GB2099221B - Light emitting diode array devices and image transfer systems - Google Patents

Light emitting diode array devices and image transfer systems

Info

Publication number
GB2099221B
GB2099221B GB8215388A GB8215388A GB2099221B GB 2099221 B GB2099221 B GB 2099221B GB 8215388 A GB8215388 A GB 8215388A GB 8215388 A GB8215388 A GB 8215388A GB 2099221 B GB2099221 B GB 2099221B
Authority
GB
United Kingdom
Prior art keywords
light emitting
diodes
image transfer
transfer systems
diode array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8215388A
Other versions
GB2099221A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB8215388A priority Critical patent/GB2099221B/en
Publication of GB2099221A publication Critical patent/GB2099221A/en
Application granted granted Critical
Publication of GB2099221B publication Critical patent/GB2099221B/en
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024—Details of scanning heads ; Means for illuminating the original
    • H04N1/032—Details of scanning heads ; Means for illuminating the original for picture information reproduction
    • H04N1/036—Details of scanning heads ; Means for illuminating the original for picture information reproduction for optical reproduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Led Device Packages (AREA)
  • Dot-Matrix Printers And Others (AREA)

Abstract

A light emitting device comprises a substrate (12); a first chip (14) incorporating a high density of light-emitting diodes (16), e.g. at up to 1000/inch, arranged in a substantially linear array and with electrical contacts (18), preferably extending alternately to opposite sides of the row; and one or a pair of IC chips (24) incorporating RAM and drivers for the diodes. The IC chips (24) are positioned alongside the LED chip (14) and interconnections are made by very fine wires (28) ultrasonically bonded to the contacts (22,26). The hybrid circuit modules (10, 10a) can be assembled side by side to give an extended diode array. The device (10) is utilised in image transfer systems where the diodes output to fibre optic filaments, micro-lenses or the like closely spaced above the diode chip (14) and having their output at or adjacent to a photosensitive medium. The system is particularly useful for high-speed, high- resolution phototypesetting. <IMAGE>
GB8215388A 1981-05-26 1982-05-26 Light emitting diode array devices and image transfer systems Expired GB2099221B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8215388A GB2099221B (en) 1981-05-26 1982-05-26 Light emitting diode array devices and image transfer systems

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8116063 1981-05-26
GB8215388A GB2099221B (en) 1981-05-26 1982-05-26 Light emitting diode array devices and image transfer systems

Publications (2)

Publication Number Publication Date
GB2099221A GB2099221A (en) 1982-12-01
GB2099221B true GB2099221B (en) 1985-11-20

Family

ID=26279599

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8215388A Expired GB2099221B (en) 1981-05-26 1982-05-26 Light emitting diode array devices and image transfer systems

Country Status (1)

Country Link
GB (1) GB2099221B (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3368839D1 (en) * 1983-01-21 1987-02-05 Agfa Gevaert Nv Recording apparatus
JPS59230112A (en) * 1983-06-13 1984-12-24 Hitachi Ltd On-vehicle electronic display type instrument board
DE3376727D1 (en) * 1983-11-01 1988-06-23 Agfa Gevaert Nv Recording apparatus
EP0142579B1 (en) * 1983-11-01 1988-05-18 Agfa-Gevaert N.V. Recording apparatus
JPH0736449B2 (en) * 1984-11-02 1995-04-19 ゼロツクス コーポレーシヨン Manufacturing method of light emitting diode printed array
US4780730A (en) * 1986-04-11 1988-10-25 Itek Graphix Corp. Led-array image printer
US4929965A (en) * 1987-09-02 1990-05-29 Alps Electric Co. Optical writing head
US4837589A (en) * 1987-10-23 1989-06-06 Itek Graphix Corp. Non-contact led-array image printer
DE3808219A1 (en) * 1988-03-11 1989-09-21 Siemens Ag OPTICAL CHARACTER GENERATOR FOR AN ELECTROPHOTOGRAPHIC PRINTER
DE3808636A1 (en) * 1988-03-15 1989-09-28 Siemens Ag CHARACTER GENERATOR FOR A NON-MECHANICAL PRINTER
EP0335553B1 (en) * 1988-03-18 1999-09-15 Nippon Sheet Glass Co., Ltd. Self-scanning light-emitting element array
US4916530A (en) * 1988-09-02 1990-04-10 Itek Graphix Corp. High resolution halftone dot generator system including LED array
US5014074A (en) * 1988-10-11 1991-05-07 Hewlett-Packard Company Light emitting diode print head assembly
US4942405A (en) * 1988-10-11 1990-07-17 Hewlett-Packard Company Light emitting diode print head assembly
GB2225869A (en) * 1988-10-25 1990-06-13 Plessey Co Plc A print head
US5307089A (en) * 1989-08-07 1994-04-26 Sanyo Electric Co., Ltd. Optical printing head
US5317344A (en) * 1989-12-22 1994-05-31 Eastman Kodak Company Light emitting diode printhead having improved signal distribution apparatus
US7292209B2 (en) 2000-08-07 2007-11-06 Rastar Corporation System and method of driving an array of optical elements

Also Published As

Publication number Publication date
GB2099221A (en) 1982-12-01

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee