based photosensitive resins, photosensitive compositions in which a difunctional acrylic monomer is mixed with a photopolymerization initiator and a polymer, dichromic acid-based photosensitive resins, etc. resist, non-chromium water-soluble photoresist, polyvinyl cinnamate photoresist, cyclized rubber-azide photoresist, and the like. The effects of the present invention described in detail above include the following. 1. Due to the increased adhesion between the substrate and the photosensitive resin, the photosensitive resin no longer peels off from the substrate even when cutting the ink ejection port formation, which is particularly impactful. 2. The solvent resistance of the bonded portion has been improved, and the passage wall between the substrate and the photosensitive resin cured film no longer peels off even when ink containing a solvent such as ethylene glycol is used. 3. Since the shape stability of the ink ejection port is high, the accuracy of the ink landing point over time is high. These effects of the present invention will be explained more specifically by the examples shown below. Examples 1 to 6 and Comparative Examples 1 to 3 Between each example, an inorganic oxide or inorganic nitride layer was provided or not provided on a portion of the protective layer facing the end face where an ink ejection port is formed, and layer(a)
The inks were prepared according to the steps of the examples set forth above (Figures 1 to 7), with or without treatment with gamma-aminopropylethoxysilane or (b) tetrastearyl titanate. outlet
A number of trial inkjet recording heads with 10 heads were manufactured. Among these prototype heads, normal ones with no peeling between the substrate and the photosensitive resin were soaked in a solution of 20% water and 80% ethylene glycol at 80°C.
A 1000 hour immersion test was conducted. These results are shown in Table 3. Furthermore, when a 10 8 pulse durability printing test was conducted on the inkjet recording heads obtained in Example 1 and Comparative Example 1, the impact point accuracy was ±12 Όm/2 mm flight distance in the example head. In contrast, the flight distance of the comparative head was ±60 Όm/2 mm. The photosensitive resin used was RISTON730S dry film photoresist (manufactured by DuPont, trade name).
第ïŒå³âïœä¹è³ç¬¬ïŒå³âïœã¯æ¬çºæã®ã€ã³ã¯ãž
ãšããèšé²ãããããã®è£œé å·¥çšã«åŸã€ãŠèª¬æã
ãããã®æš¡åŒå³ã§ããã
ïŒïŒåºæ¿ãïŒïŒã€ã³ã¯ååºå§çºççŽ åãïŒïŒç¡
æ©é
žåç©åã³ïŒåã¯ç¡æ©çªåç©å±€ãïŒïŒããªãã¬
ãžã¹ãåãïŒïŒãã©ã€ãã€ã«ã ããªãã¬ãžã¹ãã
ïŒïŒããªããã¹ã¯ãïŒïŒã€ã³ã¯ååºå£ãïŒïŒèŠ
ããïŒïŒã€ã³ã¯çŽ°æµè·¯ãïŒâïŒïŒã€ã³ã¯äŸçµŠå®€ã
ïŒïŒïŒè²«éåãïŒïŒïŒã€ã³ã¯äŸçµŠç®¡ã
FIGS. 1-a to 7-c are schematic diagrams for explaining the inkjet recording head of the present invention according to its manufacturing process. 1: Substrate, 2: Ink discharge pressure generating element, 3: Inorganic oxide and/or inorganic nitride layer, 4: Photoresist image, 5: Dry film photoresist,
6: Photomask, 7: Ink discharge port, 8: Cover, 9: Ink narrow channel, 9-1: Ink supply chamber,
10: Through hole, 11: Ink supply pipe.
Claims (1)
ãŠãã€ã³ã¯ãååºãããååºå£ã«é£éããã€ã³ã¯
éè·¯ãåºæ¿äžã«èšããããŠããã€ã³ã¯ãžãšããèš
é²ãããã«ãããŠã åèšååºå£è¿åã®åèšåºæ¿äžã«ãç¡æ©é žåç©å
ã³ç¡æ©çªåç©ã®å°ãªããšãããããäžæ¹ãããªã
垯ç¶ã®å±€ãšãæ¥çåäžå€å±€ãšãåèšèãšããé ã«
æããŠããããšãç¹åŸŽãšããã€ã³ã¯ãžãšããèšé²
ãããã ïŒ åèšã€ã³ã¯éè·¯ã«å¯Ÿå¿ããŠãåèšååºå£ãã
ã€ã³ã¯ãååºããããã«å©çšããããšãã«ã®ãŒã
çºçãããšãã«ã®ãŒçºççŽ åãèšããããŠããã
ãšãç¹åŸŽãšããç¹èš±è«æ±ã®ç¯å²ç¬¬ïŒé ã«èšèŒã®ã€
ã³ã¯ãžãšããèšé²ãããã ïŒ åèšãšãã«ã®ãŒçºççŽ åã¯ãåèšãšãã«ã®ãŒ
ãšããŠç±ãšãã«ã®ãŒãçºçããçŽ åã§ããç¹èš±è«
æ±ã®ç¯å²ç¬¬ïŒé ã«èšèŒã®ã€ã³ã¯ãžãšããèšé²ãã
ãã ïŒ åèšãšãã«ã®ãŒçºççŽ åã¯ããšãŸçŽ åã§ãã
ç¹èš±è«æ±ã®ç¯å²ç¬¬ïŒé ã«èšèŒã®ã€ã³ã¯ãžãšããèš
é²ãããã[Scope of Claims] 1. An inkjet recording head in which an ink passage communicating with an ejection port through which ink is ejected is provided on a substrate using a film formed using a photosensitive resin, the ejection port comprising: An inkjet recording head characterized in that it has a strip-shaped layer made of at least one of an inorganic oxide and an inorganic nitride, an adhesion improver layer, and the film on the substrate nearby, in this order. . 2. The ink jet according to claim 1, wherein an energy generating element that generates energy used for ejecting ink from the ejection port is provided corresponding to the ink passage. Record head. 3. The inkjet recording head according to claim 2, wherein the energy generating element is an element that generates thermal energy as the energy. 4. The inkjet recording head according to claim 2, wherein the energy generating element is a piezo element.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10944782A JPS58224758A (en) | 1982-06-25 | 1982-06-25 | Ink jet recording head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10944782A JPS58224758A (en) | 1982-06-25 | 1982-06-25 | Ink jet recording head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58224758A JPS58224758A (en) | 1983-12-27 |
JPH0415096B2 true JPH0415096B2 (en) | 1992-03-16 |
Family
ID=14510465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10944782A Granted JPS58224758A (en) | 1982-06-25 | 1982-06-25 | Ink jet recording head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58224758A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH064323B2 (en) * | 1984-05-08 | 1994-01-19 | ãã€ãã³æ ªåŒäŒç€Ÿ | Liquid jet recording head |
JP3115720B2 (en) * | 1992-09-29 | 2000-12-11 | ãã€ãã³æ ªåŒäŒç€Ÿ | INK JET PRINT HEAD, INK JET PRINTING APPARATUS HAVING THE PRINT HEAD, AND METHOD OF MANUFACTURING THE PRINT HEAD |
JP4669138B2 (en) * | 2001-02-22 | 2011-04-13 | ãã€ãã³æ ªåŒäŒç€Ÿ | Method for manufacturing ink jet recording head |
-
1982
- 1982-06-25 JP JP10944782A patent/JPS58224758A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58224758A (en) | 1983-12-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4509063A (en) | Ink jet recording head with delaminating feature | |
US4437100A (en) | Ink-jet head and method for production thereof | |
JPH0558898B2 (en) | ||
JPS58220756A (en) | Manufacture of ink jet recording head | |
JP5043548B2 (en) | Method for manufacturing ink jet recording head | |
JPH08290572A (en) | Liquid jet recording head | |
JPH0435345B2 (en) | ||
JPS58224760A (en) | Ink jet recording head | |
JPS61135756A (en) | Preparation of orifice plate | |
JPH0415096B2 (en) | ||
JPS6030355A (en) | Manufacture of inkjet recording head | |
WO2009128105A1 (en) | Ink-jet print head having improved adhesion with time, its process of manufacturing and its use in combination with a water-based ink containing acidic species | |
JPS60190363A (en) | Manufacture of inkjet recording head | |
JP3120341B2 (en) | Method of manufacturing inkjet head | |
JPH0415101B2 (en) | ||
JPH081950A (en) | Manufacture of ink jet head | |
JPS58224757A (en) | Preparation of ink jet recording head | |
JPS591269A (en) | Manufacture of ink jet recording head | |
JPH0415100B2 (en) | ||
JPH05212870A (en) | Production of ink jet recording head | |
JPH0225335B2 (en) | ||
JPH0242669B2 (en) | ||
JPS58224761A (en) | Ink jet recording head | |
JPH0712662B2 (en) | Method for manufacturing ink jet recording head | |
JPS58224759A (en) | Ink jet recording head |